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听众注册抢票!中兴微、环旭电子、天成先进、沛顿、AT&S、英特神斯、华大九天、KLA等领衔共探AI时代先进封装!
半导体芯闻· 2025-08-08 10:54
Core Viewpoint - The 9th China System-Level Packaging Conference (SiP China 2025) focuses on advanced packaging, Chiplet technology, and heterogeneous integration in the context of AI, highlighting the need for innovation in packaging solutions to meet the growing demands of AI computing power [2][28]. Group 1: Conference Overview - SiP China 2025 will take place from August 26-28, 2025, at the Shenzhen Convention Center [2]. - The main theme is "Intelligent Gathering of Chip Energy, Heterogeneous Interconnection - Innovation in Advanced Packaging and Chiplet Ecosystem in the AI Era" [2]. Group 2: Key Sessions and Topics - The main forum will cover macro trends and ecosystem building, featuring discussions on AI opportunities and challenges in advanced packaging [5][8]. - Notable speakers include industry leaders from companies like ASE, AT&S, and Siemens, discussing topics such as the trends in fan-out packaging and the integration of advanced packaging technologies [8][10][11]. Group 3: Technical Forums - Technical forums will focus on design innovation and application implementation, with sessions on testing and reliability solutions for micro-systems [15][18]. - Discussions will also include AI-driven Chiplet advanced packaging and the role of advanced packaging substrates in high-performance computing and AI applications [20][22]. Group 4: Participation and Sponsorship - The conference will feature participation from leading semiconductor companies and experts in AI chip design, emphasizing the importance of collaboration in advancing packaging technologies [28]. - Major sponsors include companies like DuPont, Ansys, and Heraeus, indicating strong industry support for the event [23][25].