Analog Devices (ADI) 2025 Conference September 04, 2025 10:50 AM ET Company ParticipantsRichard Puccio - EVP & CFOConference Call ParticipantsChristopher Danely - MD & Senior Semiconductor Equity Research AnalystChristopher DanelyI'm gonna turn up the lights. Okay. Great. Is this on? Thanks, everyone.Chris Dainley, your friendly neighborhood semiconductor analyst here at Citi. It's our distinct pleasure next to have up ADI Analog Devices. We have Rich Pucio, the CFO. ADI is one of our favorite companies, an ...

Core Viewpoint - The company, Jingfang Technology, is experiencing a significant recovery in its performance, driven by growth in its packaging business and expanding applications in automotive intelligence, robotics, and AI glasses [1][3]. Group 1: Financial Performance - In 2023, the company achieved a revenue of 1.13 billion yuan, representing a year-on-year increase of 23.72%, and a net profit attributable to shareholders of 253 million yuan, up 68.4% [1]. - In the first quarter of 2024, the net profit attributable to shareholders reached 65 million yuan, marking a year-on-year growth of 32.73% [1]. - The revenue from chip packaging and testing increased by approximately 30% due to the growth in orders and shipments in the automotive CIS sector [1]. Group 2: Business Expansion and Innovation - The company is focusing on expanding its MEMS and FILTER applications beyond CIS, aiming for commercial mass production [1][3]. - The company is actively developing new products in the automotive intelligent projection field and enhancing its optical device capabilities through its optical centers in the Netherlands and Suzhou [2]. - The company is positioned as a leader in wafer-level silicon through-hole packaging technology for automotive camera chips, benefiting from the rapid development of automotive intelligence and autonomous driving technologies [1][3]. Group 3: Market and Global Strategy - The company is adjusting its investment structure for overseas subsidiaries and projects to build an international financing platform, leveraging its Singapore subsidiary [4]. - The construction of a production base in Penang, Malaysia, is underway to better meet overseas customer demands and promote process innovation [4]. - The company is advancing its participation in national key research projects, specifically in the MEMS sensor chip advanced packaging testing platform [3].