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大基金三期出手!4.5亿元投向三维集成设备领域
Zheng Quan Shi Bao Wang· 2025-09-15 00:17
Core Viewpoint -拓荆科技 announced a series of financing plans, including a capital increase to its subsidiary拓荆键科, aiming to raise up to 4.6 billion yuan to support the rapid development of three-dimensional integration equipment [1][4] Group 1: Financing Details - The financing plan includes a total of no more than 10.4 billion yuan for拓荆键科, with a pre-investment valuation of 2.5 billion yuan [1] - 大基金三期 plans to participate in the capital increase with no more than 450 million yuan, marking its first public investment since its establishment in May 2024 [1][2] - 国投集新 also intends to invest up to 450 million yuan, resulting in a 12.71% stake in拓荆键科 after the capital increase [1][2] Group 2: Company Overview - 拓荆键科, established in September 2020, focuses on the research and industrial application of advanced bonding equipment for three-dimensional integration [2] - The company has launched various products, including wafer-to-wafer bonding equipment and measurement devices, serving clients in advanced storage, logic, and image sensor sectors [2] Group 3: Market Context - Three-dimensional integration aims to overcome the physical limitations of traditional two-dimensional integration by stacking chips vertically, enhancing packaging efficiency and transistor density [3] - The technology is essential for maintaining the momentum of Moore's Law and addressing increasing market demands [3] Group 4: Financial Performance - In 2024, 拓荆键科 reported revenues of 97.3 million yuan and a net loss of 2.1 million yuan [4] - The company has experienced rapid revenue growth, with revenues of 1.706 billion yuan, 2.705 billion yuan, and 4.103 billion yuan in 2022, 2023, and 2024, respectively, reflecting a compound annual growth rate of 55.08% [4] Group 5: Project Implementation - The implementation of the projects will significantly enhance the production capacity of high-end semiconductor equipment and improve production efficiency through intelligent facilities [5] - The company plans to allocate 20 billion yuan for the construction of a cutting-edge technology research and development center, focusing on advanced thin film deposition equipment [6]
拓荆科技,拟定增募资不超46亿元
Zhong Guo Zheng Quan Bao· 2025-09-13 05:03
Core Viewpoint - Company plans to raise up to 4.6 billion yuan through a private placement of A-shares to fund high-end semiconductor equipment industrialization, advanced technology research center, and working capital [1][2][3] Fundraising Details - The total amount to be raised is capped at 4.6 billion yuan, with a maximum issuance of 83.92 million shares, not exceeding 30% of the company's total share capital prior to the issuance [2] - The net proceeds after deducting issuance costs will be allocated to high-end semiconductor equipment industrialization, advanced technology research, and working capital [2] Project Investments - The high-end semiconductor equipment industrialization project will focus on expanding thin film deposition equipment production, with an investment of 1.768 billion yuan over a 5-year construction period [2][3] - The advanced technology research center will receive an investment of 2 billion yuan to develop various advanced thin film deposition equipment and enhance core technologies [3] Strategic Objectives - The fundraising aims to significantly increase production capacity for high-end semiconductor equipment, enhance innovation capabilities, and strengthen product advantages [3] - The company seeks to leverage capital market advantages to improve financial strength, optimize asset-liability structure, and enhance core competitiveness and profitability [3] Financial Performance - In the first half of 2025, the company reported revenue of 1.954 billion yuan, a year-on-year increase of 54.25%, while net profit attributable to shareholders decreased by 26.96% to 94.288 million yuan [4] - The decline in net profit was attributed to high costs and low gross margins during the first quarter, but improvements in gross margin were observed in the second quarter as operational efficiency increased [4]
拓荆科技拟定增募资不超过46亿元,投资加码高端半导体设备业务
Ju Chao Zi Xun· 2025-09-13 02:33
Core Viewpoint - The company plans to raise up to 4.6 billion yuan through a private placement to invest in high-end semiconductor equipment industrialization and advanced technology R&D projects, as well as to supplement working capital [1][2]. Group 1: Investment and Project Details - The company intends to invest 1.5 billion yuan in the high-end semiconductor equipment industrialization base, which is part of a project initially funded with 268 million yuan from its IPO [1]. - The new industrialization base will be located in Shenyang, Liaoning Province, and will include clean rooms, automated warehouses, and testing laboratories, incorporating advanced production technologies to create a scalable, intelligent, and digitalized facility [1][2]. Group 2: Business Growth and Market Demand - The company has experienced rapid growth in business scale due to strong downstream market demand, with revenue figures of 1.706 billion yuan in 2022, 2.705 billion yuan in 2023, and a projected 4.103 billion yuan in 2024, resulting in a compound annual growth rate of 55.08% [2]. - The current production capacity is expected to be insufficient to meet future customer orders, prompting the need for increased capacity through the new projects [2]. Group 3: Technological Advancements and Industry Impact - The project will focus on hardware innovation, control systems, software development, and high-performance film process development to enhance the R&D and optimization of new high-end film deposition equipment [3]. - This initiative aims to support the overall domestic transformation of the semiconductor industry chain and improve the security and autonomy of the domestic semiconductor supply chain [3].
拓荆科技定增募资不超46亿元 拟投建高端半导体设备产业化基地等项目
Zheng Quan Shi Bao Wang· 2025-09-12 12:54
9月12日晚间拓荆科技(688072)公告,公司拟定增募资不超过46亿元,扣除发行费用后的募集资金净额 拟投入高端半导体设备产业化基地建设项目、前沿技术研发中心建设项目并补充流动资金。其中,高端 半导体设备产业化基地建设项目系公司使用首次公开发行募集资金2.68亿元投资的项目,公司拟使用本 次募集资金15亿元对其进行追加投资。 据披露,高端半导体设备产业化基地建设项目拟在辽宁省沈阳市浑南区新建产业化基地,包括生产洁净 间、立体库房、测试实验室等,并引入先进的生产配套软硬件,打造规模化、智能化、数字化的高端半 导体设备产业化基地。 本次定增中,拓荆科技还拟使用募集资金11亿元用于公司及全资子公司补充流动资金。 拓荆科技表示,公司所处行业为资本密集型行业,需要在生产、研发及日常运营活动中进行大量而持续 的资金投入。近年来,公司业务规模逐渐扩大,产品市场需求及订单保持良好增长态势,最近三年营业 收入复合增长率达到55.08%。 与此同时,公司在原材料采购、人员薪酬、研发支出等资金支出项目及存货、应收账款等经营性项目的 资金占用项目亦随着收入快速增长而相应增加,仅依靠公司内部积累已经较难满足业务快速发展对资金 的需求 ...