来源：洞察IPO 上交所 ShangHai 深交所 ShenZhen 11月18日-11月24日，上交所科创板有1家公司上市；深交所创业板有1家公司上市。 数据来源：公开信息；图表制作：洞察IPO 1.恒坤新材：致力于集成电路领域关键材料的研发与产业化应用，是中国境内少数具备 12 英寸集成电路晶圆制造关键材料研发和量产能力的创新企业之 一，主要从事光刻材料和前驱体材料等产品的研发、生产和销售。上市首日股价收涨310.61%，截至11月24日收报50.54元/股，较发行价14.99元/股涨 237.16%，总市值约227亿元。 数据来源：公开信息；图表制作：洞察IPO 1.南网数字：主要从事为电力能源等行业客户提供数字化建设综合解决方案。上市首日股价收涨224.78%，截至11月24日收报20.51元/股，较发行价5.69元/ 股涨260.46%，总市值约652亿元。 通过上市委员会审议会议 11月18日-11月24日，上交所科创板有2家公司过会；深交所无公司过会。 数据来源：公开信息；图表制作：洞察IPO 1.振石股份：一家主要从事清洁能源领域纤维增强材料研发、生产及销售的企业。公司自成立以来，围绕清洁能源 ...

资料显示，厦门恒坤新材料科技股份有限公司位于福建省厦门市海沧区海沧大道567号厦门中心E座， 成立日期2004年12月10日，上市日期2025年11月18日，公司主营业务涉及光刻材料和前驱体材料的研 发、生产和销售。主营业务收入构成为：自产光刻材料74.50%，自产前驱体材料10.36%，引进前驱体 材料3.62%，引进其他3.47%，引进光刻材料3.33%，引进特气2.61%，其他(补充)2.10%。 截至11月18日，恒坤新材股东户数3.77万，较上期增加94110.00%；人均流通股1333股，较上期减少 99.85%。2025年1月-9月，恒坤新材实现营业收入4.86亿元，同比增长24.11%；归母净利润7390.67万 元，同比增长5.50%。 责任编辑：小浪快报 11月21日，恒坤新材跌11.47%，成交额12.50亿元。两融数据显示，当日恒坤新材获融资买入额8655.11 万元，融资偿还9394.52万元，融资净买入-739.41万元。截至11月21日，恒坤新材融资融券余额合计 1.44亿元。 融资方面，恒坤新材当日融资买入8655.11万元。当前融资余额1.44亿元，占流通市值的5.57%。 ...

Group 1 - The core viewpoint of the news is that Hengkun New Materials experienced a decline in stock price and significant changes in financing activities on November 20, with a net financing buy of -55.43 million yuan [1] - On November 20, Hengkun New Materials' stock dropped by 3.05%, with a trading volume of 1.454 billion yuan [1] - The financing buy amount for Hengkun New Materials on the same day was 89.62 million yuan, while the financing repayment was 145 million yuan, leading to a total financing balance of 1.52 billion yuan, which represents 5.19% of the circulating market value [1] Group 2 - As of November 18, the number of shareholders for Hengkun New Materials reached 37,700, an increase of 94,110% compared to the previous period [2] - The average circulating shares per person decreased to 1,333 shares, down by 99.85% from the previous period [2] - For the period from January to September 2025, Hengkun New Materials reported a revenue of 486 million yuan, reflecting a year-on-year growth of 24.11%, and a net profit attributable to shareholders of 73.91 million yuan, which is a 5.50% increase year-on-year [2]

Core Viewpoint - The article highlights the successful IPO of Hengkun New Materials Technology Co., Ltd. on the Shanghai Stock Exchange's Sci-Tech Innovation Board, emphasizing its significant stock price increase and its role in the domestic semiconductor industry [2][4]. Group 1: Company Overview - Hengkun New Materials was established in 2004 and focuses on the research and industrial application of key materials in the integrated circuit field [4]. - The company has developed into one of the few innovative enterprises in China capable of researching and mass-producing key materials for 12-inch integrated circuit wafer manufacturing [4]. Group 2: Financial Performance - The company plans to publicly issue 67.39794 million shares at a price of 14.99 yuan per share, raising a total of approximately 1.0067 billion yuan [4]. - The sales revenue from self-produced products over the past three years was 124 million yuan, 191 million yuan, and 344 million yuan, reflecting a compound annual growth rate of 66.89% [4]. Group 3: Product Development - Hengkun New Materials has achieved mass production of various photolithography materials and precursor materials, including SOC, BARC, KrF photoresist, and TEOS [5]. - The company is continuously developing new products, with over a hundred products in research, validation, and supply processes, including ArF photoresist and silicon-based precursor materials [5]. Group 4: Market Position - The company has successfully replaced foreign products in the domestic market, breaking the monopoly of foreign key materials for 12-inch integrated circuits [5].

Core Insights - C Hengkun (688727) experienced a significant increase of 310.61% on its first trading day, with a turnover rate of 81.36% and a transaction volume of 2.27 billion yuan [2] - The stock attracted a net inflow of 899 million yuan from major funds on its debut, with large orders contributing 645 million yuan and big orders adding 255 million yuan [3] Company Overview - The company specializes in the research, production, and sales of photolithography materials and precursor materials [3] Financing and Trading Details - On its first trading day, the stock had a financing purchase amount of 157 million yuan, accounting for 6.93% of the total trading volume, with a latest financing balance of 139 million yuan, representing 4.50% of the circulating market value [2][3] - The stock's first-day financing balance was 139.14 million yuan, with no short selling balance recorded [3]

Core Viewpoint - Xiamen Hengkang New Materials Technology Co., Ltd. ("Hengkang New Materials") officially listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board, marking a significant milestone for the company and the Xiamen region in the A-share market [1][6]. Company Overview - Established in 2004 and headquartered in Xiamen, Hengkang New Materials focuses on the research, production, and sales of key materials for integrated circuit manufacturing, specifically photoresist materials and precursors [2]. - The company is one of the few in China capable of developing and mass-producing key materials for 12-inch integrated circuit wafer manufacturing [2]. Financial Performance - Hengkang New Materials reported revenues of 322 million yuan, 368 million yuan, 548 million yuan, and 294 million yuan for the years 2022, 2023, 2024, and the first half of 2025, respectively [2]. - The sales revenue from self-produced products was 124 million yuan, 191 million yuan, 344 million yuan, and 250 million yuan for the same periods, with a compound annual growth rate of 66.89% from 2022 to 2024 [2]. Market Position and Growth - The company’s stock opened at 58 yuan per share, a 286.92% increase from the issue price of 14.99 yuan, and closed at 61.55 yuan, representing a 310.61% increase, with a total market capitalization of 27.6 billion yuan [1]. - Hengkang New Materials has achieved significant milestones in the domestic integrated circuit materials market, with a projected sales scale of approximately 300 million yuan for self-produced photoresist materials in 2024 [12]. Industry Context - The domestic integrated circuit industry has been rapidly developing, with some key materials gradually achieving domestic application, although the overall level of localization remains low [11]. - In the 12-inch integrated circuit sector, the localization rates for i-Line photoresist and SOC are around 10%, while BARC and KrF photoresists are at 1-2%, and ArF photoresist localization is below 1% [11]. Future Outlook - The chairman of Hengkang New Materials emphasized the company's commitment to focusing on "bottleneck" technology breakthroughs in new materials and increasing R&D investment [4]. - The company aims to leverage the opportunities presented by the Sci-Tech Innovation Board to enhance its growth trajectory and contribute to the self-sufficiency of the semiconductor industry [4][6].

Core Viewpoint - Hengkun New Materials has successfully listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board, with a significant increase in stock price, reflecting strong market interest in its semiconductor materials business [2][3]. Company Overview - Hengkun New Materials, established in December 2004, focuses on the research, production, and sales of key materials for integrated circuits, including photolithography and precursor materials [4][5]. - The company has achieved a cumulative sales volume of over 55,000 gallons of self-produced photolithography materials [20][25]. Financial Performance - The company reported revenues of approximately 300 million yuan in the first half of 2025, with self-produced products accounting for over 86% of total revenue [8][16]. - Revenue from self-produced products has shown a consistent upward trend, with sales figures of 1.24 billion yuan, 1.91 billion yuan, 3.44 billion yuan, and 2.50 billion yuan over the past three years [16][18]. Market Position - In the 12-inch integrated circuit sector, Hengkun New Materials ranks among the top domestic manufacturers for self-produced photolithography materials, with its SOC and BARC sales leading the domestic market in 2023 [7][13]. - The company has established a strong customer base, including several leading domestic 12-inch integrated circuit wafer manufacturers, effectively replacing foreign products [7][31]. Product Development - Hengkun New Materials has developed a range of photolithography materials, including SOC, BARC, KrF, and i-Line photolithography resins, which have all achieved mass production [5][20]. - The company is also expanding its production capacity for KrF/ArF photolithography materials and TEOS precursor materials, with planned investments of approximately 100 million yuan [8][25]. Customer Base - The top five customers account for over 95% of Hengkun New Materials' sales, with significant contributions from major domestic wafer manufacturers [31][32]. - The company has maintained a strong relationship with its primary customer, with sales to this client growing rapidly, offsetting any impacts from competitors [31][32]. R&D and Innovation - Hengkun New Materials has invested significantly in R&D, with a focus on developing advanced materials for the semiconductor industry, resulting in over 100 patented technologies [18][28]. - The company has successfully transitioned from importing materials to producing its own, achieving comparable quality to international standards [42].

如果您希望可以时常见面，欢迎标星收藏哦~ 来 源 ： 内容来自 上海证券报·中国证券网 ，谢谢 。 今天，厦门恒坤新材料科技股份有限公司（正式在上海证券交易所科创板上市交易，为厦门半导体 产业再添上市新军。上市首日收盘，公司大涨310%，市值直逼300亿。 恒坤新材成立于2004年，总部位于厦门市海沧区，专注于集成电路制造过程的两大关键材料—— 光刻材料和前驱体材料的研发、生产和销售，是中国境内少数具备12英寸集成电路晶圆制造关键 材料研发和量产能力的创新企业之一。 从2004年成立，到2014年确立如今的产品路径，从引进国外产品到自产营收不断增长，恒坤新材 创新性地走出了一条"引进、消化、吸收、再创新"的发展路径，公司客户涵盖多家中国境内领先的 12英寸集成电路晶圆厂，已实现境外同类产品替代。 本次IPO，恒坤新材拟募集资金10.07亿元，主要用于"集成电路前驱体二期项目"和"集成电路用先 进材料项目"的建设，帮助公司进一步扩大产能、提升技术水平，满足不断增长的市场需要。公司 力争成为具有核心竞争力，国内领先、国际先进的集成电路关键材料本土企业。 从引进到领跑 恒坤新材成立于2004年，设立之初主要从事光电 ...

Core Viewpoint - The successful IPO of Hengkun New Materials, founded by Yi Rongkun, marks a significant milestone in the development of the integrated circuit industry in Xiamen and China, showcasing a remarkable transformation from OEM to a key player in semiconductor materials [2][3]. Group 1: Company Background and Development - Yi Rongkun, a 54-year-old entrepreneur from Fujian, founded Hengkun in 1996, initially focusing on OEM production for companies like Panasonic and Sharp [3]. - In 2004, the company shifted its focus to the research and manufacturing of optoelectronic films and window lens products, eventually rebranding as Hengkun New Materials [3][5]. - The pivotal moment came in 2017 when Hengkun secured an order from Intel's Dalian factory, allowing it to enter the integrated circuit wafer manufacturing supply chain [5]. Group 2: Business Focus and Product Development - Hengkun New Materials specializes in key materials for integrated circuits, including photolithography materials and precursors, which have been historically dominated by foreign companies [5][8]. - The company has successfully developed and mass-produced various photolithography materials, including SOC, BARC, KrF, and i-Line photoresists, with advanced ArF immersion photoresists entering small-scale sales [9]. - The revenue from self-produced products has significantly increased, rising from 38.94% in 2022 to 86.68% in the first half of 2025, indicating a strong improvement in business structure and product competitiveness [10]. Group 3: Financial Performance - The company's revenue grew from 322 million yuan in 2022 to an expected 548 million yuan in 2024, with net profits consistently around 100 million yuan [10][12]. - As of June 30, 2025, total assets reached approximately 293.75 million yuan, with a debt-to-asset ratio of 47.18% [11]. Group 4: Industry Context and Capital Support - Hengkun's growth is supported by local capital, with multiple rounds of financing from Xiamen-based investment institutions, reflecting strong market confidence in the company [15][18]. - The integrated circuit industry in Xiamen has evolved from a 50 billion yuan output in 2014 to an expected 400 billion yuan by 2024, establishing a complete supply chain encompassing design, manufacturing, packaging, testing, and materials [18][20]. - The local government has implemented innovative funding models to attract investment, further enhancing the development of the semiconductor industry in Xiamen [20].

厦门恒坤新材料科技股份有限公司 在上交所科创板上市 股票简称"恒坤新材" 内容来源：海西晨报 厦门再次迎来一家A股上市公司！ 今天（18日） 恒坤新材以58元开盘 大涨286.92% 据了解，恒坤新材成立于2004年，总部位于厦门海沧区。 招股书显示，恒坤新材致力于集成电路领域关键材料的研发与产业化应用，是境内少数具备12 英寸集成电路晶圆制造关键材料研发和量产能力的创新企业之一，主要从事光刻材料和前驱体材料等产品的研发、生产和销售。 业绩方面，2022年至2024年，恒坤新材实现营业收入分别为3.22亿元、3.68亿元、5.48亿元；分别实现净利润1.01亿元、0.90亿元、0.97亿元。2025年上半 年，公司实现营业收入2.94亿元，同比增长23.74%，净利润4158.45万元。 此次IPO，恒坤新材拟募集10.07亿元，专项投入"集成电路前驱体二期项目"与"集成电路用先进材料项目"。项目落地后，将重点推进前驱体、KrF、ArF等 集成电路关键材料的研发与产业化，既有助于公司完善产品线布局、满足客户国产化需求，更能显著提升相关材料的国产化替代水平，为高端集成电路领 域供应链安全筑牢保障。 截至目前 厦 ...