这种转变是渐进式的，而非革命性的。开发者们一步一步地寻找解决方案，克服遇到的障碍，逐步 推进。就像温水煮青蛙的故事一样，我们会逐渐适应每一次变化，以至于只有当我们回顾过去，对 比现在和过去，才能真正意识到累积变化的巨大影响。 如果您希望可以时常见面，欢迎标星收藏哦~ 几十年来，电子器件通常采用两级路由结构来管理集成电路中产生的或终止的信号。近年来，路由 层数增加到了五级。虽然这大大提高了电子设备的结构灵活性，但也带来了更大的复杂性，并增加 了完成项目所需的决策数量。 起点 就本文而言，布线"结构"或"平台"被定义为互连的所在位置。历史上，这两种平台分别是集成电路 (IC) 本身的金属布线和印刷电路板 (PCB) 上的金属布线。它们都提供多层布线，以最大限度地提 高连接性，同时兼顾增加布线层的成本。这里必须谨慎使用"层"和"级"这两个术语，因为 IC 和 PCB 是两个级别的互连，每个级别都可以包含多个布线层。 直到最近，芯片和PCB这两个层级之间的差异还足够大，可以分别讨论。芯片设计人员负责构建芯 片内部的布线，而PCB设计人员则负责构建连接集成电路与其他电路板组件的布线。 在这些层级以及所有其他层级上，线间 ...

Core Viewpoint - The article discusses the evolution of interconnect complexity in semiconductor design, highlighting the transition from traditional two-level routing structures to more complex five-level systems, which enhance flexibility but also increase design challenges and costs [1][25]. Group 1: Evolution of Interconnect Structures - Historically, interconnect structures in integrated circuits (IC) and printed circuit boards (PCB) have been limited to two levels, but recent advancements have expanded this to five levels, significantly increasing complexity and decision-making requirements [1][25]. - The distinction between chip-level and PCB-level design has been significant, with chip designers focusing on internal wiring and PCB designers managing connections to other components [3][25]. Group 2: Challenges in Chip Design - Three key trends are challenging traditional interconnect solutions: the importance of signal transmission lines, increased power levels leading to heat dissipation issues, and higher chip integration levels that exacerbate power density challenges [4][5]. - As chip sizes increase, the number of required I/O connections also rises, necessitating new packaging solutions like flip-chip packaging, which connects chips directly to substrate rather than through lead frames [6][7]. Group 3: Advanced Packaging Techniques - 3D stacking of chips using Through-Silicon Vias (TSV) allows for vertical signal transmission but complicates heat dissipation due to limited pathways for heat escape [9][11]. - The introduction of intermediary layers in 2.5D integration technology allows for more compact designs and improved signal routing, with the potential for multiple layers to enhance performance [13][14]. Group 4: Design and Verification Complexity - The design and verification process for five-layer interconnect systems is significantly more complex than in the past, requiring integrated efforts from chip and packaging design teams [17][21]. - Early-stage verification now includes structural material analysis, layout planning, and thermal simulations, expanding beyond traditional functional verification [20][21]. Group 5: Power Delivery and Signal Integrity - The increase in interconnect layers facilitates finer power delivery and signal integrity solutions, allowing voltage regulation to occur closer to the chip and improving overall performance [23][24]. - The integration of decoupling capacitors within the packaging can buffer voltage fluctuations, enhancing signal quality and performance [23][24]. Group 6: Conclusion on Industry Trends - The shift to a five-layer interconnect structure represents a gradual evolution rather than a revolutionary change, reflecting years of incremental improvements in semiconductor design [25][26]. - This complexity in interconnect design will influence future chip development decisions, emphasizing the importance of architecture-level considerations [26].