近日，科睿唯安公布了2025年度"全球高被引科学家"名单。新加坡国立大学重庆研究院的王家功教授、康斯坦丁·诺沃肖洛夫教授与仇成伟教授入选！ 王家功教授 现为新加坡国立大学材料科学与工程系终身教授、系主任，新加坡国立大学重庆研究院院长和首席研究员，先后当选为新加坡国家工程院院士、新加坡科 学院院士、亚太材料科学院院士。 他在生物材料、纳米复合材料、铁电薄膜和设备、可持续能源纳米材料等领域均有深入研究，并在新型无机纳米材料、纳米复合材料和介孔材料的合成及 其在储能和医药领域的应用研究上取得了显著成果，连续6年入选科睿唯安"全球高被引科学家"，充分体现了其研究成果持续的权威性与国际影响力。 仇成伟教授 现为新加坡国立大学电子与计算机工程系院长讲席教授、新加坡国立大学重庆研究院首席研究员，是纳米光子学与电磁学领域的国际知名学者，先后当选 为新加坡工程院院士、东盟工程与技术科学院院士及美国光学学会会士、美国物理学会会士、中国光学学会外籍会士。 他在前沿光学与超构材料方面，成功设计出新型超构表面（Metasurfaces），实现了对光波的高精度操控，相关技术已应用于三维全息成像、动态涡旋光 束生成及高分辨率纳米打印等领域 ...

Market News - US stock indices collectively declined, with the Dow Jones down 0.52%, Nasdaq down 0.08%, and S&P 500 down 0.28%. Notable tech stocks had mixed performances, with Oracle up over 3% and Meta up over 2%, while Apple and Google fell over 1% [1] - Spot gold fell 1.6% to $3975.95 per ounce, while COMEX gold futures dropped 1.95% to $3991.10 per ounce. Spot silver reached a historical high of $51.24 per ounce before closing at $49.21, up 0.74%. COMEX silver futures fell 2.73% to $47.66 per ounce. International crude oil prices also declined, with WTI down 1.65% to $61.52 per barrel and Brent down 1.57% to $65.21 per barrel [2] Industry Insights - A research team from Fudan University has developed the world's first two-dimensional-silicon hybrid architecture flash memory, which could revolutionize traditional storage architectures and enhance data storage for AI applications. The prototype achieved a record speed of 400 picoseconds for non-volatile storage, addressing challenges posed by the physical limits of Moore's Law [3] - According to a recent SEMI report, global spending on 300mm wafer fab equipment is expected to reach $374 billion from 2026 to 2028, with spending surpassing $100 billion for the first time in 2025. The storage sector is projected to see a total equipment expenditure of $136 billion over the next three years, driven by limited capacity and unexpected demand [4][5] - The humanoid robot DR02, developed by Yunshen Technology, has achieved an IP66 rating for water and dust resistance, making it suitable for outdoor operations. The robot's design closely resembles that of an adult male, standing at 175 cm tall [6] - The humanoid robot industry is poised for significant growth, with 2025 expected to be a key year for market expansion. Major companies are focusing on upgrading component performance and reducing costs, which will likely lead to increased domestic production and sales of robots [6] Stock Movements - Huawang Technology announced that a shareholder plans to reduce their stake by up to 611,520 shares, representing 1.1% of the total share capital [7] - Mould Technology's controlling shareholder plans to reduce their stake by up to 918,020 shares, accounting for 1% of the total share capital [7] - WuXi AppTec plans to sell 30.3 million shares of WuXi AppTec Holdings, approximately 2.47% of the total share capital, for about HKD 2.346 billion [7]

Core Viewpoint - The Indian government has approved semiconductor projects that will produce over 24 billion chips annually, with more projects in the pipeline [2][3] Group 1: Government Initiatives - The Indian government has approved six semiconductor projects, including a wafer manufacturing plant by Tata Electronics and five packaging plants [2] - Tata's wafer plant is expected to produce 50,000 wafers per month, while the five packaging plants will collectively produce 24 billion chips annually [2] - A total of 760 billion rupees (approximately 9.1 billion USD) has been allocated to support the development of India's semiconductor ecosystem [3] Group 2: Long-term Vision - India aims to be a long-term player in the semiconductor industry, emphasizing that semiconductor business is not a short-term endeavor [2] - The government assures that policies will remain consistent to support the entire ecosystem's development [2] Group 3: Collaboration and Research - The Indian government is seeking support from German semiconductor companies to enhance manufacturing activities in India [3] - There are opportunities for collaboration in high-tech research, particularly in materials research and the development of two-dimensional materials like graphene [3] - Two-dimensional materials have the potential to produce chips that are more than ten times smaller than current silicon-based chips [3] Group 4: Global Supply Chain Positioning - India positions itself as a reliable participant in the global supply chain, with transparent policies [3] - The Indian Prime Minister has expressed the intention for India to contribute positively to global development in sectors such as semiconductors, artificial intelligence, and quantum computing [3]

Core Viewpoint - The article focuses on the latest advancements in semiconductor technology presented at the VLSI conference, highlighting innovations in chip manufacturing, including digital twins, advanced logic transistors, and future interconnects, as well as comparisons between Intel's 18A process and TSMC's technologies [1]. Group 1: FlipFET Design - Despite various restrictions, China continues to advance in semiconductor R&D, with Peking University's FlipFET design gaining significant attention for its novel patterning scheme that achieves PPA similar to CFET without the challenges of monolithic or sequential integration [2]. - The FlipFET technology involves a process where NMOS is formed on the front side and PMOS on the back side of the wafer, showcasing good performance for both types of transistors [8][10]. - The main drawback of FlipFET is its cost, as it requires multiple back-end processes and is more susceptible to wafer warping and alignment errors, potentially affecting yield [12]. Group 2: DRAM Developments - DRAM is at a pivotal point in its five-year roadmap with two key advancements: 4F2 and 3D technologies, with 4F2 expected to increase density by 30% compared to 6F2 without reducing minimum feature size [16][23]. - The 4F2 architecture necessitates vertical channel transistors to fit within the unit size, presenting manufacturing challenges due to high aspect ratios [24][31]. - 3D DRAM is being developed concurrently, with Chinese manufacturers showing strong motivation to innovate in this area due to its independence from advanced lithography technologies [36]. Group 3: Digital Twin Technology - Digital twin technology is becoming essential in semiconductor design and manufacturing, allowing for design exploration and optimization in a virtual environment before physical production [79]. - This technology spans atomic-level simulations to wafer-level optimizations, enhancing productivity and yield in semiconductor fabrication [80][87]. - The implementation of "unmanned" fabs is a future goal, aiming for automated maintenance and operation without human intervention, which poses challenges in standardizing processes across different equipment vendors [92]. Group 4: Intel's 18A Process - Intel's 18A process, set to enter mass production in late 2025, combines Gate-All-Around transistors with a PowerVia back power network, significantly reducing interconnect spacing and improving yield [74][78]. - The 18A process claims a 30% reduction in SRAM size compared to Intel's 3rd generation baseline, with performance improvements of approximately 15% at the same power consumption [76]. - The process also features a reduction in the number of front metal layers and an increase in back metal layers to support the new architecture, indicating a shift towards more efficient manufacturing [77].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自asu ，谢谢。 近60年来，全球巨头应用材料公司（Applied Materials）一直致力于开发不断改变微芯片制造方 式的技术。 他们的产品广泛应用于平板电视、智能手机和电动汽车等各类设备。应用材料已获得超过22,000 项专利，其20世纪80年代推出的Precision 5000芯片制造系统更被永久收藏于史密森学会。 富尔顿学院的教师获得了应用材料的研究资助，用于推动创新、促进产业与学术进步。目前，已有 多个旨在开发新材料、改进制造工艺的项目在进行中。 在ASU物质、传输与能源工程学院，Seth Ariel Tongay教授与该公司合作开展多项研究，探索二 维材料在先进半导体制造中的应用。这类材料的厚度可达原子级，有望提升电流传输效率，提高速 度与能效。 但这家美国最大的半导体设备制造商也在推进另一项事业：创新精神。 该 公 司 正 在 亚 利 桑 那 州 立 大 学 （ ASU ） 艾 拉 · 富 尔 顿 工 程 学 院 （ Ira A. Fulton Schools of Engineering）发起一系列投资项目，旨在加速科研发现、帮助研究 ...

如果您希望可以时常见面，欢迎标星收藏哦~ https://www.intellinews.com/china-creates-world-s-thinnest-chip-with-5931-transistors-378131/ 点这里加关注，锁定更多原创内容 来源 ：内容编译自 intellinews ，谢谢。 据《IEEE Spectrum》报道，中国研究人员研制出迄今为止最先进的二维材料微处理器，其内部集 成了5931个由二硫化钼制成的晶体管，厚度仅为三个原子。二硫化钼由两层硫层之间的钼层构 成，由于其原子级厚度和高效率，被视为硅的有力替代者。 这种新型微处理器可能对众多行业产生突破性的影响，并受到世界各地其他研究人员的密切关注。 这款名为 RV32-WUJI 的芯片基于开源 RISC-V 架构，能够执行标准的 32 位指令。它基于绝缘蓝 宝石基底，配备全新开发的单元库，包含 25 种逻辑门类型，能够执行"与"和"或"等基本计算功 能。与之前仅管理 156 个晶体管的二维电路相比，这一进展标志着一个重要的里程碑。 尽管 RV32-WUJI 的运行频率仅为 1 千赫兹，功耗仅为 0.43 毫瓦，但它展示了 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 2024年，AI引发的芯片需求全面爆发，半导体产业结构性转型持续演进。在这一年，台积电 再次交出了一份亮眼答卷：不仅巩固了其技术领先地位，还在产能、营收、客户结构与全球 战略布局方面全面开花，成为当前全球最具战略纵深的半导体企业。 透过其刚刚发布的2024年年报，我们可以更清晰地看到：在这场以AI为主引擎的产业变革 中，台积电正以技术为根基、制造为核心、生态为延伸，持续构筑属于自己的"护城河"。 AI爆发年，台积电"稳稳赢麻" 2024年，尽管全球经济仍充满不确定性，传统消费电子市场复苏缓慢，但AI相关芯片的需求却持 续强劲，推动晶圆代工行业走出低谷，重回成长轨道。台积电成为最大受益者之一。 年报显示，2024年台积电全年合并营收达900亿美元，同比增长30%；税后净利达365亿美元，同 比大幅增长35.9%。毛利率达到56.1%，营业利益率达45.7%，皆创历史新高。 作为全球晶圆代工产业的龙头，台积电已经在业内建立起不可动摇的地位。台积电在IDM 2.0产业 （包括了封装、测试和光罩制造等更多环节）中 占据34%的市场份额 ，较2023年的28%显著提 升，进一步 ...

Core Viewpoint - A team of 30 scientists from the Indian Institute of Science (IISc) has proposed the development of "angstrom-level" chips, significantly smaller than the current smallest chips, to enhance India's position in the semiconductor industry [1][2]. Group 1: Proposal Details - The proposal aims to develop chips using new semiconductor materials known as two-dimensional materials, which could reduce chip size to one-tenth of the current smallest chips produced globally [1]. - The current smallest chips are produced using 3-nanometer nodes by companies like Samsung and TSMC [1]. - The detailed project report (DPR) was initially submitted in April 2022 and revised for resubmission in October 2024, indicating ongoing governmental discussions [1][3]. Group 2: Government and Industry Response - The Indian Ministry of Electronics and Information Technology (MeitY) is positively inclined towards the project, exploring electronic applications for the proposed technology [2]. - India's semiconductor manufacturing heavily relies on foreign companies, making this project strategically significant for economic and national security [2]. - The largest semiconductor project in India, a collaboration between Tata Electronics and Taiwan's TSMC, has an investment of ₹910 billion and has received government approval for 50% funding support [2]. Group 3: Funding and Global Context - The IISc-led proposal requests ₹5 billion over five years for developing indigenous semiconductor technology, which is relatively modest compared to other global investments [2]. - Countries like Europe and South Korea have invested significantly in two-dimensional materials, with Europe exceeding $1 billion (approximately ₹83 billion) [2]. - The urgency for India to act is emphasized, as global tech companies are shifting focus towards two-dimensional semiconductors, and the window for India to execute this proposal may close soon [3].

如果您希望可以时常见面，欢迎标星收藏哦~ 印度电子和信息技术部（MeitY）的消息人士证实，该提案正在讨论中。 一位知情官员表示："印 度半导体技术与创新部（MeitY）对该项目持积极态度。首席科学顾问兼秘书长已就此举行会议。 MeitY正在探索可部署此类技术的电子应用。这是一项合作项目，每一步都需要尽职调查。" 印度目前在半导体制造方面严重依赖外国企业——这项技术从经济和国家安全角度来看都具有战略 意义。该国最大的半导体项目由塔塔电子与台湾力积电合作设立，投资额达9100亿卢比。该项目 已获得印度半导体计划的批准，并有资格获得政府50%的资金支持。相 比之下，印度理工学院（IISc）牵头的提案要求在五年内拨款50亿卢比，用于打造下一代半导体的 本土技术，但金额相对较低。该项目还包括初始融资阶段后的自主可持续发展路线图。 在全球范围内，二维材料引起了广泛关注。欧洲已投资超过10亿美元（约合830亿卢比），韩国投 资超过3亿卢比，中国和日本等国家也对基于二维材料的半导体研究进行了大规模但未公开的投 资。一位不愿透露姓名的官员表示："二维材料将成为未来异构系统的关键推动因素。 尽管全球发展势头强劲，但印度在这方面 ...