Core Viewpoint - The article highlights the significant advancements made by domestic semiconductor equipment manufacturers, particularly in the field of thin film deposition equipment, which has reached international leading levels, while acknowledging the existing gap in lithography technology compared to global leaders like ASML [1][4]. Group 1: Breakthrough Direction and Market Dynamics - In 2010, the domestic semiconductor equipment market was dominated by international giants, with over 90% market share, prompting companies like拓荆科技 to focus on PECVD equipment as a breakthrough point due to its large market scale [3][4]. - The push for domestic substitution policies has led to unprecedented support for local semiconductor equipment suppliers, with expectations for domestic wafer production capacity to double by 2027 [4][5]. - The ongoing geopolitical tensions have accelerated the push for domestic semiconductor equipment localization, benefiting the equipment sector in the medium to long term [5][6]. Group 2: Technological Advancements and Milestones - In 2011,拓荆科技 produced its first 12-inch PECVD equipment, marking a significant milestone in China's semiconductor equipment development [6][8]. - By 2015, the PF-300T PECVD equipment had achieved over 10,000 wafers processed at中芯国际, validating the reliability of domestic equipment for large-scale production [8][9]. - The company has successfully developed a comprehensive technology system covering PECVD, ALD, and SACVD, with a strong focus on R&D, resulting in over 1,200 patents filed [12][13]. Group 3: Industry Ecosystem and Collaboration - The collaboration between various entities, including national research institutions and leading semiconductor manufacturers, has been crucial for the success of domestic equipment suppliers like拓荆科技 [27][28]. - The domestic semiconductor equipment industry has seen a significant increase in localization rates, projected to reach 50% by 2025-2026, compared to less than 5% in 2010 [28][29]. - The competitive landscape among domestic manufacturers is robust, with companies like北方华创 and中微公司 also making strides in different technology routes [29][30]. Group 4: Market Trends and Future Outlook - The global semiconductor equipment market is expected to grow significantly, with the thin film deposition equipment market projected to reach $34 billion by 2025, driven by advancements in storage chips and packaging technologies [30][31]. - The rise of three-dimensional integration technologies is anticipated to create new revenue streams for companies like拓荆科技, with a projected market size of nearly 30 billion yuan in the next five years [31].

Core Viewpoint -拓荆科技 is a leading enterprise in the domestic semiconductor thin film deposition equipment and hybrid bonding equipment market, focusing on advanced technologies and products to meet the growing demands of the semiconductor industry driven by AI and emerging sectors [1][2][3] Financial Performance - In Q1 2025, the company reported revenue of 709 million yuan, a year-on-year increase of 50.22%, but a net loss of 147 million yuan, with a basic earnings per share of -0.53 yuan [1] - The decline in gross margin is attributed to the high cost of new products and processes, which accounted for nearly 70% of the revenue during the quarter [2] Product Development and Market Position - The company is focusing on thin film deposition equipment and advanced bonding equipment for 3D integration, continuously expanding its product offerings to meet industry trends and customer demands [3][4] - The company has successfully developed and delivered several new products, including low dielectric constant SiCO film process equipment and Thermal-ALD devices, which have passed customer verification and are now in industrial application [4] Industry Outlook - The semiconductor industry is expected to grow significantly, with global sales projected to increase by 19% to reach 628 billion USD in 2024, and continue to maintain double-digit growth in 2025, potentially exceeding 1 trillion USD by 2030 [2] - The demand for semiconductor equipment is rising due to advancements in AI applications and the increasing performance requirements for semiconductor devices [3] Strategic Initiatives - The company is committed to deepening its core business and advancing technology products in cutting-edge fields, with plans for new R&D and industrialization bases to support future growth [4][5]

事件: 拓荆科技4 月30 日公告2025 年一季报：2025Q1 实现收入7.09 亿元，同比增长50.22%；实现归母净利 润-1.47 亿元，上年同期为0.10 亿元；实现扣非归母净利润-1.80 亿元，上年同期为-0.44 亿元。 2024 年公司期间费用率为32.19%，同比减少2.15pct，其中销售费用为2.90 亿元，同比增长64.40%；管 理费用为2.10 亿元，同比增长11.25%；研发费用为7.56 亿元，同比增长31.26%；财务费用为0.65 亿 元，上年同期为-0.12 亿元。 薄膜沉积设备品类持续丰富，混合键合设备加速发展。1）产品进展方面，PECVD 系列产品是公司核 心产品，持续保持竞争优势；ALDSiCO、SiN、AlN 等工艺设备获得重复订单并已实现出货，持续扩大 量产规模；HDPCVD 系列产品自通过客户端验证后，逐步放量；SACVD 系列产品持续拓展应用领域， 量产规模不断扩大；FlowableCVD 系列产品取得突破性进展，2024 年实现首台产业化应用且复购设备 再次通过验证；晶圆对晶圆混合键合设备、芯片对晶圆键合前表面预处理设备获得重复订单并扩大产业 化应用， ...

Core Viewpoint -拓荆科技 reported strong financial performance in Q1 2025, with significant revenue growth and positive cash flow, indicating robust business development and market competitiveness [1][2] Financial Performance - The company achieved operating revenue of 709 million yuan, a year-on-year increase of 50.22% [1] - The net cash flow from operating activities turned positive, increasing by 732 million yuan year-on-year [1] - The amount of orders on hand at the end of the reporting period grew compared to the end of 2024, along with significant increases in advance payments and sales collections [1] R&D Investment - In Q1 2025, the company invested 159 million yuan in R&D, accounting for 22.38% of its operating revenue [1] - From 2022 to 2024, total R&D investment reached 1.711 billion yuan, representing 20.09% of total operating revenue during the same period [1] Product Development and Market Position - The company focuses on high-end semiconductor equipment, including PECVD, ALD, SACVD, HDPCVD, and Flowable CVD products, as well as advanced bonding and detection equipment for 3D integration [1][2] - The company has maintained a compound annual growth rate (CAGR) of 74.83% in operating revenue from 2019 to 2024, showcasing strong market competitiveness [1] - The company has achieved breakthroughs in new products and processes, with successful batch validation of new products and expanded process coverage [2] - In the field of thin film deposition equipment, the company is advancing high-capacity and high-performance equipment for advanced storage and logic chips, entering large-scale production [2] - The company is actively promoting new generation advanced bonding products and detection equipment for the 3D integration field, aiming to provide comprehensive technical solutions [2]

Core Viewpoint - The company reported a significant increase in revenue for Q1 2025, driven by rising demand for domestic semiconductor equipment and successful new product validations, despite a net loss. Group 1: Financial Performance - In Q1 2025, the company achieved revenue of 709 million yuan, a year-on-year increase of 50.22% [1] - The net profit for the same period was -147 million yuan, with a basic earnings per share of -0.53 yuan [1] - The compound annual growth rate (CAGR) of revenue from 2019 to 2024 reached 74.83% [1] Group 2: Product Development and Market Position - The company focuses on semiconductor thin film deposition equipment and has established two product series: thin film deposition equipment and hybrid bonding equipment [1] - New products and processes accounted for nearly 70% of sales revenue during the reporting period, although gross margins declined due to high customer validation costs [2] - The company emphasizes independent innovation and has maintained high R&D investment, with R&D expenses of 159 million yuan in Q1 2025, representing 22.38% of revenue [2] Group 3: Operational Efficiency - The company reported a significant increase in net cash flow from operating activities, turning positive with an increase of 732 million yuan year-on-year [3] - The volume of goods shipped increased by 94% compared to the previous year, contributing to improved cash flow [2][3] - The company has seen a substantial increase in both advance payments and sales collections compared to the same period last year [3]

多种薄膜新工艺设备实现批量出货，关键材料持续突破。 公司拓展了芯片沟槽填充用Flowable CVD设 备，多台通过客户验证；基于新平台、新反应腔的PECVD Stack（ONO叠层）、ACHM等先进工艺设备 实现了大批量出货，通过客户验证；ALD SiCO、SiN、AlN等工艺设备实现大批量出货。目前公司推出 的PECVD、ALD、SACVD、HDPCVD及Flowable CVD薄膜设备可以支撑全部介质薄膜材料的约100多 种工艺应用。 点击招商研究小程序查看PDF报告原文 拓荆科技发布2024年报，24Q4利润快速释放，在手订单同比高增长。公司多种薄膜新工艺设备实现批 量出货，3D IC领域混合键合设备获得重复订单。 24Q4利润快速释放，在手订单同比高增长。 1）2024全年： 公司收入41亿元，同比+51.7%；归母净利 润6.88亿元，同比+3.86%；扣非净利润3.56亿元，同比+14.1%；截至2024年底，公司在手订单约94亿 元，同比+46.3%； 2）24Q4： 公司收入18.26亿元，同比+82%/环比+81%；毛利率39.3%，同 比-12.8pcts/环比持平，同比承压主要系新品或 ...

Investment Rating - The investment rating for the company is "Recommended" [1] Core Views - The company achieved a revenue of 4.103 billion yuan in 2024, representing a year-on-year growth of 51.70%, and a net profit of 688 million yuan, with a year-on-year increase of 3.86% [4][8] - The company plans to distribute a cash dividend of 2.70 yuan per 10 shares to all shareholders [4] - The company has a strong order backlog of approximately 9.4 billion yuan at the end of 2024, which is a 46.35% increase compared to the end of 2023 [8] Financial Performance Summary - Revenue for 2024 is projected at 4.103 billion yuan, with a growth rate of 51.7% [6][11] - Net profit for 2024 is expected to be 688 million yuan, with a growth rate of 3.9% [6][11] - Gross margin for 2024 is reported at 41.69%, a decrease of 9.32 percentage points year-on-year [8] - The company’s thin film deposition equipment revenue reached 3.863 billion yuan, growing by 50.29% [8] - The advanced bonding equipment revenue in the 3D integration field was approximately 95.67 million yuan, with a year-on-year growth of 48.78% [9] Future Projections - The company’s net profit is projected to reach 1.075 billion yuan in 2025, 1.368 billion yuan in 2026, and 1.728 billion yuan in 2027 [9][10] - The expected P/E ratios for 2025, 2026, and 2027 are 41.8X, 32.9X, and 26.0X respectively [9][11] Market Position and Competitive Advantage - The company has a comprehensive layout in CVD thin film deposition equipment, with strong competitiveness and significant positioning advantages [9] - The advanced bonding equipment in the 3D integration field is expected to become a key growth point for the company [9]

Investment Rating - The report maintains an "Accumulate" investment rating for the company [1][3]. Core Insights - The company has experienced significant growth in its order backlog, with a year-on-year increase of 46.3%, amounting to approximately 9.4 billion yuan by the end of 2024 [7]. - The company reported a rapid profit release in Q4 2024, with revenue reaching 1.826 billion yuan, representing an 82% year-on-year increase [7]. - The company has successfully launched multiple new film process equipment, achieving bulk shipments and receiving repeat orders in the 3D IC field [7]. - The projected revenue for the company is expected to grow significantly, with estimates of 5.411 billion yuan in 2025, 6.862 billion yuan in 2026, and 8.513 billion yuan in 2027 [2][7]. Financial Data and Valuation - Total revenue for 2023 is reported at 2.705 billion yuan, with a year-on-year growth of 59% [2][10]. - The net profit attributable to the parent company for 2024 is projected at 688 million yuan, reflecting a 4% increase compared to the previous year [2][10]. - The company's PE ratio is expected to decrease from 67.9 in 2023 to 25.7 by 2027, indicating improving valuation metrics over time [11]. Performance Metrics - The company's gross margin for Q4 2024 was reported at 39.3%, with a year-on-year decrease of 12.8 percentage points [7]. - The return on equity (ROE) for 2023 was 13.0%, with projections indicating an increase to 21.4% by 2027 [3][10]. - The company's total assets are expected to grow from 9.969 billion yuan in 2023 to 23.470 billion yuan by 2027 [9].

Core Viewpoint - The company is engaged in the research, production, and sales of high-end semiconductor equipment, focusing on maintaining core competitiveness through independent research and development, with a significant emphasis on the growth potential in the semiconductor equipment market driven by advancements in technology and increasing demand from emerging industries [3][4][8]. Company Overview - The company primarily operates in the high-end semiconductor equipment sector, developing products such as PECVD, ALD, SACVD, HDPCVD, and Flowable CVD equipment, which are widely used in the manufacturing of integrated circuits [3][4]. - The company has established a stable cooperation relationship with domestic semiconductor manufacturers, ensuring a steady flow of orders through direct sales and technical services [7][8]. Industry Situation - The semiconductor equipment industry is characterized by cyclical fluctuations, driven by technological advancements and demand from downstream applications, with a projected global semiconductor sales growth of 19% to $628 billion in 2024 [8][9]. - The global semiconductor manufacturing equipment sales are expected to reach $117.1 billion in 2024, reflecting a 10% increase from 2023, with China being the largest market for semiconductor equipment, projected to reach $49.6 billion in sales, a 35% year-on-year growth [9][10]. - The thin film deposition equipment market, a subset of the semiconductor equipment sector, is expected to reach approximately $23 billion in 2024, with the company focusing on CVD equipment, which holds a significant market share [10][12]. Technological Trends - The advancement of three-dimensional integration technology is becoming a key driver for market growth, with the global advanced packaging market expected to grow from $4.3 billion in 2023 to $28 billion by 2029, at a CAGR of 37% [12][13]. - The increasing complexity of chip manufacturing processes and the shift towards 3D chip designs are driving demand for advanced bonding equipment, which is essential for achieving high-density and high-performance chips [12][24]. Financial Data - The company plans to distribute a cash dividend of 2.70 yuan per 10 shares, amounting to a total of approximately 75.18 million yuan, which represents 10.93% of the net profit attributable to shareholders for the reporting period [1][2].