Core Viewpoint - The article emphasizes the critical role of thermal management materials in enhancing the performance and reliability of electronic devices, particularly in the context of increasing heat generation due to advancements in AI, 5G, and IoT technologies. The demand for effective thermal solutions is expected to grow significantly as electronic products become thinner, more integrated, and high-performing [4][13][24]. Group 1: Thermal Management Materials - Thermal management materials are essential for improving heat dissipation in electronic products, which directly affects their stability and reliability [4]. - The failure rate of electronic components increases exponentially with temperature, with a 50% reduction in system reliability for every 10°C rise in temperature [4][11]. - The market for thermal management technologies is projected to grow, with the global thermal management market expected to reach $26.1 billion by 2028, growing at a CAGR of 8.5% from $17.3 billion in 2023 [26][27]. Group 2: Product Classification - Thermal management materials can be classified into active (forced cooling) and passive (natural cooling) types, with active systems like fans and liquid cooling being common in consumer electronics [9][10]. - Passive cooling methods rely on conduction and radiation, suitable for compact devices like smartphones and tablets [9][10]. Group 3: Mainstream Products - Key products in the thermal management space include artificial synthetic graphite heat dissipation films, heat pipes, and vapor chambers, which are becoming mainstream solutions in the market [12][14][19]. - The rise of synthetic graphite materials began in 2011 with their application in smartphones, expanding to tablets, laptops, automotive electronics, and communication base stations [19]. Group 4: Market Trends and Growth Drivers - The demand for thermal management solutions is driven by the increasing heat generated by AI and 5G technologies, particularly in consumer electronics like smartphones and personal computers [35][40]. - The AI upgrade in smartphones is expected to significantly increase thermal management needs, with AI-enabled devices requiring more efficient cooling solutions due to higher power consumption [35][40]. - The global smartphone shipment is projected to reach 1.371 billion units by 2027, representing a growth of approximately 13.3% from 2022, further driving the demand for thermal management materials [38]. Group 5: Industry Challenges and Opportunities - The industry faces challenges such as the need for innovative thermal solutions to manage increased heat generation from high-performance components [54]. - Opportunities exist in the customization and diversification of thermal management solutions to meet the complex demands of modern electronic devices [54][56]. - The trend towards localized sourcing in response to global trade dynamics is expected to benefit domestic thermal management product manufacturers [54].

本次发行股票拟在创业板市场上市，创业板公司具有创新投入大、新旧产 业融合存在不确定性、尚处于成长期、经营风险高、业绩不稳定、退市风险高 等特点，投资者面临较大的市场风险。投资者应充分了解创业板的投资风险及 本公司所披露的风险因素，审慎作出投资决定。 广东思泉新材料股份有限公司 （东莞市企石镇江边村金磊工业园区 A 栋 1-2 楼） 首次公开发行股票并在创业板上市 招股说明书 保荐人（主承销商） （深圳市福田区福田街道金田路 2026 号能源大厦南塔楼 10-19 层） 广东思泉新材料股份有限公司 招股说明书 声明及承诺 中国证监会、深圳证券交易所对本次发行所作的任何决定或意见，均不表明 其对发行人注册申请文件及所披露信息的真实性、准确性、完整性作出保证，也 不表明其对发行人的盈利能力、投资价值或者对投资者的收益作出实质性判断或 保证。任何与之相反的声明均属虚假不实陈述。 根据《证券法》的规定，股票依法发行后，发行人经营与收益的变化，由发 行人自行负责；投资者自主判断发行人的投资价值，自主作出投资决策，自行承 担股票依法发行后因发行人经营与收益变化或者股票价格变动引致的投资风险。 1-1-1 广东思泉新材料股份 ...

广东思泉新材料股份有限公司 首次公开发行股票并在创业板上市发行公告 保荐人（主承销商）：长城证券股份有限公司 特别提示 广东思泉新材料股份有限公司（以下简称"思泉新材"、"发行人"或"公司"） 根据中国证券监督管理委员会（以下简称"中国证监会"）颁布的《证券发行与 承销管理办法》（证监会令[第 208 号]）（以下简称"《管理办法》"）、《首次公开发 行股票注册管理办法》（证监会令[第 205 号]），深圳证券交易所（以下简称"深 交所"）颁布的《深圳证券交易所首次公开发行证券发行与承销业务实施细则》 （深证上[2023]100 号）（以下简称"《业务实施细则》"）、《深圳市场首次公开发行 股票网上发行实施细则》（深证上[2018]279 号）（以下简称"《网上发行实施细 则》"）、《深圳市场首次公开发行股票网下发行实施细则（2023 年修订）》（深证上 [2023]110 号）（以下简称"《网下发行实施细则》"），中国证券业协会（以下简称 "证券业协会"）颁布的《首次公开发行证券承销业务规则》（中证协发[2023]18 号）、 《首次公开发行证券网下投资者管理规则》（中证协发[2023]19 号）（以下简称 ...