最近几年来，中介层（Interposer）一词频繁的出现在大众的视线当中。中介层负责承载 GPU、 存储等核心芯片并实现互联，原本并不起眼。但如今，无论是材料公司、设备公司，还是台积 电、英伟达这样的巨头，都把目光聚焦到中介层。 公众号记得加星标⭐️，第一时间看推送不会错过。 一边是 Resonac（瑞萨）牵头的 JOINT3 联盟，集结27家全球材料、设备、EDA 巨头，瞄准面 板级有机中介层；另一边，是英伟达掀起的SiC中介层风潮，台系厂商纷纷加码，试图突破功耗 与散热的极限。这两条脉络，折射出一个事实：中介层已从"幕后配角"，成为产业链上下游争夺 的焦点。 什么是interposer？ 近年来，随着摩尔定律趋缓，单颗芯片继续微缩的难度和成本不断攀升，行业开始转向异构集成：把 逻辑芯片、存储芯片、I/O 模块甚至模拟芯片组合在一起，形成一个系统级芯片（SiP）。而要让这 些"芯粒"（Chiplet）可靠互连，就必须依靠一个具备超高布线密度和电气性能的平台——这正是 Interposer 的价值所在。 Interposer（中介层） 是一种位于芯片（逻辑/存储）与封装基板（Substrate）之间的中间层结 ...

Core Viewpoint - Resonac has established an alliance named JOINT3, consisting of nearly 30 global companies, to develop advanced chip packaging technologies to meet the growing demand for artificial intelligence [2][3] Group 1: Alliance Formation - The JOINT3 alliance includes 27 companies, such as material manufacturers, equipment manufacturers, and chip designers, aiming to collaboratively develop materials, equipment, and design tools for chip packaging [2] - The alliance provides a practical platform for stakeholders to create and manufacture materials and technologies required for intermediary layers used in large panel manufacturing [2][3] Group 2: Importance of Intermediary Layers - Intermediary layers are critical components in chip packaging, facilitating communication between multiple chips integrated into a single module [2] - The demand for intermediary layers is expected to rise due to the increasing need for advanced packaging methods that can integrate more chips, as traditional methods of reducing transistor sizes become more challenging and costly [3] Group 3: Research and Development Initiatives - Resonac plans to establish a research and development center in Ibaraki Prefecture, northern Tokyo, which will house a prototype production line expected to be operational next year [3] - The five-year project is projected to cost 26 billion yen (approximately 174 million USD), funded and operated by participating companies [3] Group 4: Industry Trends - The rapid development of technologies such as generative artificial intelligence and autonomous driving is increasing the complexity of semiconductor technology requirements [3] - The current era is seen as a time for cross-company and cross-national collaboration to address technological challenges in the semiconductor industry [3]

Core Viewpoint - United Microelectronics Corporation (UMC) is making significant strides in advanced packaging technology, securing a major contract with Qualcomm and developing its own high-end interposer, which has been validated by Qualcomm, indicating a countdown to mass production [1][2]. Group 1: Advanced Packaging Developments - UMC's collaboration with Qualcomm focuses on advanced packaging for high-performance computing applications, particularly in AI PCs, automotive, and AI server markets, with initial production expected in Q1 2026 [1][2]. - The first batch of interposers with a capacitance of 1500nF/mm² has passed Qualcomm's electrical testing, showcasing UMC's capability in advanced packaging [1][2]. - UMC's advanced packaging technology, including 2.5D and 3D packaging, relies heavily on interposer capacitors, which are crucial for connecting stacked or side-by-side chips [2]. Group 2: Competitive Positioning - UMC's entry into advanced packaging allows it to differentiate itself from competitors in the mature process wafer foundry market, particularly against the backdrop of low-cost competition from the "red supply chain" [2]. - The partnership with Qualcomm not only involves orders but also includes Qualcomm purchasing equipment to be placed in UMC's facilities, indicating a deep and trusting collaboration [2]. Group 3: Process Technology Advancements - UMC is advancing its wafer foundry business by developing high-voltage process technologies, including a 14nm FinFET embedded high-voltage process platform, and is exploring collaboration with Intel to extend its process capabilities from 12nm to 6nm [3][4]. - UMC invested NT$15.6 billion in R&D last year, focusing on process technologies required for 5G communications, AI, IoT, and automotive electronics, with progress in special processes and 3D IC advanced packaging [3]. Group 4: Performance Enhancements - The 12nm FinFET process technology platform offers significant improvements over the 14nm technology, achieving a 10% performance increase and a 20% reduction in power consumption, while also reducing chip area by over 10% [4]. - UMC's advancements in process technology enhance its cost competitiveness and position in the semiconductor market [4].