上证报中国证券网讯（记者 何昕怡）2月24日，上交所官网显示，盛合晶微半导体有限公司（简称"盛合晶微"）科创板IPO已成功通过上交所上市审核委员 会审议，成为马年首家科创板过会企业。 值得关注的是，盛合晶微是一家红筹企业，此次拟募资48亿元冲刺科创板上市。 "在科创板改革落实落地持续推进的背景下，半导体、人工智能等领域的硬科技企业加速对接资本市场。盛合晶微在经过多轮审核问询后，快速推进至上会 阶段，这是资本市场制度包容性、适应性和竞争力、吸引力的有力体现。"业内人士向上海证券报记者表示。 据招股书显示，盛合晶微是集成电路晶圆级先进封测企业，起步于先进的12英寸中段硅片加工，并进一步提供晶圆级封装（WLP）和芯粒多芯片集成封装 等全流程的先进封测服务，致力于支持各类高性能芯片，尤其是图形处理器（GPU）、中央处理器（CPU）、人工智能芯片等，通过超越摩尔定律的异构集 成方式，实现高算力、高带宽、低功耗等的全面性能提升。 从现场问询来看，上交所上市委要求盛合晶微结合其2.5D业务的技术来源，三种技术路线的应用领域、发展趋势、市场空间，以及新客户开拓情况，说明与 主要客户的业务稳定性及业绩可持续性。 据审核结果，盛 ...

Nvidia’s stock has become a market object. It’s big enough to tug the major indexes, with a 7.8% weight in the S&P 500. When it moves, it drags money and sentiment with it, which helps explain why people talk about its quarterly reports as if they’re a major weather event.The company can clear consensus and still disappoint a crowd that paid for a bigger and louder fireworks show. Meet the expectations treadmill: A good quarter gets a shrug. A great quarter gets a shrug. Now, the market’s daring Nvidia to d ...

在上市委会议现场，上市委要求盛合晶微结合公司2.5D业务的技术来源，三种技术路线的应用领域、发 展趋势、市场空间，以及新客户开拓情况，说明与主要客户的业务稳定性及业绩可持续性。 北京商报讯（记者 马换换 李佳雪）2月24日晚间，上交所官网显示，盛合晶微半导体有限公司（以下简 称"盛合晶微"）科创板IPO当日上会获得通过，这也是马年首家IPO上会企业。 据了解，盛合晶微是一家集成电路晶圆级先进封测企业，起步于先进的12英寸中段硅片加工，并进一步 提供晶圆级封装（WLP）和芯粒多芯片集成封装等全流程的先进封测服务，致力于支持各类高性能芯 片，尤其是图形处理器（GPU）、中央处理器（CPU）、人工智能芯片等，通过超越摩尔定律（More than Moore）的异构集成方式，实现高算力、高带宽、低功耗等的全面性能提升。公司IPO于2025年10 月30日获得受理，当年11月14日进入问询阶段。本次冲击上市，盛合晶微拟募集资金48亿元。 ...

Group 1 - Leading foundries showed strong pre-market performance, with ASE Semiconductor up 5.6%, UMC up 4.2%, TSMC up 1.8%, and Tower Semiconductor up 1.5% [1] - ASML researchers announced a technological solution to enhance the power of core chip manufacturing equipment's light source, increasing EUV light source power from the current 600 watts to 1000 watts [1] - The higher power will enable the production of more chips per hour, thereby reducing the manufacturing cost per chip [1] Group 2 - By the end of 2030, each piece of equipment is expected to process approximately 330 silicon wafers per hour, a 50% increase from the current capacity of 220 wafers [1]

深圳平湖实验室（国家第三代半导体技术创新中心深圳综合平台）主任万玉喜表示，经过3年的建设， 综合平台已具备为高端功率半导体材料和器件科研和中试提供全方位的服务，包括新型产品的科研、国 产软件工具的研发、装备零部件的验证。即，为高端功率半导体制造业全链条提供支撑、服务。"十四 五"初期，新型科研机构在政策衔接上曾存在不畅，现在已逐步改善。他还提到，深圳还有一个突出优 势：第三代半导体等领域的头部应用企业，大多集中在深圳，本地应用场景丰富、客户资源集中，能为 技术创新和成果转化提供有力支撑。（深圳特区报） ...

Group 1 - The Social Security Administration (SSA) is centralizing the process of handling benefit claims and appointments, transitioning to a National Appointment Scheduling Calendar and National Workload Management starting March 7 [3][4]. - This centralization is a response to reduced staffing within the SSA, raising concerns that seniors may not receive the specialized assistance they need from local employees familiar with specific local and state rules [4]. - Potential challenges for seniors include difficulties in securing appointments, longer wait times for calls, and extended processing times for claims, which could delay benefit receipt [7]. Group 2 - Seniors are advised to prepare for the upcoming changes by planning appointments in advance and utilizing online tools, such as creating an account on the SSA's website, to facilitate the filing process [5]. - It is crucial for seniors to understand the financial implications of different claiming ages, as this can significantly affect their monthly benefits [8].

The new apple of Laffont's eye holds a sustainable competitive advantage within the artificial intelligence (AI) infrastructure arena.There's nothing more valuable on Wall Street than data. One week ago, on Feb. 17, institutional investors with at least $100 million in assets under management filed Form 13F with the Securities and Exchange Commission. A 13F offers investors a snapshot of the stocks Wall Street's smartest money managers purchased and sold in the latest quarter.Investors often pay close atten ...

Core Viewpoint - ChipMOS Technologies Inc. reported strong financial results for the fourth quarter and full year of 2025, driven by increased demand for high-value memory solutions, particularly in datacenter and AI-related applications [1]. Financial Performance - Revenue for Q4 2025 was NT$6,521.1 million (US$207.9 million), a 20.8% increase from NT$5,399.6 million (US$172.1 million) in Q4 2024 [1]. - Full year revenue for 2025 reached NT$23,932.9 million (US$762.9 million), up 5.5% from NT$22,695.9 million (US$723.5 million) in 2024 [1]. - Q4 2025 net earnings were NT$499.7 million (US$15.9 million), translating to NT$0.72 (US$0.02) per basic common share, compared to NT$232.2 million (US$7.4 million) and NT$0.32 (US$0.01) per basic common share in Q4 2024 [1]. - Net profit for the fiscal year 2025 was NT$495.1 million (US$15.8 million), down from NT$1,420.0 million (US$45.3 million) in 2024 [1]. Cash Flow and Financial Position - The company reported a net free cash inflow of NT$1,554.8 million (US$49.6 million) for the full year 2025 [1]. - Cash and cash equivalents stood at NT$14,858.9 million (US$473.7 million) as of December 31, 2025 [1]. Non-Operating Expenses - Q4 2025 net non-operating expenses were NT$23.8 million (US$0.8 million), a decline from net non-operating income of NT$154.6 million (US$4.9 million) in Q4 2024 [1]. - Full year net non-operating expenses for 2025 totaled NT$555.4 million (US$17.7 million), compared to net non-operating income of NT$373.1 million (US$11.9 million) in 2024 [1]. Market Position and Services - ChipMOS is recognized as an industry leader in outsourced semiconductor assembly and test services (OSAT), providing end-to-end solutions to various semiconductor companies globally [2].

格隆汇2月24日丨瑞芯微(603893.SH)在投资者互动平台表示，公司RK3588、RK182X等多款芯片适合个 人部署OpenClaw等AI Agent应用产品，当前已有基于公司RK3588并调用云端大模型的AI Agent应用解 决方案。同时，公司协处理器RK182X具备大算力、高带宽优势，支持各类智能终端设备在本地部署大 模型并快速获得端侧AI Agent能力，能够更好地满足用户数据隐私安全、低延时响应等需求，实现自主 操作和多任务处理。 ...

格隆汇2月24日丨香农芯创(300475.SZ)在互动平台表示，公司目前的产品线（包括自主品牌"海普存 储"及分销业务）主要聚焦于企业级服务器、数据中心等地面应用场景。公司暂未布局航天级存储芯片 的研发与认证，公司将继续聚焦于"分销+产品"一体两翼的核心业务格局的深化与拓展。 ...