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英特尔豪赌下一代晶体管
半导体行业观察· 2025-12-18 01:02
Core Viewpoint - The collaboration between Intel and imec marks a significant step towards the practical application of two-dimensional field-effect transistors (2DFET) by demonstrating a process compatible with 300mm wafers, indicating progress in integrating two-dimensional materials into large-scale semiconductor manufacturing [1][2][3] Group 1: Technological Advancements - Intel and imec have developed a contact and gate stack integration scheme that is compatible with wafer fabrication, addressing the challenge of integrating transition metal dichalcogenides (TMDs) into the manufacturing process without damaging the sensitive channels [2] - The use of high-quality two-dimensional layers, combined with a multi-layer stack of AlOx, HfO₂, and SiO₂, allows for the formation of embedded top contacts that protect the underlying two-dimensional channels from contamination and physical damage [2] Group 2: Industry Implications - The work done by Intel and imec is not expected to lead to immediate product commercialization but is valuable in reducing risks associated with the development and eventual production of chips based on two-dimensional materials [3] - Intel's strategy positions two-dimensional materials as a future option to be evaluated before silicon reaches its physical limits, aiming to address manufacturing challenges early in the development process [3] Group 3: Long-term Vision - The announcement from Intel's foundry conveys two key messages: the ongoing commitment to long-term technology R&D that will be critical for the semiconductor industry in the coming decades, and the necessity for new transistor concepts to consider manufacturability even in the research phase [3]
英特尔安装首台High NA EUV光刻机
半导体行业观察· 2025-12-16 01:22
公众号记得加星标⭐️,第一时间看推送不会错过。 在英特尔看来,半导体创新始终是一项团队合作,最持久的突破源于从研发到量产的深度生态系统协 作。英特尔晶圆代工为其在这一进程中扮演的领导角色而感到自豪,并已确立了其在业界的地位,成 为唯一一家拥有本土领先逻辑芯片研发和制造能力的美国公司。 今天,英特尔分享两个不同项目的里程碑,这两个项目分别展示了公司推动行业研究和创新、降低先 进设备概念风险以及加快为客户创造价值的不同方式。 自信扩展:首台 TWINSCAN EXE:5200B 高数值孔径 EUV 安装 随着前沿工艺节点特征尺寸的不断缩小,高数值孔径(High NA)极紫外(EUV)光刻技术正迅速崛 起,成为人工智能时代极具吸引力的光刻技术。ASML 和 Intel Foundry 已证明,目前 最先进的光 刻扫描仪在技术上可行,能够提供更高的精度和生产效率,从而使高数值孔径 EUV 技术在未来的大 规模生产中占据优势。 今天,英特尔激动地宣布,英特尔和ASML已成功完成TWINSCAN EXE:5200B的"验收测试"。 这 款高数值孔径(High NA)极紫外光刻机在保持第一代EXE : 5000高分辨率的同 ...