证券日报网讯2月6日，昂瑞微在互动平台回答投资者提问时表示，公司卫星通信产品具备卫星直联功 能，不涉及卫星组网通信。公司卫星通信产品可同时支持北斗、天通和低轨三种卫星通信系统。凭借深 厚的技术积累与产品创新能力，公司卫星通信产品已于多家品牌手机终端客户的高端机型实现量产出 货。未来，公司将继续深耕卫星通信射频芯片技术研发，加大相关产品的创新与迭代力度，拓展更多元 化的应用场景，助力我国卫星通信产业发展，为构建空天地一体化通信网络贡献力量。 ...

Core Viewpoint - The article highlights the significant increase in IPO applications on the Sci-Tech Innovation Board, with 48 companies accepted in 2025 compared to only 6 in 2024, particularly emphasizing the semiconductor sector with 20 companies [1]. Group 1: Company Summaries - Angrui Micro, based in Beijing, focuses on RF and analog integrated circuit design and has successfully completed its IPO process, emphasizing domestic substitution in RF and analog chips [1]. - Shanghai Super Silicon specializes in the R&D and production of 300mm and 200mm semiconductor silicon wafers, which are critical substrates for chip manufacturing [1]. - Hengyun Chang, located in Shenzhen, develops plasma RF power systems and devices, essential for advanced chip manufacturing processes [1]. - Chipmi Technology, based in Shanghai, focuses on semiconductor-grade perfluoroether rubber materials, crucial for sealing in semiconductor production [1]. - Zhaoxin Integrated, also in Shanghai, develops high-end general-purpose processors and supporting chips, aiding in domestic chip substitution [2]. - Shanghai Superconductor specializes in high-temperature superconducting materials, enhancing semiconductor device performance [2]. - Youxun Co., based in Xiamen, is a leader in optical communication front-end transceiver chips, recognized as a national champion in manufacturing [2]. - Yadian Technology, located in Jiangsu, develops wet cleaning equipment for silicon-based and compound semiconductors, vital for chip manufacturing precision [3]. - Moer Thread, based in Beijing, focuses on GPU and related products, aligning with high-end industry development needs [3]. - Muxi Co., located in Shanghai, specializes in full-stack GPU products, supporting AI training and general computing [3]. - Qinheng Micro, based in Nanjing, develops interface chips and interconnect MCUs, essential for embedded systems [4]. - Youyan Composite Materials, located in Beijing, produces special non-ferrous metal alloy products for semiconductor packaging [4]. - Lianxun Instruments, based in Suzhou, develops electronic measurement instruments and semiconductor testing equipment [4]. - Lepu Technology, based in Chengdu, focuses on high-end semiconductor equipment, crucial for chip manufacturing [4]. - Zhongke Kehua, located in Jiangsu, specializes in semiconductor packaging materials, impacting chip packaging quality [5]. - Pinzhun Laser, based in Shanghai, develops precision lasers for semiconductor production processes [5]. - Changxin Technology, located in Anhui, focuses on DRAM products, contributing to domestic storage chip production [5]. - Ruishi Chuangxin, based in Chongqing, develops RF front-end chips and modules for various applications [5]. - Taosheng Technology, based in Shanghai, specializes in semiconductor testing interfaces, crucial for product quality assurance [6]. - Zhongtu Technology, located in Dongguan, develops GaN substrates, essential for high-end chips and new energy applications [6]. Group 2: Market Trends and Characteristics - The 20 companies show a significant regional concentration in Shanghai, Jiangsu, Beijing, and Guangdong, indicating a well-developed semiconductor industry ecosystem in these areas [12]. - The companies cover a comprehensive industry chain, including upstream materials, midstream chip design, and downstream testing and packaging, aligning with collaborative industry development trends [12]. - There is a notable profit disparity among the companies, with many in the high R&D investment sectors like chip design operating at a loss, while those in testing and materials are achieving profitability [12].

（编辑 王雪儿） 证券日报网1月30日讯 ，昂瑞微在接受调研者提问时表示，行业竞争格局的演变将受到整体市场环境与 新产品迭代速度等多重因素的影响，长期看会逐步从无序竞争回归到有序竞争。未来行业核心竞争力源 于客户合作粘性、产品创新、海外拓展及细分领域突破。在此背景下，公司将专注于核心技术的研发、 产品线的布局完善、客户和市场的开拓，以确保在激烈的市场角逐中稳固自身竞争优势。 ...

证券日报网1月30日讯 ，昂瑞微在接受调研者提问时表示，公司射频前端芯片产品主要下游应用领域为 移动智能终端行业，并正在重点拓展智能汽车、物联网模块、智能穿戴领域。我国射频前端厂商市场占 有率仍相对较低，合计约20%（以金额计），在关键技术领域仍有很大的国产化替代空间。公司射频 SoC芯片下游应用领域主要为无线键鼠、智能家居、健康医疗、智慧物流等。公司正不断在一些具有广 阔市场前景的新兴应用领域取得突破。 （编辑 王雪儿） ...

证券日报网1月30日讯，昂瑞微在接受调研者提问时表示，公司产品战略聚焦射频前端，把握"模组 化"趋势，持续迭代L-PAMiD等高端模组。协同发展射频SoC，重点拓展智能零售、智慧物流、物联网 模块、智能寻物、健康医疗、车载出行等专业类应用场景，并加速出海进程。布局其他模拟芯片，形成 协同矩阵。前瞻性布局卫星通信、车载通信等增量市场，筑牢长期发展壁垒。 ...

Core Viewpoint - The company, Angruiwei, has successfully achieved mass production and shipment of satellite communication products that are compatible with Beidou, Tiantong, and low-orbit satellite communication systems for high-end mobile terminal clients [1] Group 1 - The company is advancing its research on future products, including sixth-generation mobile communication and highly integrated RF front-end chips for satellite communication that combine Tiantong and Beidou low-orbit systems [1] - The company is enhancing horizontal technical cooperation with industry chain enterprises and research institutions to maintain a forward-looking perspective [1]

证券日报网1月30日讯，昂瑞微在接受调研者提问时表示，未来，公司核心发展方向聚焦六方面：一是 强化研发投入，推动射频前端L-PAMiD等高集成度产品升级，深化射频SoC低功耗、高集成优势；二是 深耕移动智能终端市场，拓展车载通信、卫星通信等新兴应用场景；三是加强供应链安全与成本优势； 四是深化大客户战略合作，拓展优质客户群体，提升市场占有率；五是完善人才体系建设，支持业务的 持续发展；六是拓展海外市场，具备国际化竞争能力。 ...

证券日报网1月30日讯，昂瑞微在接受调研者提问时表示，公司各项业务正有序展开。客户方面，持续 深化与现有核心客户的合作粘性，同时积极拓展海内外优质新客户，推进跨领域客户布局，客户结构与 合作广度不断优化。产品方面，射频前端产品迭代与落地稳步推进；射频SoC产品聚焦细分赛道持续优 化；其他模拟芯片产品矩阵不断丰富。未来应用方面，在巩固现有应用场景的基础上，积极向新兴领域 延伸，同步跟进相关技术与市场趋势，为业务拓展储备新的增长空间。 ...

炒股就看金麒麟分析师研报，权威，专业，及时，全面，助您挖掘潜力主题机会！ 来源：上市之家 上市之家首发|1月28日，北京昂瑞微电子技术股份有限公司（证券代码：688790，简称"昂瑞微"）发布 2025年年度业绩预告，公司预计全年归属于母公司所有者的净利润亏损范围为1.1亿元至1.5亿元，扣除 非经常性损益后的净利润亏损1.3亿元至1.9亿元，较上年同期亏损幅度有所扩大。 免责声明：本号原创文章享有著作权，未经授权禁止转载。内容仅供学习分享，不构成投资建议，信息 和数据均来源于网络及公开信息，如有侵权，请联系处理。 责任编辑：杨红卜 炒股就看金麒麟分析师研报，权威，专业，及时，全面，助您挖掘潜力主题机会！ 来源：上市之家 数据显示，昂瑞微2024年同期归属于母公司所有者的净利润为亏损6470.92万元，扣非后净利润亏损1.1 亿元。2025年业绩预告显示，公司亏损幅度同比显著增加，主要受行业环境波动与公司战略调整双重因 素影响。 业绩巨亏背后，昂瑞微的股价也深度承压。公司于2025年12月16日于科创板上市，首日股价大幅高开， 最高达244元/股，不过，随后股价一路调整，最低曾达147.78元/股，区间最大跌 ...

公告指出，本期业绩变化的主要原因包括： 1、部分客户基于自身终端销售预期及供应链情况调整了采购节奏，阶段性放缓了提货节奏。公司为追求高质量发展，主动优化客户与订单结构，战略性 收缩了部分低毛利、竞争激烈的项目，对公司业绩造成一定影响。 昂瑞微于2026年1月27日发布《2025年年度业绩预告》，预计2025年年度实现归属于母公司所有者的净利润区间为亏损11000万元到15000万元；预计归属 于母公司所有者扣除非经常性损益后的净利润区间为亏损13000万元到19000万元。 2、部分产品受客户需求结构性变化、备货策略及材料涨价等因素影响导致其可变现净值低于账面价值，公司根据会计准则要求，对部分存货计提了减值 准备，亦对本期业绩产生影响。 为应对上述影响，公司表示将持续加大市场开拓力度，一方面积极拓宽与现有射频前端芯片品牌客户的合作品类，加速全系列产品导入，并加强工业、医 疗、汽车等新兴应用场景的开拓；另一方面持续加大海外市场拓展力度，以全面提高公司综合竞争力。 ...