Core Points - ACM Research, Inc. will participate in the 17th Annual CEO Investor Summit 2025 on October 7 in Phoenix, Arizona [1] - The presentation materials will be available on the company's website [2] - The CEO Investor Summit is held annually during the SEMICON West industry trade show, with this year's event taking place for the first time in downtown Phoenix [3] Event Details - The event will be held at The Arrogant Butcher restaurant, with an agenda that includes registration, a networking luncheon, CEO summit meeting sessions, and a cocktail reception [3] - The summit will feature 12 management teams from various companies, including ACM Research, Aehr Test Systems, and others [4] - Attendance is by invitation only for accredited investors and research analysts, with a registration deadline of September 26, 2025 [5] Company Overview - ACM Research develops, manufactures, and sells semiconductor process equipment, focusing on various processes such as cleaning, electroplating, and wafer-level packaging [7] - The company aims to provide customized, high-performance, and cost-effective solutions to improve productivity and product yield for semiconductor manufacturers [7]

This headline just crossing the Bloomberg terminal. Nvidia to buy $5 billion in an Intel stake as part of a new partnership. >> In this agreement, Nvidia is going to own less than a 5% stake, buying common stock at about a 6.5% discount to Wednesday's closing price.And this really is a question of how much the US is going to really underwrite Intel's effort to be a foundry and some sort of competitor to TSMC. >> Amarie on the ground in the UK. Amarie, I imagine this announcement is music to the ears of the ...

Core Insights - Ainos, Inc. has announced a strategic distribution partnership with Topco Scientific Co., Ltd., enhancing its AI Nose platform's commercialization prospects [1] - The collaboration is expected to expand Ainos' global reach across key industries, positioning the company for large-scale commercialization in 2026 [1] Company Overview - Ainos, Inc. is recognized as a leader in AI-powered scent detection technology [1] - The partnership with Topco is highlighted as a significant milestone for Ainos [1] Industry Impact - The collaboration with a leading global semiconductor solutions provider indicates a strengthening of Ainos' cross-industry ecosystem [1] - This strategic move is aimed at accelerating the path toward large-scale commercialization of the AI Nose platform [1]

Core Insights - Huawei has planned three series of Ascend chips: 950, 960, and 970 series [1] - The Ascend 950 series includes two chips: 950PR, which will be launched in Q1 2026, and 950DT, expected in Q4 2026 [1] - The Ascend 960 chip is set to be released in Q4 2027, while the Ascend 970 chip is anticipated for Q4 2028 [1] - Since the release of the Ascend 310 chip in 2018 and the Ascend 910 chip in 2019, Huawei has continuously invested in AI computing power research and innovation [1] - The company aims to establish a solid foundation for AI computing power in China and globally through the evolution of Ascend chips [1]

Core Viewpoint - Huawei has launched new supernode products, significantly enhancing computing power and interconnect bandwidth, positioning itself as a leader in the AI chip industry [6][7][8]. Group 1: Huawei's New Products - The Atlas 950 supernode, based on the Ascend 950DT chip, supports 8192 Ascend 950DT chips, achieving a total computing power of 8E FLOPS for FP8 and 16E FLOPS for FP4, with an interconnect bandwidth of 16PB/s [7]. - The Atlas 960 supernode, based on the Ascend 960 chip, can support up to 15488 cards, with a total computing power of 30E FLOPS for FP8 and 60E FLOPS for FP4, and an interconnect bandwidth of 34PB/s [8]. - The Atlas 950 supernode is set to launch in Q4 2026, while the Atlas 960 is expected in Q4 2027, both significantly outperforming competitors like NVIDIA's upcoming products [7][8]. Group 2: Market Demand for Optical Modules - The demand for optical modules is projected to increase, with estimates for 2026 indicating a need for 3000-3200 million units, driven by major companies like Microsoft and NVIDIA [12]. - The 800G optical module market is expected to exceed expectations, particularly due to Microsoft's procurement strategies [12]. - The ratio of GPUs to optical modules varies by company, with NVIDIA at 1:3-1:4.5 and Google at approximately 1:14, indicating a growing need for optical modules in the industry [17]. Group 3: Key Suppliers and Market Dynamics - Major suppliers for optical modules include companies like 旭创 (Acacia), 菲尼萨 (Finisar), and 新易盛 (NewEase), with varying market shares across different clients [18]. - For 2026, the optimistic demand for 800G and 1.6T optical modules could reach nearly 50 million units, highlighting a potential supply gap [16]. - The competitive landscape shows that 旭创 is a dominant supplier for Google, while 新易盛 holds significant shares with AWS [18].

记者丨倪雨晴李益文 编辑丨骆一帆 叶映橙 视频丨杨浩凯 9月18日，华为全联接大会（HC 2025）拉开帷幕，华为副董事长、轮值董事长徐直军在50分钟的演讲中，罕见地详细公开了华为的AI算力版图。 华为算力概念多股上涨，烽火通信直线涨停 受上述消息影响，华为算力概念午后上扬。截至收盘，烽火通信（600498.SH）涨停，兴图新科（688081.SH）涨超10%，星环科技（688031.SH）、信安 世纪（688201.SH）、大华股份（002236.SZ）涨超5%，神州数码（000034.SZ）、高新发展（000628.SZ）等个股跟涨。 （华为轮值董事长徐直军发表主题演讲，图源：华为） 围绕算力核心，徐直军首次完整公布了昇腾芯片未来三年的迭代路线：从2026年一季度即将推出的Ascend 950系列，到2027年的Ascend 960，再到2028年 的Ascend 970，几乎以"一年一代算力翻倍"的速度推进。 他详述了950系列在低精度数据格式、向量算力、互联带宽以及自研HBM等方面的突破，并明确芯片硬件持续演进、CANN编译器及Mind工具链全面开 源、openPangu基础大模型开放等四大承诺，以回 ...

Core Viewpoint - The article discusses advancements in lithography technology, particularly the development of "Beyond-EUV" (B-EUV) lithography, which utilizes a wavelength of 6.5nm to 6.7nm, potentially allowing for resolutions below 5nm, surpassing current EUV technology [2][3][18]. Summary by Sections Lithography Technology Evolution - The evolution of lithography has progressed from contact to projection methods, with current mainstream technology using extreme ultraviolet (EUV) light at a wavelength of 13.5nm [3][5]. - The need for higher resolution in lithography can be achieved by either increasing numerical aperture (NA) or shortening the wavelength [3]. Challenges of EUV and B-EUV - EUV technology faces challenges due to its high absorption rates by materials, necessitating advanced mirrors for effective light reflection [5][6]. - B-EUV technology is still in its infancy, with no industry-standard methods for generating the required 6.7nm wavelength radiation [6][19]. Innovations in Light Sources - Various companies are exploring new light sources for lithography, including the development of high-efficiency laser systems and compact, high-power sources [10][11][13]. - Inversion is working on Laser Wakefield Acceleration (LWFA) to create high-energy light sources, while xLight is developing free electron lasers (FEL) to enhance EUV power output significantly [13][16]. Breakthroughs in Photoresist Materials - Johns Hopkins University has made significant progress in photoresist materials, discovering that metals like zinc can effectively absorb B-EUV light and trigger chemical reactions for fine pattern etching [18][19]. - The development of a new technique called Chemical Liquid Deposition (CLD) allows for the creation of thin films that can be used in semiconductor manufacturing, highlighting the importance of matching materials with the appropriate wavelengths [19][20]. Future Prospects - The advancements in B-EUV technology and associated materials could lead to significant improvements in semiconductor manufacturing efficiency and cost reduction, although challenges remain before widespread adoption [20].

Core Viewpoint - Computing power is crucial for artificial intelligence and will continue to be a key factor for China's AI development, as stated by Huawei's rotating chairman Xu Zhijun [3]. Group 1: Huawei's Chip Development - Huawei plans to launch the Ascend 950PR chip in Q1 2026, the Ascend 950DT in Q4 2026, the Ascend 960 chip in Q4 2027, and the Ascend 970 chip in Q4 2028 [3]. - The company has introduced the Atlas 900 A3 SuperPoD, with over 300 units deployed, serving more than 20 customers, and will release the Atlas 950 SuperPoD in Q4 2026, supporting 8192 Ascend cards with a computing power of 8 EFLOPS FP8 / 16 EFLOPS FP4 [5]. Group 2: Supernode Infrastructure - Huawei is developing the Atlas 960 SuperPoD, expected to support 15488 Ascend cards with a computing power of 30 EFLOPS FP8 / 60 EFLOPS FP4, planned for Q4 2027 [7]. - The company announced the Atlas 950 SuperCluster and Atlas 960 SuperCluster, with computing power exceeding 500,000 cards and reaching one million cards, respectively [9]. Group 3: General Computing and Open Technology - Huawei revealed the roadmap for the Kunpeng chip, with the Kunpeng 950 chip set to launch in Q4 2026 and the Kunpeng 960 chip in Q1 2028 [9]. - The company introduced the TaiShan950 SuperPoD, the world's first general computing supernode, expected to launch in Q1 2026, which aims to replace various large and small machines as well as Exadata database integrated machines [9]. - Xu Zhijun announced that the supernode technology will be fully open, including the Lingqu 2.0 technology specifications, which encompass foundational, firmware, and operating system reference design specifications [9].

Core Viewpoint - The company has successfully developed 10 microwave MMIC products, including power amplifiers, low-noise amplifiers, and digitally controlled phase shifters, which are applicable in communication and radar scenarios [1] Group 1: Product Development - The company has completed performance verification for its microwave MMIC products [1] - Microwave components such as S-band and Ku-band TR components are currently in the research and development phase [1] - The company is actively developing new products in clock management circuits and buffers, demonstrating relevant technical capabilities [1] Group 2: Commercialization and Production - The company will strictly follow R&D progress, market demand, and industry certification requirements for large-scale production and commercialization [1]

格隆汇9月18日丨鼎信通讯(603421.SH)在投资者互动平台表示，公司芯片开发采用平头哥的CK802 32位 内核架构，平头哥与公司签订有全面技术授权协议。 ...