进入2026年，热管理技术已不再局限于传统的"散热"，它成为了制约算力突破、能源效率与产品可靠性的核心命脉。随着AI大规模算力集群、智能汽车、半 导体、深空/低空飞行器等前沿领域的跨越式发展，行业对热管理方案的精准度与能效比提出了近乎苛刻的要求。基于此， " 洞见热管理2026 " 系列活动 将以" 上海+深圳 " 双展联动模式 ，搭建起贯穿产、学、研、用的全产业链对接平台，旨在汇聚全球智慧，攻克温控难题，定义新一代热力平衡标准。 01 6月10日 上海站：未来产业之基！聚焦液冷板、芯片与功率器件热管理 2026未来产业新材料博览会 （FINE2026） 将于 6月10-12日 在上海新国际博览中心隆重举行。上海站规模宏大展出面积达 50,000平方米（N1-N5） ， 300+场 战略与前沿科技报告， 预计吸引超过10万+名专业观众。 同期 N2馆 特设 "2026热管理液冷板产业展"与"AI芯片及功率器件热管理展区" ，聚焦高热流密度场景下的工程难题。（ 可点击下方图片超链接查看详细介绍 ） | FINE 2026 × Ind iTher M | 中国未来产业崛起引领全球新材料创新发展 | | | | - ...

Core Insights - The article emphasizes that thermal management technology is crucial for breakthroughs in computing power, energy efficiency, and product reliability, especially in advanced fields like AI, smart vehicles, and semiconductors [2] - The "洞见热管理2026" series aims to create a comprehensive platform for industry, academia, research, and application to address thermal control challenges and establish new thermal balance standards [2] Group 1: Event Overview - The 2026 Future Industry New Materials Expo (FINE2026) will take place from June 10-12 at the Shanghai New International Expo Center, featuring an exhibition area of 50,000 square meters and over 300 strategic and cutting-edge technology reports, expecting to attract more than 100,000 professional visitors [3] - The Shanghai event will focus on high heat flux density scenarios, showcasing liquid cooling plates, AI chips, and power device thermal management [6] Group 2: Shanghai Event Highlights - The Shanghai exhibition will emphasize the integration of the Yangtze River Delta industrial cluster, particularly in data centers, new energy vehicles, semiconductors, energy storage systems, and large power facilities [8] - Key topics will include battery thermal management under high-power fast charging, automotive-grade power module cooling, and industrial-grade heat exchange solutions aimed at carbon neutrality [8] Group 3: Shenzhen Event Overview - The seventh Thermal Management Industry Conference and Expo (iTherM2026) will be held in Shenzhen in December 2026, focusing on the flexibility of technology and rapid market response [9] - The Shenzhen event will address the thermal challenges of miniaturized and integrated electronic devices and chips, providing a one-stop value connection platform for the thermal management industry [9] Group 4: Shenzhen Event Highlights - The Shenzhen exhibition will spotlight AI computing servers, smartphones, wearable devices, and low-altitude economy sectors, showcasing immersion cooling technology and new thermal interface materials for compact spaces [11] - The event aims to facilitate the commercialization of innovative technologies and provide a platform for startups and tech giants to showcase their ideas [11] Group 5: Previous Event Recap - The 2025 Shenzhen Thermal Management Expo featured numerous companies presenting new materials, processes, and system-level cooling solutions, attracting significant engagement from engineers and professionals [12] - The event successfully transitioned from "display" to "connection," highlighting the importance of industry collaboration and the rapid generation of cooperation intentions [16]

进入2026年，热管理技术已不再局限于传统的"散热"，它成为了制约算力突破、能源效率与产品可靠性的核心命脉。随着AI大规模算力集群、智能汽车、半 导体、深空/低空飞行器等前沿领域的跨越式发展，行业对热管理方案的精准度与能效比提出了近乎苛刻的要求。基于此， " 洞见热管理2026 " 系列活动 将以" 上海+深圳 " 双展联动模式 ，搭建起贯穿产、学、研、用的全产业链对接平台，旨在汇聚全球智慧，攻克温控难题，定义新一代热力平衡标准。 01 6月10日 上海站：未来产业之基！聚焦液冷板、芯片与功率器件热管理 2026未来产业新材料博览会 （FINE2026） 将于 6月10-12日 在上海新国际博览中心隆重举行。上海站规模宏大展出面积达 50,000平方米（N1-N5） ， 300+场 战略与前沿科技报告， 预计吸引超过10万+名专业观众。 同期 N2馆 特设 "2026热管理液冷板产业展"与"AI芯片及功率器件热管理展区" ，聚焦高热流密度场景下的工程难题。（ 可点击下方图片超链接查看详细介绍 ） | FINE 2026 × Ind iTher M | 中国未来产业崛起引领全球新材料创新发展 | | | | - ...

Group 1 - QYResearch is recognized for its authoritative industry analysis and customized reports, widely cited by numerous domestic and international enterprises, securities firms, and media [2] - The global laser communication terminal market is projected to surge to $2.948 billion by 2031, with a compound annual growth rate (CAGR) of 45.0% from 2025 to 2031 [5] - The global hot runner market report indicates that Hengdao Technology's market share was only 2.07% in 2022, ranking sixth in the industry, which contradicts other public information [8] Group 2 - The near-space travel market in China is expected to reach $894 million by 2032, with a CAGR of 13.6% from 2026 to 2032 [10] - The USB bridge chip market report shows that Qinheng Microelectronics is ranked ninth globally and first domestically in sales revenue for 2024 [12] - The global multi-fingered dexterous robot hand market is forecasted to exceed $5 billion by 2030, with a CAGR of 64.6% from 2024 to 2030 [15] Group 3 - The global repair equipment market is expected to grow from $3.7 billion in 2024 to $8.49 billion by 2030, with a CAGR of 13.8% [17] - The mild hyperbaric oxygen chamber market is projected to reach $321.83 million by 2030, with a CAGR of 14.88% from 2024 to 2030 [20] - The medical low-value consumables market is expected to grow at a CAGR of 8.3% from 2024 to 2031, driven by an aging population and rising chronic disease rates [22] Group 4 - The low-temperature dairy products market is anticipated to exceed 70 billion yuan by 2025, with QYResearch highlighting Junlebao's strategic positioning in this sector [25] - The global drone market is projected to grow significantly, with consumer drones contributing approximately 35% of market revenue in 2024 [28] - The semiconductor metrology and inspection market is expected to reach $27.76 billion by 2030, with a CAGR of 8.1% from 2024 to 2030 [29] Group 5 - The gallium arsenide solar cell market is expected to see significant growth, with over 95% of space equipment powered by these cells [31][43] - The wireless charging chip market is projected to rank first domestically and among the top three globally in 2023 and 2024 [44] - The global algae oil DHA market is expected to grow from $604 million in 2024 to $1.377 billion by 2031, with a CAGR of 12.7% [48]

证券日报网1月23日讯，德邦科技在接受调研者提问时表示，公司导热界面材料目前已经成为公司重要 的支柱业务之一，在收入、利润方面均有较大的贡献。公司导热界面材料主要由深圳德邦界面、苏州泰 吉诺两个子公司负责，两个子公司在产品应用定位上略有区别。深圳德邦界面产品广泛应用于消费电 子、汽车电子、存储、通讯、新能源等领域，并在汽车电子、存储等高附加值领域持续突破；泰吉诺产 品主要应用于服务器领域，同时也应用于消费电子、汽车电子、通讯等领域。 ...

Core Viewpoint - The company, Zhongshi Technology, forecasts a significant increase in net profit for 2025, driven by strong performance in the consumer electronics sector and successful collaborations with major clients in North America [1]. Group 1: Financial Performance - The company expects a net profit attributable to shareholders of 330 million to 370 million yuan for 2025, representing a year-on-year growth of 63.86% to 83.73% [1]. - In the first three quarters of 2025, Zhongshi Technology reported revenue of 1.298 billion yuan, an increase of 18.45% year-on-year, and a net profit of 252 million yuan, up 90.59% year-on-year [2]. Group 2: Market Opportunities - The company is capitalizing on the traditional peak season in the consumer electronics industry, benefiting from the launch of new products by major clients in North America, which has led to increased shipments of thermal materials and components [1][2]. - Zhongshi Technology is actively expanding into emerging fields such as AI terminal devices and AI infrastructure, resulting in rapid revenue growth for high-efficiency thermal modules and core thermal components [2]. Group 3: Product Development and Innovation - The company maintains a leading position in artificial synthetic graphite materials within the consumer electronics sector, enhancing its market share in die-cut components [3]. - Zhongshi Technology is accelerating the research and mass production of various high-performance liquid-absorbing core materials to establish technical barriers and achieve differentiated competition [3]. Group 4: Capacity Expansion - The company has a high capacity utilization rate and is investing in new production lines for high thermal conductivity graphite products, thermal interface materials, heat pipes, and thermal modules, primarily for emerging consumer electronics and digital infrastructure [3]. - The company is focusing on liquid cooling solutions as a significant new business expansion direction, increasing resource investment in product development, customer acquisition, and capacity construction [3].

Group 1 - The company will hold its first extraordinary general meeting of shareholders on February 4, 2026, at 14:30 in Yantai, Shandong Province [2][5] - The voting will be conducted through both on-site and online methods, utilizing the Shanghai Stock Exchange's voting system [3][5] - Shareholders must register for the meeting by January 30, 2026, and provide necessary identification documents [13][14] Group 2 - The company announced a change in its fundraising project from a semiconductor packaging materials project to a semiconductor materials R&D and production base in South China, with a total investment of 230.4954 million yuan [20][21] - The new project will utilize 62.3699 million yuan of the remaining funds from the original project, with the excess to be covered by the subsidiary's own funds [20][21] - The new project aims to enhance production efficiency and support the company's long-term growth strategy, with an expected production capacity of 450 tons annually after completion [25][32] Group 3 - The company has received approval from its board for the project change, which does not involve related transactions or constitute a major asset restructuring [21][41] - The project is expected to be completed within two years, with production commencing thereafter [20][25] - The company emphasizes that the change will not adversely affect its normal operations or shareholder interests [41][45]

Core Viewpoint - Suzhou Tianmai (301626) has clarified its main product categories and applications in response to investor inquiries, highlighting its focus on thermal management solutions [1] Product Categories - The company’s primary products are divided into three major categories: heat dissipation devices, thermal materials, and thermal modules [1] - Key products include temperature equalization plates, thermal interface materials, heat pipes, thermal modules, and graphite thermal films [1] Application Scenarios - The temperature equalization plates are primarily used in various fields such as smartphones, laptops, communication servers, automotive electronics, communication base stations, projectors, and drones [1]

Core Viewpoint - Suzhou Tianmai (301626.SZ) has categorized its main products into three major categories: heat dissipation devices, thermal materials, and heat dissipation modules [1] Product Categories - The core products include temperature equalization plates, thermal interface materials, heat pipes, heat dissipation modules, and graphite heat dissipation films [1] - The temperature equalization plates are primarily used in various applications such as smartphones, laptops, communication servers, automotive electronics, communication base stations, projectors, and drones [1]

Core Viewpoint - Shenzhen Hongfucheng New Materials Co., Ltd. has entered the inquiry stage for its IPO on the ChiNext board, aiming to raise approximately 1.22 billion yuan for various projects and working capital [1] Group 1: Company Overview - Hongfucheng is a national-level specialized and innovative "little giant" enterprise focused on the research and industrialization of advanced electronic functional materials and devices, including thermal management, electromagnetic shielding, and wave-absorbing materials [1] - The company's main products consist of thermal interface materials, electromagnetic shielding, and wave-absorbing materials [1] Group 2: IPO Details - The IPO application was accepted on December 26, 2025, and is currently in the inquiry phase [1] - The funds raised from the IPO will be allocated to the construction of an advanced electronic functional materials base, a research and development center, marketing service network, headquarters construction, and to supplement working capital and technology reserve funds [1]