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兴森科技(002436):营收实现增长,坚定发展半导体业务
Changjiang Securities· 2025-05-19 15:31
Investment Rating - The investment rating for the company is "Buy" and is maintained [9]. Core Views - The company reported a revenue of 5.817 billion yuan for 2024, an increase of 8.53% year-on-year, but a net profit attributable to shareholders of -198 million yuan, a decrease of 193.88% year-on-year. For Q1 2025, the revenue was 1.580 billion yuan, up 13.77% year-on-year, while the net profit attributable to shareholders was 9 million yuan, down 62.24% year-on-year [2][6]. - The PCB business showed growth, but significant investments in expenses led to losses. The revenue from PCB, semiconductor test boards, and packaging substrates for 2024 was 4.300 billion yuan, 169 million yuan, and 1.116 billion yuan, with year-on-year growth rates of +5.11%, -36.21%, and +35.87% respectively [11]. - The FCBGA project is expanding, with an overall investment exceeding 3.5 billion yuan, and the project has entered small batch production. The company aims to complete product certification for overseas clients by 2025 [11]. Summary by Sections Financial Performance - In 2024, the total revenue was 58.17 billion yuan, with a gross profit of 9.23 billion yuan, resulting in a gross margin of 16%. The net profit attributable to shareholders was -1.98 billion yuan [16]. - For 2025, the projected revenues are 62.62 billion yuan, 74.54 billion yuan, and 84.09 billion yuan for 2025, 2026, and 2027 respectively, with net profits expected to be 1.09 billion yuan, 3.65 billion yuan, and 4.35 billion yuan [16]. Business Segments - The PCB segment generated 4.300 billion yuan in revenue, with a gross margin of 26.96%. The semiconductor test board segment had a revenue of 169 million yuan, with a gross margin of 37.38%. The packaging substrate segment generated 1.116 billion yuan, but with a negative gross margin of -43.86% [11]. - The company is focusing on upgrading PCB products and breaking into strategic large clients, which is expected to improve product profitability [11]. Future Outlook - The semiconductor packaging substrate business is expected to become a new growth driver, with established partnerships with major domestic and international clients. The company anticipates benefiting from high industry demand as new capacities come online [11].