股票简称：优迅股份 股票代码：688807 厦门优迅芯片股份有限公司 XIAMEN UX IC CO., LTD. （厦门市软件园观日路 52 号 402） 首次公开发行股票科创板上市公告书 保荐人（主承销商） （广东省深圳市福田区中心三路 8 号卓越时代广场（二期）北座） 二〇二五年十二月十八日 厦门优迅芯片股份有限公司 上市公告书 特别提示 厦门优迅芯片股份有限公司（以下简称"优迅股份""本公司""发行人" "公司"）股票将于 2025 年 12 月 19 日在上海证券交易所科创板上市。 本公司提醒投资者应充分了解股票市场风险及本公司披露的风险因素，在新 股上市初期切忌盲目跟风"炒新"，应当审慎决策、理性投资。 1 | 特别提示 | 1 | | --- | --- | | 目录 2 | | | 第一节 | 重要声明与提示 4 | | 一、重要声明与提示 4 | | | 二、风险提示 4 | | | 三、特别风险提示 6 | | | 第二节 | 股票上市情况 12 | | 一、股票注册及上市审核情况 12 | | | 二、股票上市相关信息 13 | | | 三、公司申请首次公开发行并上市时选择的具体上市标准 ...

（文章来源：证券时报网） N昂瑞-UW(688790)今日上市，开盘上涨188.95%，截至收盘涨幅回落至160.11%，全天成交量907.64万 股，成交额20.61亿元，换手率75.28%。 公司是一家专注于射频、模拟领域的集成电路设计企业，是国家级专精特新重点"小巨人"企业。公司主 要从事射频前端芯片、射频SoC芯片及其他模拟芯片的研发、设计与销售。自成立以来，公司通过持续 的研发投入和技术积累，不断进行产品高效迭代，为客户提供高性能、高可靠性、低功耗、高集成度的 射频及模拟芯片产品。 统计显示，公司本次发行总量为2488.29万股，其中，网上发行量为597.20万股，发行价格为83.06元/ 股，网上发行最终中签率为0.03449153%。公司首发募资金额为20.67亿元，募资主要投向5G射频前端 芯片及模组研发和产业化升级项目、总部基地及研发中心建设项目、射频SoC研发及产业化升级项目 等。（数据宝） 今日上市新股表现 | 代码 | 简称 | 最新价（元） | 收盘涨跌幅（%） | 首日换手率（%） | | --- | --- | --- | --- | --- | | 688790 | N昂瑞-U ...

中国经济网北京12月16日讯 今日，昂瑞微（688790）在上交所上市。 上交所：昂瑞微（688790） (责任编辑：关婧) 综上，钱永学在本次发行前合计控制了公司62.4309%的表决权。本次发行后，钱永学合计控制公 司52.4783%的表决权，仍为公司实际控制人。 昂瑞微本次发行募集资金总额206,677.55万元，扣除发行费用后募集资金净额为193,232.27万元，用 于5G射频前端芯片及模组研发和产业化升级项目、射频SoC研发及产业化升级项目、总部基地及研发中 心建设项目。 昂瑞微是一家专注于射频、模拟领域的集成电路设计企业，是国家级专精特新重点"小巨人"企业。 公司主要从事射频前端芯片、射频SoC芯片及其他模拟芯片的研发、设计与销售。 报告期内，公司股权较为分散，单一股东所持表决权均未超过30%。任何单一股东所持的表决权均 无法控制股东会或对股东会决议产生重大影响。因此，公司认定无控股股东。公司实际控制人为钱永 学，截至上市公告书签署日，钱永学直接持有公司3.8578%的股份，并通过特别表决权机制直接控制公 司21.9494%的表决权；通过北京鑫科间接控制公司9.1200%的股份，并通过特别表决权 ...

Core Viewpoint - Angrui Micro (688790.SH) has initiated its subscription with an issue price of 83.06 CNY per share and a price-to-earnings ratio of 58.25 times, positioning itself as a key player in the integrated circuit design industry, particularly in the RF and analog sectors [1] Company Overview - Angrui Micro specializes in the research, design, and sales of RF front-end chips, RF SoC chips, and other analog chips, recognized as a national-level "little giant" enterprise focusing on specialized and innovative technologies [1] - The company has achieved significant technological advancements and product iterations through continuous R&D investment, providing high-performance, reliable, low-power, and highly integrated RF and analog chip products [1] Product Lines - The core product lines include a full range of RF front-end chips for smart mobile terminals (covering 5G/4G/3G/2G) and RF SoC chips for IoT applications, such as low-power Bluetooth and 2.4GHz wireless communication chips [2] - Angrui Micro has established a strong customer base, with its RF front-end chips being sold to major brands like Honor, Samsung, Vivo, Xiaomi, OPPO, and Lenovo, while its RF SoC chips are utilized by companies like Alibaba, Pinduoduo, and BYD [2] Technological Innovation - The company has led or participated in six national-level and multiple local major scientific research projects, contributing to the foundational research and industrial application of RF technology in China [3] - Angrui Micro has developed high-integration products like the 5GL-PAMiD, achieving performance levels comparable to international competitors and breaking their monopoly in the L-PAMiD module market [3] Market Position - Among domestic RF front-end companies, Angrui Micro ranks among the top three in revenue, with projected revenues of 2.101 billion CNY for 2024, of which 1.790 billion CNY comes from RF front-end products [3] - The global market for low-power Bluetooth devices is estimated at 1.8 billion units in 2024, with Angrui Micro expected to capture approximately 5.4% of the market share in the IoT wireless connection chip sector, with a projected shipment of 9.8 million units [3] Financial Performance - The company reported revenues of approximately 0.923 billion CNY, 1.695 billion CNY, 2.101 billion CNY, and 0.844 billion CNY for the years 2022, 2023, 2024, and the first half of 2025, respectively [4] - Net profits for the same periods were approximately -0.290 billion CNY, -0.450 billion CNY, -0.065 billion CNY, and -0.040 billion CNY, indicating ongoing financial challenges [4] Financial Metrics - As of June 30, 2025, total assets are reported at 1.627 billion CNY, with equity attributable to shareholders at 936.3 million CNY and a debt-to-asset ratio of 39.58% [5] - The company's operating income for 2024 is projected at 2.101 billion CNY, with a net profit of -0.065 billion CNY, reflecting a trend of increasing revenue but persistent losses [5]

Core Viewpoint - Angrui Micro's IPO aims to raise approximately 2.067 billion yuan, with a share price set at 83.06 yuan per share, reflecting strong investor confidence and strategic partnerships in the RF chip market [1][2][3][4]. Company Overview - Angrui Micro, established in 2012, specializes in RF and analog integrated circuit design and is recognized as a national-level "little giant" enterprise [3]. - The company focuses on the research, design, and sales of RF front-end chips, RF SoC chips, and other analog chips, providing high-performance, reliable, low-power, and highly integrated products [3]. IPO Details - The IPO will issue 24.8829 million shares, all through public offering, with the subscription starting on December 5 and results announced on December 9 [1][2]. - The total expected fundraising amount is 2.067 billion yuan, with a net amount of approximately 1.932 billion yuan after deducting issuance costs [1][2]. Market Potential - The global RF front-end market is projected to reach 24.7 billion USD by 2028, indicating significant growth opportunities for Angrui Micro [3]. - From 2022 to 2024, the company's revenue is expected to grow from 923 million yuan to 2.101 billion yuan, with a compound annual growth rate exceeding 50% [3]. Business Applications - Angrui Micro has diversified its business across various sectors, including automotive communication, satellite communication, and IoT, with products already in mass production for major automotive brands and flagship mobile devices [3]. - The company’s RF SoC revenue is projected to reach 295 million yuan in 2024, reflecting a year-on-year growth of 49.5% [3]. Fund Utilization - The funds raised from the IPO will be allocated to the R&D and industrialization of 5G RF front-end chips and modules, RF SoC development, and the construction of headquarters and R&D centers [4]. - These investments are crucial for enhancing R&D capabilities and expanding into high-end markets and emerging applications in satellite and automotive wireless communication [4].

智通财经APP获悉，12月2日，中国证监会国际合作司发布《关于国民技术股份有限公司境外发行上市备案通知书》。国民技术(300077.SZ)拟发行不超过 145,781,400股境外上市普通股并在香港联合交易所上市。 招股书显示，国民技术是一家平台型集成电路设计公司，致力于为各类智能终端提供高安全性、高可靠性、高集成度的控制芯片与系统解决方案。依靠软硬 件安全架构、前沿的异构集成方案以及灵活的兼容适配能力，公司在消费电子、工业控制和数字能源、智慧家居、汽车电子与医疗电子多个关键领域实现了 产品的广泛应用，成功构建了多元化场景覆盖的产品矩阵。 根据灼识咨询的资料，按2024年收入计，公司在全球平台型MCU市场中，在中国企业中名列前五，而在全球32位平台型MCU市场中，在中国企业中名列前 三。根据灼识咨询的资料，按2024年收入计，公司在内置商业密码算法模块的中国MCU市场中，排名第一。 ...

智通财经APP获悉，12月2日，中国证监会国际合作司发布《关于国民技术股份有限公司境外发行上市备案通知书》。国民技术(300077.SZ)拟发行不超过 145,781,400股境外上市普通股并在香港联合交易所上市。 招股书显示，国民技术是一家平台型集成电路设计公司，致力于为各类智能终端提供高安全性、高可靠性、高集成度的控制芯片与系统解决方案。依靠软硬 件安全架构、前沿的异构集成方案以及灵活的兼容适配能力，公司在消费电子、工业控制和数字能源、智慧家居、汽车电子与医疗电子多个关键领域实现了 产品的广泛应用，成功构建了多元化场景覆盖的产品矩阵。 根据灼识咨询的资料，按2024年收入计，公司在全球平台型MCU市场中，在中国企业中名列前五，而在全球32位平台型MCU市场中，在中国企业中名列前 三。根据灼识咨询的资料，按2024年收入计，公司在内置商业密码算法模块的中国MCU市场中，排名第一。 ...

Core Viewpoint - Chengdu Huami (688709.SH) is actively developing brain-computer interface technology, focusing on providing foundational hardware components for signal processing, including high-precision ADCs and low-power FPGAs and MCUs [1] Group 1: Company Developments - The company has leveraged its integrated circuit design advantages to establish a presence in the brain-computer interface sector [1] - Key projects in collaboration with universities such as Shanghai Jiao Tong University and Tianjin University have been completed, covering both invasive and non-invasive brain-computer interface signal chain requirements [1] - The company maintains strong collaborative relationships with several higher education institutions and research organizations, including University of Electronic Science and Technology of China, Xi'an University of Electronic Science and Technology, and National University of Defense Technology [1] Group 2: Future Plans - The company will closely monitor trends in cutting-edge technology and explore new collaboration opportunities in line with its R&D strengths [1] - The company emphasizes the importance of industry-academia-research collaborative innovation and will fulfill information disclosure obligations for any new cooperation plans [1]

Core Viewpoint - Canshi Semiconductor experienced a decline in stock price and significant changes in financing activities, indicating potential liquidity concerns and a challenging financial environment [1][2]. Financing Activities - On November 11, Canshi Semiconductor's stock fell by 0.67%, with a trading volume of 616 million yuan. The financing buy-in amounted to 52.85 million yuan, while financing repayment was 63.02 million yuan, resulting in a net financing outflow of 10.17 million yuan [1]. - As of November 11, the total financing and securities lending balance for Canshi Semiconductor was 681 million yuan, representing 8.56% of its market capitalization, which is above the 90th percentile of the past year [1]. - The company had no securities lending activity on November 11, with a balance of 0 shares and 0 yuan in securities lending [1]. Financial Performance - For the period from January to September 2025, Canshi Semiconductor reported a revenue of 468 million yuan, a year-on-year decrease of 45.74%. The net profit attributable to shareholders was -94.49 million yuan, reflecting a significant decline of 215.28% compared to the previous year [2]. Shareholder Information - As of September 30, 2025, the number of shareholders for Canshi Semiconductor was 11,300, an increase of 4.17% from the previous period. The average number of circulating shares per shareholder decreased by 4.00% to 6,311 shares [2]. - The company has distributed a total of 71.76 million yuan in dividends since its A-share listing [3]. - Notable new institutional shareholders include Qianhai Kaiyuan Public Utilities Stock and Nuoan Flexible Allocation Mixed Fund, among others, indicating growing institutional interest [3].

Group 1 - The core point of the article is that Hangzhou Chipright Microelectronics Co., Ltd. has completed its Series A financing round, raising hundreds of millions of RMB, with participation from several investment institutions [1][2]. - The investors in this financing round include Zhongke Chuangxing, Shanzheng Investment, Hongtai Fund, Guozhong Capital, Botai Venture Capital, and Shandong Publishing [1][2]. - Hangzhou Chipright Microelectronics specializes in integrated circuit design and testing, focusing on domestic integrated circuit design with products such as digital isolators, memory, sensors, and interface circuits [2]. Group 2 - The company adheres to the philosophy of "Chip Right, National Strength" and aims to strengthen domestic integrated circuit design capabilities [2]. - The core management and technical personnel of the company have extensive experience in IC design, testing, and operations, including experts with special allowances from the State Council and senior engineers [2].