Core Viewpoint - The Nanjing Xinde Technology packaging production line upgrade project is expected to generate an annual output value exceeding 1.8 billion yuan after full production, highlighting the growth of the semiconductor industry in the Jiangsu province [1][4]. Group 1: Project Overview - The Nanjing Xinde Technology packaging production line upgrade project is a major industrial project in Jiangsu province for 2025, focusing on enhancing high-end semiconductor packaging technology and expanding production capacity [1]. - The project, initiated in February last year, has a total investment of approximately 1.1 billion yuan and is expected to be fully operational by 2026 [1]. - The project is based on a 60-acre factory and aims to achieve an annual output value of over 1.8 billion yuan upon full production [1]. Group 2: Equipment and Technology - In the past two months, the company has added 28 new pieces of equipment, including fully automated AOI inspection equipment and surface mount machines [2]. - The project includes the construction of system-level and wafer-level packaging production lines, with plans to complete 80% of the system-level line and 90% of the wafer-level line's equipment procurement by September this year [2]. - The project has achieved over 80% completion in equipment procurement, with 50% of the equipment currently in the installation and debugging phase [2]. Group 3: Automation and Efficiency - The company is developing a highly integrated intelligent production line to reduce labor costs and improve production efficiency, achieving over 30% reduction in manual intervention through automated processes [3]. - The high-precision dicing machine supports ultra-thin wafer cutting and is equipped with an AI vision detection system for real-time path correction [3]. - The SMT equipment can achieve a placement speed of 48,000 points per hour, improving efficiency by 15% compared to traditional equipment [3]. Group 4: Market Position and Future Prospects - Nanjing Xinde Technology, established in September 2020, specializes in semiconductor integrated circuit packaging and testing, with a focus on high-end packaging products [3]. - The company has successfully launched advanced packaging technology platforms and is one of the few independent packaging and testing enterprises in China capable of chiplet packaging technology [3]. - The project aims to focus on high-end chip packaging and testing in various fields, including 5G, AI, and high-performance computing [4].

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