兴森科技所属申万行业为：电子-元件-印制电路板。所属概念板块包括：PCB概念、5G、光通信、华为 概念、毫米波雷达等。 截至9月19日，兴森科技股东户数13.30万，较上期增加13.68%；人均流通股11357股，较上期减少 12.03%。2025年1月-6月，兴森科技实现营业收入34.26亿元，同比增长18.91%；归母净利润2883.29万 元，同比增长47.85%。 分红方面，兴森科技A股上市后累计派现11.29亿元。近三年，累计派现2.70亿元。 机构持仓方面，截止2025年6月30日，兴森科技十大流通股东中，香港中央结算有限公司位居第五大流 通股东，持股3361.64万股，相比上期增加831.05万股。南方中证500ETF（510500）位居第六大流通股 东，持股2504.68万股，相比上期增加351.90万股。光大保德信信用添益债券A类（360013）位居第九大 流通股东，持股1129.31万股，相比上期减少1064.60万股。易方达供给改革混合（002910）退出十大流 通股东之列。 9月25日，兴森科技盘中下跌2.05%，截至09:39，报22.48元/股，成交2.44亿元，换手率0.71%， ...

融资方面，兴森科技当日融资买入4.43亿元。当前融资余额28.91亿元，占流通市值的7.41%，融资余额 超过近一年90%分位水平，处于高位。 融券方面，兴森科技9月24日融券偿还15.78万股，融券卖出2300.00股，按当日收盘价计算，卖出金额 5.28万元；融券余量81.93万股，融券余额1880.29万元，超过近一年90%分位水平，处于高位。 资料显示，深圳市兴森快捷电路科技股份有限公司位于广东省深圳市南山区粤海街道沙河西路与白石路 交汇处深圳湾科技生态园一区2栋A座8层，成立日期1999年3月18日，上市日期2010年6月18日，公司主 营业务涉及PCB业务、半导体业务。主营业务收入构成为：PCB印制电路板71.45%，IC封装基板 21.09%，其他4.29%，半导体测试板3.17%。 9月24日，兴森科技跌1.33%，成交额31.71亿元。两融数据显示，当日兴森科技获融资买入额4.43亿 元，融资偿还2.30亿元，融资净买入2.12亿元。截至9月24日，兴森科技融资融券余额合计29.10亿元。 分红方面，兴森科技A股上市后累计派现11.29亿元。近三年，累计派现2.70亿元。 机构持仓方面，截止 ...

Core Insights - The company reported a revenue of 3.43 billion yuan for the first half of 2025, representing an 18.91% increase compared to the same period last year [1] - Net profit attributable to shareholders reached 28.83 million yuan, a 47.85% increase year-on-year [1] - The company’s semiconductor business, including IC packaging substrate and semiconductor testing board, achieved a revenue of 830 million yuan, marking a 38.39% increase [2][3] Financial Performance - Revenue for the PCB business was 2.448 billion yuan, a year-on-year growth of 12.8%, with a gross margin of 26.32%, slightly down by 0.77 percentage points [2] - The net profit for the Fineline subsidiary was 75.96 million yuan, a decrease of 13.5%, primarily due to foreign exchange losses [2] - The company’s total assets at the end of the reporting period were 14.99 billion yuan, a 9.67% increase from the previous year [1] Business Segments - The IC packaging substrate business generated 722 million yuan in revenue, a 36.04% increase, driven by CSP packaging substrate contributions [2][3] - The company is focusing on high-value products in the CSP packaging substrate business, particularly in storage and RF sectors, and is expanding into the automotive market [3] - The FCBGA packaging substrate project has not yet achieved mass production, leading to a negative gross margin of -25.17% [3]

Core Viewpoint - The credit rating report indicates that Shenzhen Xingsen Quick Circuit Technology Co., Ltd. (referred to as "Xingsen Technology") maintains a stable credit rating of AA, reflecting its leading position in the domestic PCB prototype and small batch board sector, despite facing significant financial challenges due to high upfront costs in semiconductor projects and slow order integration [2][4][5]. Company Overview - Xingsen Technology is recognized as one of the few domestic manufacturers capable of mass production of FCBGA packaging substrates, maintaining a technological edge in the industry [2][17]. - The company has a diversified product application across various sectors, including communication, industrial control, medical electronics, and consumer electronics, with a stable customer base [4][17]. Financial Performance - The company reported total assets of 145.69 billion and total liabilities of 59.44 billion as of March 2025, with operating revenue of 15.80 billion for the year [2]. - The net profit for 2024 was a loss of 5.31 billion, reflecting the impact of high costs associated with semiconductor projects and insufficient order volume [3][5]. - The company's debt-to-equity ratio increased, indicating rising financial leverage and debt repayment pressure [5][19]. Industry Environment - The PCB market is expected to recover in 2024, driven by demand from AI servers and consumer electronics, with a projected global market value of 73.6 billion, representing a 5.8% year-on-year growth [11][12]. - The domestic PCB market in China is anticipated to grow from 41.2 billion to 50.8 billion from 2024 to 2029, with a compound annual growth rate of 4.3% [11][12]. - The industry faces challenges such as high raw material costs and competitive pressures, which may impact profit margins [15][19]. Competitive Position - Xingsen Technology ranks seventh among domestic PCB manufacturers according to the CPCA, showcasing its competitive strength [17]. - The company has invested significantly in R&D, with 4.42 billion allocated in 2024, and has received national awards for its technological advancements [18][19]. - Despite the competitive landscape, Xingsen Technology's PCB business saw a revenue increase of 5.11% in 2024, primarily due to recovery in the consumer electronics sector [19].

Investment Rating - The investment rating for the company is "Buy" and is maintained [9]. Core Views - The company reported a revenue of 5.817 billion yuan for 2024, an increase of 8.53% year-on-year, but a net profit attributable to shareholders of -198 million yuan, a decrease of 193.88% year-on-year. For Q1 2025, the revenue was 1.580 billion yuan, up 13.77% year-on-year, while the net profit attributable to shareholders was 9 million yuan, down 62.24% year-on-year [2][6]. - The PCB business showed growth, but significant investments in expenses led to losses. The revenue from PCB, semiconductor test boards, and packaging substrates for 2024 was 4.300 billion yuan, 169 million yuan, and 1.116 billion yuan, with year-on-year growth rates of +5.11%, -36.21%, and +35.87% respectively [11]. - The FCBGA project is expanding, with an overall investment exceeding 3.5 billion yuan, and the project has entered small batch production. The company aims to complete product certification for overseas clients by 2025 [11]. Summary by Sections Financial Performance - In 2024, the total revenue was 58.17 billion yuan, with a gross profit of 9.23 billion yuan, resulting in a gross margin of 16%. The net profit attributable to shareholders was -1.98 billion yuan [16]. - For 2025, the projected revenues are 62.62 billion yuan, 74.54 billion yuan, and 84.09 billion yuan for 2025, 2026, and 2027 respectively, with net profits expected to be 1.09 billion yuan, 3.65 billion yuan, and 4.35 billion yuan [16]. Business Segments - The PCB segment generated 4.300 billion yuan in revenue, with a gross margin of 26.96%. The semiconductor test board segment had a revenue of 169 million yuan, with a gross margin of 37.38%. The packaging substrate segment generated 1.116 billion yuan, but with a negative gross margin of -43.86% [11]. - The company is focusing on upgrading PCB products and breaking into strategic large clients, which is expected to improve product profitability [11]. Future Outlook - The semiconductor packaging substrate business is expected to become a new growth driver, with established partnerships with major domestic and international clients. The company anticipates benefiting from high industry demand as new capacities come online [11].

Group 1: Company Overview - The main business of the company is the research, development, production, and sales of printed circuit boards (PCBs) [6] - As of March 31, 2025, the number of shareholders is 27,571 [5] Group 2: Financial Performance - In 2024, the company achieved an operating income of RMB 1.559 billion, a year-on-year decrease of 3.70% [3] - The net profit attributable to shareholders was RMB 11.384 million, a significant decline of 88.91% year-on-year [3] - The net cash flow from operating activities was RMB 156 million [3] Group 3: Market Challenges - The decline in foreign sales revenue was influenced by market conditions in Europe and the United States, leading to a decrease in export business [3] - The company faced pressure from rising raw material prices and intensified industry competition, resulting in a decrease in gross margin [7] - New product lines are still in the capacity ramp-up phase, contributing to losses in related business areas [7] Group 4: Strategic Focus - In 2025, the company will focus on high-precision, high-density, and high-reliability PCB technologies, including advanced packaging and thermal management [3] - The company aims to enhance its manufacturing capabilities for high-tech, high-value-added products to strategically upgrade its product structure [3] Group 5: Share Buyback Plan - The company announced a share buyback plan on May 14, 2025, intending to repurchase shares using between RMB 15 million and RMB 25 million of its own or raised funds [2]

Company Performance - Company achieved operating revenue of 5.817 billion yuan in 2024, representing a year-on-year increase of 8.53% [2] - Net profit attributable to shareholders was -198 million yuan, a year-on-year decline of 193.88%, primarily due to high investments in FCBGA packaging substrate projects and losses from subsidiaries [2] Industry Overview - The global PCB industry is experiencing a structural recovery in 2024, with high-layer boards (18 layers and above) and HDI boards showing year-on-year growth of approximately 40% and 18.8%, respectively, driven by demand from AI, communications, and satellite sectors [2] - Overall demand in the packaging substrate industry is currently insufficient, but a recovery is expected in 2025, with BT substrates likely to outperform ABF substrates [2] Company Strategy - Company is in the small-batch production stage for FCBGA packaging substrates, with future mass production dependent on industry demand recovery, customer production progress, and supplier management strategies [2] - Company is focusing on market expansion and customer certification, aiming to achieve large-scale production by enhancing technical capabilities, optimizing processes, and improving yield and delivery performance [2] - Beijing Xinfai plans to upgrade production lines in mid-2024, focusing on expanding capacity for AI server accelerator cards and high-end optical module products [3] - Revenue from semiconductor test boards increased by over 30% year-on-year, with a continuous rise in the proportion of high-end products [3] - Future profit growth will focus on the steady development of PCB samples and test board businesses, as well as improving capacity utilization and cost optimization for CSP and FCBGA packaging substrates [3]

Investment Rating - The report maintains a "Buy" rating for the company with a target price of RMB 15.00 [7][15]. Core Insights - The company reported a revenue of RMB 5.8 billion for 2024, representing a year-over-year increase of 9%. However, it faced a net loss of RMB 200 million due to high costs associated with the ABF substrate project and underperformance of the BT substrate factory [1][4]. - In Q1 2025, the company achieved a revenue of RMB 1.58 billion, a 14% year-over-year increase, with a gross margin of 17.2%, slightly improving from the previous quarter [1][2]. - The report highlights that the demand for domestic IC substrates has increased due to tariff conflicts, leading to an upward revision of the target price [1][4]. Summary by Sections Financial Performance - For 2024, the company reported a revenue of RMB 5.8 billion and a gross margin of 15.9%, down 7.4 percentage points year-over-year. The net loss attributable to shareholders was RMB 200 million [1][4]. - In Q1 2025, the company recorded a revenue of RMB 1.58 billion and a net profit of RMB 9 million, although this was a 62% decline year-over-year [2][3]. 2025 Outlook - The company plans to focus on new products and customer integration for ABF substrates, expecting a revenue contribution of RMB 58 million in 2025. The BT substrate segment is anticipated to improve profitability, with projected revenue of RMB 1.3 billion [3][4]. - The report indicates that the company is experiencing a ramp-up in production capacity, particularly in its Guangzhou and Zhuhai factories, which is expected to enhance profitability in the BT substrate segment [3][4]. Valuation Adjustments - The target price was raised to RMB 15.00, reflecting a more favorable outlook for the company's IC substrate business amid increased domestic demand. The valuation multiples for PCB and semiconductor businesses were adjusted to 25.0x PE and 8.0x PS, respectively [4][15]. - The report also notes a downward revision of net profit expectations for 2025 and 2026 due to ongoing adjustments in the PCB business and high initial costs for new ABF substrate lines [4][12].