Core Viewpoint - The "2025 Electronic Semiconductor Industry Innovation Development Conference and International Electronic Circuit (Greater Bay Area) Exhibition" (CPCA Show Plus) will take place from October 28 to 30, 2025, in Shenzhen, focusing on innovation-driven development in the semiconductor and electronic circuit industries [1]. Industry Growth and Trends - The PCB manufacturing industry in China experienced robust growth in the first half of 2025, with revenue reaching approximately 183 billion RMB, reflecting a year-on-year increase of over 10% driven by terminal demand and the expansion of emerging applications [4]. - The exhibition aims to leverage the advantages of the Greater Bay Area to stimulate the PCB industry's growth in the AI era by connecting upstream and downstream enterprises [4]. Exhibition Highlights - CPCA Show Plus 2025 will feature over 300 renowned exhibitors, showcasing a comprehensive range of products from PCB manufacturing processes to semiconductor and packaging substrates, providing a one-stop procurement and collaboration service [1][4]. - Key exhibitors include leading companies in the PCB manufacturing sector and those covering advanced materials, equipment, and chemicals, emphasizing a full industry chain approach [5]. Technological Innovations - The exhibition will present smart manufacturing solutions such as automated production lines, AI quality inspection systems, and digital twin factories, aimed at enhancing production efficiency and precision management in the electronic circuit and semiconductor industries [5]. - The event will also highlight sustainable development practices, showcasing green materials, energy-efficient production equipment, and clean production processes to support the industry's low-carbon transformation [5]. Networking and Collaboration - CPCA Show Plus 2025 is expected to attract over 45,000 professional attendees from global PCB application enterprises, research institutions, and buyers, facilitating supply-demand matching and technical exchanges [7]. - The exhibition will feature specialized zones for ceramic substrates, top PCB companies, and academic innovation, allowing attendees to focus on industry dynamics and trends [7]. International Promotion - The event has been promoted through various domestic and international media channels to enhance the global presence of China's electronic manufacturing industry, attracting notable companies from the application demand side [10]. Forums and Activities - A series of forums and activities will be held alongside the exhibition, including the 47th Sino-Japanese Electronic Circuit Autumn Conference, focusing on AI empowerment and industry breakthroughs [13]. - Specialized forums will address various topics, including low-altitude economy, commercial aerospace, and AI technology innovations, catering to diverse attendee interests [14]. Invitation to Industry Stakeholders - CPCA Show Plus 2025 serves as a platform for industry stakeholders to explore opportunities and drive upgrades in the semiconductor sector, inviting global enterprises, experts, and partners to participate [16].

Financial Information Release - Aspocomp Group Plc will publish its financial statements for 2025 on February 25, 2026, at around 9:00 a.m. Finnish time [1] - The interim reports for 2026 will be published on April 29, July 29, and October 28, 2026, at around 8:00 a.m. and 9:00 a.m. Finnish time [1] Silent Period - Aspocomp's silent period will commence 30 days prior to the publication of its financial information [2] Annual Report - The Annual Report for 2025 will be published in week 11 at the latest, containing the Financial Statements, the report of the Board of Directors, and the Auditor's Report [3] Annual General Meeting - The Annual General Meeting for 2026 is scheduled for April 29, 2026, at 10:00 a.m. Finnish time, with a notification deadline for agenda items set for January 30, 2026 [4] Company Overview - Aspocomp specializes in PCB technology design, testing, and logistics services throughout the product lifecycle, ensuring cost-effectiveness and reliable deliveries through its own production and international partner network [5] - The company serves customers in telecommunications, automotive, industrial electronics, and semiconductor testing, with most net sales generated from exports [6] - Aspocomp is headquartered in Espoo, Finland, with a production facility located in Oulu, a major technology hub [6]

Group 1 - The company currently does not have direct OCS (Optical Circuit Switching) switch products [2] - The company's R&D resources are primarily focused on the development and mass production of core technologies such as servers, communication, high-layer PCBs for aerospace, and advanced packaging substrates [2] - The company will continue to monitor industry technology trends and actively invest in cutting-edge fields [2]

Group 1 - Aspocomp Group Plc will hold a Capital Markets Day on November 4, 2025, in Helsinki, Finland, aimed at investors, analysts, and financial media [1][2] - The event will feature presentations from CEO Manu Skyttä and CFO Terhi Launis, discussing market conditions, company strategy, investments, and future outlook [2] - Participants are required to register by October 23, 2025, due to limited space, and the event will also be livestreamed [3][4] Group 2 - Aspocomp specializes in printed circuit board (PCB) technology, providing design, testing, and logistics services throughout the product lifecycle [5] - The company serves a global customer base, primarily in telecommunications, automotive, industrial electronics, and semiconductor testing sectors, with most net sales generated from exports [6] - Aspocomp is headquartered in Espoo, Finland, with a production facility located in Oulu, a key technology hub in the country [6]

Summary of Conference Call Notes Industry Overview - The conference call discusses the Taiwan ABF (Ajinomoto Build-up Film) and BT (Bismaleimide Triazine) substrate industry, focusing on pricing trends and supply chain dynamics. Key Companies Mentioned - NYPCB (Nanya PCB) - Unimicron Technology - Kinsus - Ibiden Core Insights and Arguments 1. **Pricing Hike Expectations**: - A pricing hike for both ABF and BT substrates is anticipated in October, driven by a ~30% increase in T-glass related raw material costs, which accounts for ~5% of ABF and ~15% of BT substrate COGS [1][4] - Expected pricing increases: ABF substrate by 10%+ and BT substrate by 15%+ [1][4] 2. **Demand and Supply Dynamics**: - Solid demand for AI ABF substrates is expected, aligning with capacity expansion plans from Ibiden [2] - A supply shortage for ABF and BT substrates is projected due to lengthening raw material lead times and low inventory levels among suppliers [4][7] 3. **Earnings and Price Target Revisions**: - NYPCB's price target raised from NT$280 to NT$310, reflecting a positive outlook on revenue and gross margin improvements [3][14] - Unimicron's price target increased from NT$130 to NT$144, maintaining a Neutral rating due to high exposure to LTA business [3][20] 4. **Market Share and Competitive Position**: - NYPCB is expected to benefit significantly from the pricing uptrend, with a projected earnings CAGR of 175% from 2025 to 2027 [21][22] - Unimicron holds a 27% market share in ABF substrates but may lose market share in the AI server PCB segment due to production yield issues [24] 5. **Long-term Supply Constraints**: - T-glass supply is expected to remain tight until new capacity comes online in 1Q27, leading to sustained pricing pressure [11][12] - The shift in T-glass usage from BT to ABF substrates is anticipated due to higher demand from AI applications [8][9] Additional Important Points 1. **Raw Material Shortages**: - The shortage of T-glass could limit growth in BT applications and impact AI ASIC shipments, as T-glass is crucial for high-layer count ABF substrates [8][10] 2. **Earnings Estimates**: - NYPCB's 2025 earnings estimate revised down by 7% due to higher production costs, despite a 2% increase in revenue expectations [14] - Unimicron's earnings estimates for 2025-2027 revised up by 1-7% based on improved pricing outlook [19][20] 3. **Risks and Methodology**: - Key risks for NYPCB include slower-than-expected demand recovery and pricing upgrades [23] - Unimicron faces risks related to market share loss and demand recovery in the PC segment [25] 4. **Valuation Metrics**: - NYPCB's target price based on a 3.8x 2026E P/B, while Unimicron's target price based on a 2.1x blended 2026E P/B [22][25] This summary encapsulates the critical insights from the conference call, highlighting the dynamics of the ABF and BT substrate market, the performance outlook for key players, and the implications of raw material shortages on future growth.

崇达技术（002815.SZ）9月23日在投资者互动平台表示，公司PCB产品已应用于AI智能体领域，如AI服 务器等，并持续配合客户进行新一代产品开发。公司将继续深耕该领域，为投资者创造价值。 （文章来源：每日经济新闻） 每经AI快讯，有投资者在投资者互动平台提问：请问公司的产品有没应用到AI智能体领域？ ...

Core Viewpoint - The company has successfully begun small-scale deliveries of its 800G optical modules and is planning to advance the development of its 1.5T optical modules based on market demand and technological progress [2] Group 1 - The company confirmed that the 800G optical module PCB is currently in the small-scale delivery phase [2] - Future advancements for the 1.5T optical module will depend on market demand and technological developments [2]

Core Insights - TTM Technologies, a leader in PCB manufacturing, is partnering with companies like Arista, RTX, and Jabil to develop AI infrastructure aimed at enhancing its market position and driving growth [1] Company Developments - The collaboration with Arista, RTX, and Jabil signifies TTM Technologies' strategic move to leverage AI technologies in its operations, which could lead to improved efficiency and innovation in PCB manufacturing [1] - TTM Technologies is focusing on breaking out in the competitive landscape by integrating advanced technologies, particularly in AI, to meet the evolving demands of the electronics industry [1] Industry Trends - The partnership reflects a broader trend in the electronics industry where companies are increasingly investing in AI and advanced technologies to stay competitive and meet customer needs [1] - The move towards AI infrastructure is indicative of the industry's shift towards automation and smart manufacturing processes, which are expected to enhance productivity and reduce costs [1]

Group 1 - The core point of the article is that Chongda Technology (002815) has confirmed that its 800G optical module PCB is currently in the small batch delivery stage [1]

Core Viewpoint - Chongda Technology (002815) has announced its collaboration with domestic GPU manufacturers, including Baidu, to deliver PCB products for the server sector in bulk [1] Company Summary - Chongda Technology is actively engaging in partnerships with domestic GPU manufacturers to enhance its product offerings in the server market [1]