隔夜外盘：截至收盘，道琼斯工业平均指数跌0.07%；纳斯达克综合指数涨0.22%；标准普尔500种股票 指数涨0.11%。费城半导体指数跌0.89%，恩智浦半导体跌0.62%，美光科技跌3.21%，ARM涨0.93%， 应用材料涨0.30%，微芯科技涨1.75%。 行业资讯： 3. 当地时间周四（12月4日），数据分析公司Palantir、英伟达和美国公用事业公司CenterPoint Energy宣 布，三方正共同开发一款新的软件平台，以加速新一代人工智能（AI）数据中心的建设。该软件系统 被命名为"连锁反应"（Chain Reaction），其目标是帮助正在建设AI数据中心的企业解决许可审批、供 应链与施工等难题——这些数据中心的耗电量可与一座小城市相当。 2025年12月4日，截至收盘，沪指跌0.06%，报收3875.79点；深成指涨0.40%，报收13006.72点；创业板 指涨1.01%，报收3067.48点。科创半导体ETF（588170）涨3.09%，半导体材料ETF（562590）涨 2.63%。 1. 今日有2只新股申购，分别为科创板的昂瑞微，沐曦股份；1只新股上市，为科创板的摩尔线程。 2 ...

隔夜外盘：截至收盘，道琼斯工业平均指数跌0.07%；纳斯达克综合指数涨0.22%；标准普尔500种股票 指数涨0.11%。费城半导体指数跌0.89%，恩智浦半导体跌0.62%，美光科技跌3.21%，ARM涨0.93%， 应用材料涨0.30%，微芯科技涨1.75%。 2025年12月4日，截至收盘，沪指跌0.06%，报收3875.79点；深成指涨0.40%，报收13006.72点；创业板 指涨1.01%，报收3067.48点。科创半导体ETF（588170）涨3.09%，半导体材料ETF（562590）涨 2.63%。 行业资讯： 1. 今日有2只新股申购，分别为科创板的昂瑞微，沐曦股份；1只新股上市，为科创板的摩尔线程。 2. 九峰山实验室新发布科技成果氮化镓电源模块——用100万个指甲盖大小的"黑盒子"，装入一座容量1 吉瓦（10亿瓦）的超大型AI算力中心机柜里，一年可省近3亿度电，约合2.4亿元电费。团队负责人表 示，该成果目前已完成概念验证，即将开始中试验证，预计3-5年内量产，届时可满足千亿级市场需 求。氮化镓是第三代半导体材料。若把硅基氮化镓芯片装入电源模块中，替代传统电源模块芯片使用的 硅材料，可 ...

Core Viewpoint - The company,拓荆科技, is focused on high-end semiconductor equipment, particularly in the development and industrial application of thin film deposition equipment, which has seen significant demand in the semiconductor manufacturing sector [1][4]. Group 1: Company Performance and Product Development - The company held a performance briefing on December 4, 2025, discussing its operational results and financial metrics for Q3 2025 [1]. - The company has established industrial bases in Shenyang and Shanghai, with a production capacity exceeding 700 sets per year, and is expanding its capacity with a new factory in Shenyang [1]. - The thin film deposition product series, including PECVD, ALD, SACVD, HDPCVD, and Flowable CVD, has achieved industrial application in the storage chip manufacturing sector, with a full order book indicating strong future demand [1][4]. Group 2: Technological Advancements and Market Trends - The company is continuously expanding its thin film deposition product series and increasing production scale, with new equipment platforms and advanced processes entering mass production [2]. - The semiconductor industry is transitioning into a post-Moore era, with rapid technological iterations and the emergence of new structures and materials, driving demand for advanced semiconductor equipment [3]. - The rise in storage prices reflects strong demand in the storage chip market, which may lead to increased production capacity among manufacturers, further driving the need for advanced thin film equipment [4]. Group 3: Future Outlook - The company plans to maintain its core competitiveness through high-intensity R&D investments, focusing on thin film deposition and three-dimensional integration equipment, while expanding into new products and processes required for advanced manufacturing [3]. - The ongoing complexity in storage chip processes and structures is expected to significantly boost the demand for thin film equipment, as manufacturers seek to enhance performance with advanced materials [4].

高端 半导体 专用设备 公司 拓荆科技 （688072.SH）继续加码主业。 11月27日， 拓荆科技 发布公告，披露2025年度向特定对象发行A股股票相关方案（修订稿），公司拟 通过定增募资不超过46亿元，聚焦高端 半导体设备 产业化、前沿技术研发及补充流动资金三大核心方 向。此举旨在抓住半导体行业发展机遇，强化公司在薄膜沉积设备领域的核心竞争力。 长江商报记者注意到， 拓荆科技 是一家专注于半导体专用设备研发、生产、销售与 技术服务 的国家高 新技术企业。公司业绩持续增长为此次募资提供了坚实支撑。2025年前三季度， 拓荆科技 实现营收 42.2亿元，同比增长85.27%；归母净利润5.57亿元，同比增长105.14%，营收与利润双双倍增，显示出 公司业务发展的强劲动力。 同时，资本市场对公司的发展前景高度认可，截至11月28日， 拓荆科技 股价报收303.3元/股，2025年以 来累计涨幅达97.72%，总市值攀升至852.8亿元。 拟定增募资不超46亿投向三大领域 根据公告， 拓荆科技 本次定增发行对象不超过35名，拟募资不超过46亿元，发行数量不超过发行前公 司总股本的30%，即不超过8434.92 ...

Core Insights - The company reported significant growth in Q3 2025, with revenue reaching 4.22 billion yuan, a year-on-year increase of 85.27%, driven by an expanded product process coverage and enhanced core competitiveness [1] - The gross profit margin was 33.28%, down 10.31 percentage points year-on-year, primarily due to high costs associated with new product validation [1] - The net profit attributable to shareholders was 557 million yuan, up 105.14% year-on-year, benefiting from increased revenue and reduced expense ratios due to scale effects [1] Financial Performance - For Q3 2025, the company achieved revenue of 2.27 billion yuan, a year-on-year increase of 124.15% and a quarter-on-quarter increase of 81.94% [1] - The gross profit margin for Q3 was 34.42%, a decrease of 4.4 percentage points quarter-on-quarter [1] - The net profit attributable to shareholders for Q3 was 462 million yuan, reflecting a year-on-year increase of 225.07% and a quarter-on-quarter increase of 91.60% [1] Production and Market Position - The company began large-scale production of advanced process machines in Q3 2025, exceeding expectations, leading to an upward revision of profit forecasts for 2025-2027 [2] - Revenue projections for 2025-2027 are now set at 6.4 billion, 8.6 billion, and 10.6 billion yuan, respectively, with net profit forecasts of 1.02 billion, 2.02 billion, and 2.73 billion yuan [2] - The company maintains a leading position in the CVD field, with a diverse range of deposition equipment, and is expected to strengthen its competitive edge as various advanced process machines enter mass production [2] Technological Advancements - The company has launched multiple W2W and D2W bonding equipment, aligning with the trend of advanced packaging and expected to contribute to long-term growth [3] - The new generation of memory devices, such as the next-generation 4F2 DRAM, will utilize CBA technology, increasing demand for bonding equipment [3]

Core Viewpoint -拓荆科技 reported significant growth in revenue and net profit for the first half of 2025, indicating a strong recovery and acceleration in business performance, particularly in the second quarter [1][2]. Group 1: Financial Performance - In the first half of 2025, the company achieved operating revenue of 1.954 billion yuan, a year-on-year increase of 54.25%, with the second quarter alone reaching 1.245 billion yuan, up 56.64% year-on-year and 75.74% quarter-on-quarter [1]. - The net profit attributable to shareholders for the first half of 2025 was 94.288 million yuan, with the second quarter net profit reaching 241 million yuan, representing a year-on-year growth of 103.37% and a quarter-on-quarter increase of 388 million yuan [1]. Group 2: Business Development - The company is a leading enterprise in the domestic chemical vapor deposition equipment and advanced bonding equipment for three-dimensional integration, with a broad product range and increasing competitiveness [2]. - The company plans to continue focusing on the research and industrial application of thin film deposition equipment and advanced bonding equipment, while expanding into cutting-edge technologies [2]. - The company has a full order book, with a new industrialization base project in Shenyang planned for a total investment of 1.768 billion yuan, of which 1.5 billion yuan is expected to be raised through a private placement [2]. Group 3: Investment and Expansion - Guotou Jixin (Beijing) Equity Investment Fund has increased its investment in the company's subsidiary, Tuojing Jiank, based on the market prospects for advanced bonding equipment in the three-dimensional integration field, enhancing the subsidiary's capacity and R&D strength [3].

Core Viewpoint - The company,拓荆科技, reported significant growth in revenue and net profit for the first half of 2025, driven by its advancements in thin film deposition equipment and three-dimensional integration technology [1][2]. Financial Performance - In the first half of 2025, the company achieved operating revenue of 1.954 billion yuan, a year-on-year increase of 54.25% [1]. - The second quarter alone saw operating revenue reach 1.245 billion yuan, marking a year-on-year growth of 56.64% and a quarter-on-quarter increase of 75.74% [1]. - The net profit attributable to shareholders for the first half of 2025 was 94.288 million yuan, with the second quarter net profit reaching 241 million yuan, reflecting a year-on-year increase of 103.37% and a quarter-on-quarter increase of 388 million yuan [1][2]. Product and Market Position - The company specializes in the research and industrial application of thin film deposition equipment, with a product range that includes PECVD, ALD, SACVD, HDPCVD, and Flowable CVD technologies [1][2]. -拓荆科技 is recognized as a leading enterprise in the domestic chemical vapor deposition equipment and advanced bonding equipment for three-dimensional integration, with a broad product coverage and increasing competitiveness [2]. Strategic Initiatives - The company is expanding its production capabilities with the construction of a new industrial base in Shenyang, with a total investment of 1.768 billion yuan, of which 1.5 billion yuan is planned to be funded through a private placement [3]. - The investment from Guotou Jixin (Beijing) Equity Investment Fund into the company's subsidiary,拓荆键科, is aimed at enhancing production capacity and research capabilities in the advanced bonding equipment sector [3].

Summary of Conference Call on China Semiconductors Industry Overview - The conference call focused on the semiconductor equipment industry in China, specifically discussing the companies NAURA, AMEC, and Piotech. Key Points Company Performance and Outlook 1. **Piotech's Growth Potential**: Piotech is expected to capture a 58% upside in the next 12 months, driven by rapid EPS growth and currently trading at 30X 2026E EPS, indicating it is underappreciated [2][5][10]. 2. **Order Growth**: All three companies (NAURA, AMEC, Piotech) reported over 40% order growth year-over-year in 1H25, with Piotech's management indicating alignment with industry growth [3][4]. 3. **Profitability Variations**: While Piotech is expected to see a recovery in gross profit margin (GPM) and normalization of R&D expenses, AMEC faces pressure due to high R&D ratios [4][69]. Financial Projections 1. **Piotech's Financials**: - Projected revenue growth of 40% in 2025E, 38% in 2026E, and 31% in 2027E, with a significant EPS increase expected [11][12]. - EPS is projected to grow from RMB 3.52 in 2025E to RMB 6.31 in 2026E, reflecting a 79% increase [12][23]. - GPM is expected to stabilize around 38.4% in 2025E and improve to 43.5% in 2026E [15][21]. 2. **NAURA's Financials**: - Revenue projections for NAURA are set at RMB 38.8 billion in 2025E, growing to RMB 62.1 billion by 2027E, with a GPM of 42.7% in 2025E [46][48]. - EPS is expected to reach RMB 10.61 in 2025E, with a growth rate of 35% [54]. 3. **AMEC's Financials**: - AMEC's revenue is projected to grow at 34% in 2025E, with a significant reduction in GPM to 40% due to increased R&D expenses [69][70]. - EPS is expected to be RMB 5.45 for 2026E, maintaining a P/E multiple of 55x [70]. Investment Recommendations 1. **Price Targets**: - Piotech's price target raised to CNY 300 from CNY 280, indicating strong upside potential [5][10]. - NAURA's price target increased to CNY 450 from CNY 400, reflecting confidence in its market position [5][45]. - AMEC's price target remains at CNY 300, despite profitability concerns [5][70]. R&D and Capital Expenditures 1. **R&D Discipline**: Piotech has shown a disciplined approach to R&D, maintaining a lower expense ratio compared to peers, which is expected to benefit its net profit margin (NPM) [4][11]. 2. **Investment in Infrastructure**: Piotech announced plans to raise RMB 4.6 billion for a semiconductor equipment industrialization base and a cutting-edge technology R&D center [13][14]. Market Sentiment 1. **Positive Sentiment**: The overall sentiment in the semiconductor equipment market is optimistic, with expectations of continued order growth and profitability improvements for Piotech, NAURA, and AMEC [3][4][8]. Additional Insights - The shift in order growth dynamics, particularly in advanced logic and memory sectors, is expected to benefit all three companies in the coming years [3][43]. - The competitive landscape is intensifying, with all companies facing pressure on margins due to increased R&D investments and changing accounting rules [4][69]. This summary encapsulates the key insights and projections discussed during the conference call, highlighting the growth potential and challenges faced by the semiconductor equipment companies in China.

Core Viewpoint - The company,拓荆科技, is intensifying its focus on the high-end semiconductor equipment sector by planning a private placement to raise up to 4.6 billion yuan for industrialization, technology research, and working capital, aiming to enhance its core competitiveness in the thin film deposition equipment field [1][2]. Group 1: Fundraising and Investment Plans - The company plans to raise no more than 4.6 billion yuan through a private placement, targeting up to 35 investors, with the issuance not exceeding 30% of the pre-issue total share capital, equating to a maximum of 83.92 million shares [2]. - The raised funds will be allocated to three main areas: 1.5 billion yuan for the construction of a high-end semiconductor equipment industrialization base, 2 billion yuan for the establishment of a cutting-edge technology research center, and 1.1 billion yuan for supplementing working capital [2][3]. Group 2: Financial Performance - Since its establishment in 2010, the company has focused on independent research and innovation, developing various thin film equipment widely used in integrated circuit manufacturing [4]. - The company has experienced rapid revenue growth since its listing in 2022, with revenues of 1.706 billion yuan, 2.705 billion yuan, and 4.103 billion yuan projected for 2022, 2023, and 2024 respectively, alongside net profits of 368 million yuan, 663 million yuan, and 688 million yuan, marking three consecutive years of growth [4]. - In the first half of 2025, the company's net profit decreased by 26.96% year-on-year to 94 million yuan, but the adjusted net profit showed a significant increase of 91.35% year-on-year to 38 million yuan [5]. Group 3: Market Position and Future Outlook - The company aims to enhance its production capacity for high-end semiconductor equipment, supporting the industrialization of its PECVD, SACVD, and HDPCVD product lines, while improving production efficiency through smart facilities [3]. - The company has not engaged in equity financing since its IPO in 2022, with a total of 2.273 billion yuan raised, of which 2.128 billion yuan has been invested in expanding production and technology development [3].

Core Viewpoint -拓荆科技 announced a series of financing plans, including a capital increase to its subsidiary拓荆键科, aiming to raise up to 4.6 billion yuan to support the rapid development of three-dimensional integration equipment [1][4] Group 1: Financing Details - The financing plan includes a total of no more than 10.4 billion yuan for拓荆键科, with a pre-investment valuation of 2.5 billion yuan [1] - 大基金三期 plans to participate in the capital increase with no more than 450 million yuan, marking its first public investment since its establishment in May 2024 [1][2] - 国投集新 also intends to invest up to 450 million yuan, resulting in a 12.71% stake in拓荆键科 after the capital increase [1][2] Group 2: Company Overview - 拓荆键科, established in September 2020, focuses on the research and industrial application of advanced bonding equipment for three-dimensional integration [2] - The company has launched various products, including wafer-to-wafer bonding equipment and measurement devices, serving clients in advanced storage, logic, and image sensor sectors [2] Group 3: Market Context - Three-dimensional integration aims to overcome the physical limitations of traditional two-dimensional integration by stacking chips vertically, enhancing packaging efficiency and transistor density [3] - The technology is essential for maintaining the momentum of Moore's Law and addressing increasing market demands [3] Group 4: Financial Performance - In 2024, 拓荆键科 reported revenues of 97.3 million yuan and a net loss of 2.1 million yuan [4] - The company has experienced rapid revenue growth, with revenues of 1.706 billion yuan, 2.705 billion yuan, and 4.103 billion yuan in 2022, 2023, and 2024, respectively, reflecting a compound annual growth rate of 55.08% [4] Group 5: Project Implementation - The implementation of the projects will significantly enhance the production capacity of high-end semiconductor equipment and improve production efficiency through intelligent facilities [5] - The company plans to allocate 20 billion yuan for the construction of a cutting-edge technology research and development center, focusing on advanced thin film deposition equipment [6]