内容概要：随着全球数字化转型与汽车电动智能化浪潮的推进，HDI 板市场需求激增。中国作为全球 最大的电子产品制造和消费市场之一，HDI板行业也得到快速发展。数据显示，2024年中国HDI板行业 市场规模为455.68亿元，同比上涨16.5%。预计未来在5G需求驱动下，HDI板企业将加速进入中高端市 场，行业市场规模将进一步扩大。到2025年中国HDI板行业市场规模达到509.08亿元，同比上涨 11.7%。 相关上市企业：大族数控（301200）、沪电股份（002463）、胜宏科技（300476）、东山精密 （002384）、生益电子（688183）、景旺电子（603228）、兴森科技（002436）、博敏电子 （603936）、深南电路（002916）、方正科技（600601）、崇达技术（002815）等。 相关企业：深圳市五株科技股份有限公司等。 关键词：HDI板行业产业链、HDI板行业市场规模、HDI板行业竞争格局、HDI板行业发展趋势 HDI板行业产业链 消费电子是HDI板最主要的应用领域之一，比如智能手机、平板电脑和笔记本电脑等产品。由于设备对 体积和重量的要求越来越高，HDI板能够有效地实现小型化 ...

就在上个月，胜宏科技（300476.SZ）和沪电股份（002463.SZ），两家市值过千亿的PCB龙头，分别披露了其融资扩产计划的进度。 先是9月17日，沪电股份在接受机构调研时透露了其新建人工智能芯片配套高端印制电路板扩产项目进展。据悉，该项目投资额高达43亿元，最初规划于 去年10月，并于今年6月下旬正式开工建设。公司预计，将在2026年下半年开始试产，并逐步提升产能。 随后在9月19日，经过近11个月的推进，胜宏科技新一轮定增最终落地。根据公告，此轮定增募集资金总额达19亿元，其中8.5亿元投向越南胜宏人工智能 HDI项目，5亿元投向泰国高多层印制线路板项目。 此外，据《科创板日报》统计，仅7月25日至今，便有8家PCB厂商公布新一轮的融资扩产计划，扩产投资项目大多用于提升HDI、HLC、SLP等高端PCB 产能和技术能力。 | 代码 | 公司 | 动作类型 | 金额 | 公告目期 | | --- | --- | --- | --- | --- | | 002938. SZ | 鹏鼎控股 | 扩产 | 80亿元 | 8月19日 | | 002384. SZ | 东山精密 | 扩产 | 10亿美元 | 7 ...

《科创板日报》10月5日讯 就在上个月，胜宏科技和沪电股份，两家市值过千亿的PCB龙头，分别披露了其融资扩产计划的进度。 先是9月17日，沪电股份在接受机构调研时透露了其新建人工智能芯片配套高端印制电路板扩产项目进展。据悉，该项目投资额高达43亿元，最初规划于去 年10月，并于今年6月下旬正式开工建设。公司预计，将在2026年下半年开始试产，并逐步提升产能。 随后在9月19日，经过近11个月的推进，胜宏科技新一轮定增最终落地。根据公告，此轮定增募集资金总额达19亿元，其中8.5亿元投向越南胜宏人工智能 HDI项目，5亿元投向泰国高多层印制线路板项目。 此外，据《科创板日报》统计，仅7月25日至今，便有8家PCB厂商公布新一轮的融资扩产计划，扩产投资项目大多用于提升HDI、HLC、SLP等高端PCB产 能和技术能力。 虽然未来PCB需求尚具有不确定性，但在AI叙事下，PCB产品具有沿着高端方向发展的需要是确定的。 | 代码 | 公司 | | 动作类 | | --- | --- | --- | --- | | 002938. SZ | 鹏鼎控股 | | 扩产 | | 002384. SZ | 东山精密 | | 扩 ...

备 受 行 业 瞩 目 的 "2025 电 子 半 导 体 产 业 创 新 发 展 大 会 暨 国 际 电 子 电 路 （ 大 湾 区 ） 展 览 会 （ 简 称 CPCA Show Plus）"，将于 2025年10月28日至30日 在 深圳国际会展中心（宝安） 盛大启幕！ 本届展会以 "创新驱动 芯耀未来" 为核心主题，既延续往届展会在行业内的专业口碑与国际影响 力，更在展示规模、内容深度与前沿技术呈现上实现全面升级，持续为电子电路与半导体产业链上 下游企业搭建高效链接、深度交流、协同合作的优质平台，助力产业共享 AI 时代发展机遇。展会 汇聚超 300 家知名展商，展品范围覆盖 PCB 制造全流程，从印制电路板、半导体、封装基板及陶 瓷基板，到电子电路供应链、智能制造等，为企业提供一站式采购与合作对接服务。 扫码即可注册参会 AI时代PCB产业 整合解决方案聚链湾区 当人工智能掀起技术革命，智能汽车、物联网加速融入生活，电子电路作为"电子工业重要基石"的 地位愈发凸显，已融入全球科技生态之中，并得到了前所未有的巨大发展。2025年上半年，中国 PCB制造业保持了强劲增长，营收规模约1830亿元人民币，同 ...

Financial Information Release - Aspocomp Group Plc will publish its financial statements for 2025 on February 25, 2026, at around 9:00 a.m. Finnish time [1] - The interim reports for 2026 will be published on April 29, July 29, and October 28, 2026, at around 8:00 a.m. and 9:00 a.m. Finnish time [1] Silent Period - Aspocomp's silent period will commence 30 days prior to the publication of its financial information [2] Annual Report - The Annual Report for 2025 will be published in week 11 at the latest, containing the Financial Statements, the report of the Board of Directors, and the Auditor's Report [3] Annual General Meeting - The Annual General Meeting for 2026 is scheduled for April 29, 2026, at 10:00 a.m. Finnish time, with a notification deadline for agenda items set for January 30, 2026 [4] Company Overview - Aspocomp specializes in PCB technology design, testing, and logistics services throughout the product lifecycle, ensuring cost-effectiveness and reliable deliveries through its own production and international partner network [5] - The company serves customers in telecommunications, automotive, industrial electronics, and semiconductor testing, with most net sales generated from exports [6] - Aspocomp is headquartered in Espoo, Finland, with a production facility located in Oulu, a major technology hub [6]

崇达技术（002815.SZ）9月26日在投资者互动平台表示，公司目前尚无直接的OCS（光电路交换）交换 机产品。我们的研发资源主要聚焦于服务器、通讯、航空航天用高多层PCB、以及先进封装基板等核心 技术的开发与量产。公司会持续关注行业技术动态，积极布局前沿领域。 （文章来源：每日经济新闻） 每经AI快讯，有投资者在投资者互动平台提问：请问董秘贵公司有在OCS方面的技术储备吗？ ...

Aspocomp Group Plc, Press Release, September 25, 2025, at 9:00 a.m.Aspocomp will organize a Capital Markets Day for investors, analysts, financial media and other industry representatives on November 4, 2025, from 9:00 a.m. to 12:00 p.m., at the Helsinki Fair Center, Conference Room, Rautatieläisenkatu 3, Helsinki, Finland.During the CMD, the company’s CEO Manu Skyttä and CFO Terhi Launis, among others, will present Aspocomp's views on the market situation, the company's strategy, investments and outlook. A ...

Summary of Conference Call Notes Industry Overview - The conference call discusses the Taiwan ABF (Ajinomoto Build-up Film) and BT (Bismaleimide Triazine) substrate industry, focusing on pricing trends and supply chain dynamics. Key Companies Mentioned - NYPCB (Nanya PCB) - Unimicron Technology - Kinsus - Ibiden Core Insights and Arguments 1. **Pricing Hike Expectations**: - A pricing hike for both ABF and BT substrates is anticipated in October, driven by a ~30% increase in T-glass related raw material costs, which accounts for ~5% of ABF and ~15% of BT substrate COGS [1][4] - Expected pricing increases: ABF substrate by 10%+ and BT substrate by 15%+ [1][4] 2. **Demand and Supply Dynamics**: - Solid demand for AI ABF substrates is expected, aligning with capacity expansion plans from Ibiden [2] - A supply shortage for ABF and BT substrates is projected due to lengthening raw material lead times and low inventory levels among suppliers [4][7] 3. **Earnings and Price Target Revisions**: - NYPCB's price target raised from NT$280 to NT$310, reflecting a positive outlook on revenue and gross margin improvements [3][14] - Unimicron's price target increased from NT$130 to NT$144, maintaining a Neutral rating due to high exposure to LTA business [3][20] 4. **Market Share and Competitive Position**: - NYPCB is expected to benefit significantly from the pricing uptrend, with a projected earnings CAGR of 175% from 2025 to 2027 [21][22] - Unimicron holds a 27% market share in ABF substrates but may lose market share in the AI server PCB segment due to production yield issues [24] 5. **Long-term Supply Constraints**: - T-glass supply is expected to remain tight until new capacity comes online in 1Q27, leading to sustained pricing pressure [11][12] - The shift in T-glass usage from BT to ABF substrates is anticipated due to higher demand from AI applications [8][9] Additional Important Points 1. **Raw Material Shortages**: - The shortage of T-glass could limit growth in BT applications and impact AI ASIC shipments, as T-glass is crucial for high-layer count ABF substrates [8][10] 2. **Earnings Estimates**: - NYPCB's 2025 earnings estimate revised down by 7% due to higher production costs, despite a 2% increase in revenue expectations [14] - Unimicron's earnings estimates for 2025-2027 revised up by 1-7% based on improved pricing outlook [19][20] 3. **Risks and Methodology**: - Key risks for NYPCB include slower-than-expected demand recovery and pricing upgrades [23] - Unimicron faces risks related to market share loss and demand recovery in the PC segment [25] 4. **Valuation Metrics**: - NYPCB's target price based on a 3.8x 2026E P/B, while Unimicron's target price based on a 2.1x blended 2026E P/B [22][25] This summary encapsulates the critical insights from the conference call, highlighting the dynamics of the ABF and BT substrate market, the performance outlook for key players, and the implications of raw material shortages on future growth.

崇达技术（002815.SZ）9月23日在投资者互动平台表示，公司PCB产品已应用于AI智能体领域，如AI服 务器等，并持续配合客户进行新一代产品开发。公司将继续深耕该领域，为投资者创造价值。 （文章来源：每日经济新闻） 每经AI快讯，有投资者在投资者互动平台提问：请问公司的产品有没应用到AI智能体领域？ ...

Core Viewpoint - The company has successfully begun small-scale deliveries of its 800G optical modules and is planning to advance the development of its 1.5T optical modules based on market demand and technological progress [2] Group 1 - The company confirmed that the 800G optical module PCB is currently in the small-scale delivery phase [2] - Future advancements for the 1.5T optical module will depend on market demand and technological developments [2]