Core Viewpoint - The article discusses the development and trends in the semiconductor packaging industry, particularly focusing on the plastic packaging machines, highlighting the growth potential in the Chinese market and the shift towards advanced packaging technologies. Group 1: Semiconductor Packaging Process - The semiconductor production process includes wafer manufacturing, testing, packaging, and testing, with packaging being crucial for electrical and signal connections as well as physical protection of integrated circuits [1] - The encapsulation process involves injecting packaging materials into molds to protect semiconductor chips, which is essential due to environmental conditions that could lead to chip failure [1] Group 2: Industry Development Overview - China is actively promoting the integrated circuit industry as a strategic pillar, with a focus on high-quality development and self-sufficiency in manufacturing processes, equipment, and materials [4] - The domestic integrated circuit market is experiencing steady growth, supported by strong internal demand and a clear trend towards domestic substitution, despite global economic fluctuations [4] Group 3: Characteristics of the Semiconductor Packaging Machine Industry - The trend towards high reliability in packaging machines is becoming critical, especially for automotive and industrial-grade chips, where performance metrics like temperature control and operational consistency are essential [6] - Advanced packaging technologies are driving the need for equipment upgrades, with T-Molding and C-Molding market shares expected to diverge [7][8] Group 4: Automation and Localization - The introduction of automation and intelligence in packaging machines enhances efficiency and consistency, reducing reliance on manual labor [9] - The demand for domestic equipment is increasing as local semiconductor companies expand their production capacities, with several emerging firms gaining market share [9] Group 5: Market Size and Forecast - The global semiconductor packaging machine market is projected to reach USD 406 million in 2024, with a compound annual growth rate (CAGR) of 6.59% expected until 2031 [11] - The Chinese market is anticipated to grow from USD 179 million in 2024 to USD 275 million by 2031, representing approximately 44% of the global market [11] Group 6: Market Share and Key Players - Major players in the international market include Towa, Besi, ASMPT, and Sanan Optoelectronics, with the top five companies holding about 80.79% of the market share [15] - In the Chinese market, the leading companies also include Towa, Besi, ASMPT, and Sanan Optoelectronics, with the top five accounting for approximately 77.24% of the market [15] Group 7: Policy Support - The Chinese government has implemented various policies to support the semiconductor industry, including tax incentives for companies involved in integrated circuit design, equipment, materials, packaging, and testing [16][17][18]

内容概况：作为半导体封装环节的核心设备，塑封机的技术升级与产业布局深刻影响着中国半导体产业 链的自主化进程。2025年1-4月，中国半导体塑封机进口金额为3144.82万美元，同比增长29.46%；出口 金额为1605.21万美元，同比下降28.05%。进口增长方面，一是国内先进封装产能扩张，尤其是第三代 半导体（SiC、GaN）封装线建设，对日本东和半导体、荷兰ASMPT等企业的超高压塑封机需求激增。 二是高端设备国产替代率不足，500MPa级超高压成型机、激光辅助成型设备等仍依赖进口，单台设备 价格超50万美元，推高进口总额。出口下降则反映全球市场压力。一方面，东南亚、印度等新兴市场本 土封装厂崛起，以价格优势挤压中国设备出口；另一方面，美国《芯片与科学法案》限制中国设备进入 高端市场，叠加欧盟碳关税（CBAM）政策，导致出口成本上升。此外，国产设备在稳定性、精度 （±1μm以下）等指标上仍落后于国际巨头，难以满足台积电、三星等大客户要求。 相关上市企业：耐科装备（688419）、三佳科技（600520）、长电科技（600584） 相关企业：衡所华威电子有限公司、北京科化新材料科技有限公司、宁波博威合金材 ...