证券日报网讯 12月31日，凯格精机在互动平台回答投资者提问时表示，公司的封装设备主要应用于半 导体及LED封装环节的固晶工序，固晶设备是一种将裸芯片从晶圆转移至载具基板/引线框架上并实现 芯片的固定或粘合的自动化设备，可应用于LED照明及显示器件、半导体芯片封装环节。半导体领域的 固晶设备可适用于QFN、DFN、SMA、SOD、卷式SIM、共晶工艺（车规级贴装、光通讯贴装、COB 大功率）等产品应用。 （编辑 袁冠琳） ...

Group 1: Company Overview and Core Competencies - The company emphasizes "excellence in quality as the starting point of value and dignity, and meeting customer needs as the source of innovation and development" [3] - The company has established a research and development center focusing on common technology, with seven major technical modules including software engineering and mechanical engineering [3] - The company is recognized as a national high-tech enterprise and has achieved significant technological capabilities in solder paste printing equipment, surpassing international competitors [3] Group 2: Revenue Growth Factors - The company's revenue growth is primarily attributed to an increase in acceptance amounts for solder paste printing equipment [3] - Key factors driving demand in the electronic manufacturing industry include: - Expansion of AI investment, leading to strong growth in the AI server market [3] - Recovery in consumer electronics demand, with a 2.6% year-on-year increase in global smartphone shipments and a 9.4% increase in PC shipments in Q3 2025 [3] - Increased penetration of electric vehicles, driving demand for SMT equipment [4] Group 3: Market Position and Future Outlook - The company sees potential for increased market share in solder paste printing equipment, which is critical in PCB and electronic component applications [4] - The company has established a global marketing network and technical support system, with products sold in over 50 countries [4] - Future plans include expanding overseas market efforts to contribute to overall performance [4] Group 4: Product Applications - The company's solder paste printing and dispensing equipment are widely used in electronic manufacturing, particularly in the assembly of PCBs and electronic components [5] - Solder paste printing is a core process in SMT and COB technologies, essential for the electrical connection of components [5] - Dispensing equipment is crucial for ensuring the quality and longevity of electronic products through protective applications [5]

Core Viewpoint - The company, Kaige Precision Machinery (301338.SZ), is recognized as a national high-tech enterprise and has received several prestigious titles, indicating its strong position in the manufacturing sector [1] Group 1: Company Achievements - The company has been awarded the title of "National Manufacturing Single Champion Enterprise" and "Specialized and Innovative 'Little Giant' Enterprise," showcasing its excellence in specific manufacturing areas [1] - The technology capabilities of the company's solder paste printing equipment have reached or surpassed those of top international manufacturers [1] Group 2: Product Competitiveness - In the field of die bonding equipment, the company has demonstrated significant competitive advantages in efficiency and stability, aligning with the trend of chip miniaturization [1] - The company's dispensing equipment has seen continuous improvement in market competitiveness due to its customer resource advantages and ongoing technological advancements [1] Group 3: Innovation and Development - In the flexible automation equipment sector, the company has developed an 800G optical module automation assembly line, which has gained recognition from globally renowned clients [1] - Building on this success, the company has introduced a new product line for 1.6T optical module automation assembly, targeting higher specifications [1] - The company is committed to a research and development strategy that emphasizes a "shared technology platform + multiple products + multiple fields," aiming to transition from being a single "champion" to multiple "champions" in various sectors [1]

Core Viewpoint - The company, Kaige Precision Machinery (301338.SZ), is recognized as a national high-tech enterprise and has received multiple honors, including "National Manufacturing Single Champion Enterprise" and "Specialized and Innovative 'Little Giant' Enterprise" [1] Group 1: Technology and Product Development - The company's solder paste printing equipment technology has reached or surpassed the level of top international manufacturers [1] - In the field of die bonding equipment, the company has demonstrated significant competitive advantages in efficiency and stability, aligning with the trend of chip miniaturization [1] - The company's dispensing equipment has seen continuous improvement in market competitiveness through ongoing technological accumulation and product iteration, leveraging its customer resource advantages [1] Group 2: Automation and Market Recognition - In the flexible automation equipment sector, the company's 800G optical module automation assembly line has gained recognition from globally renowned clients [1] - Building on this success, the company has launched a new product line for the 1.6T optical module automation assembly, targeting higher specifications [1] Group 3: Strategic Vision - The company is committed to implementing a "shared technology platform + multiple products + multiple fields" research and development layout, aiming to transition from being a single "single champion" to multiple "single champions" [1]

Core Viewpoint - The company Zhili Fang (301312.SZ) has indicated that its solid crystal equipment can be applied in the storage sector [1] Group 1 - The company is actively engaging with investors through an interactive platform [1] - The application of solid crystal equipment in the storage field suggests potential growth opportunities for the company [1]

Group 1: Core Competencies and Advantages - The company focuses on "leading basic component technology and deep application in industry equipment," positioning itself as a global leader in intelligent manufacturing equipment solutions [2] - It has over 20 years of development, showcasing vertical integration advantages from basic components to complete equipment and process solutions [2] - The company leverages various advantages, including industry policy support, comprehensive technology, sales and service network, customer resources, and brand effect [2] Group 2: New Energy Sector Performance - The growth focus in the lithium battery equipment industry is shifting from domestic to overseas markets, with partnerships with major clients like CATL and others [4] - The company aims to enhance its market competitiveness and share in the power battery and energy storage battery equipment sectors through innovation and refined management [4] - In the photovoltaic equipment sector, the company has secured bulk orders for core equipment from mainstream battery manufacturers despite a decrease in capital expenditure from downstream clients [4] Group 3: Semiconductor Sector Overview - The company provides intelligent manufacturing equipment for the semiconductor sector, including laser cutting and testing equipment [5] - Its subsidiary, Shenzhen Dazhu Semiconductor Technology Co., focuses on semiconductor packaging equipment, which is currently expanding its market presence [5] Group 4: General Industrial Laser Processing Equipment Market - The company has achieved significant sales with its self-developed 3D five-axis cutting head, generating over 50 million in its first year [6] - It launched the world's first 150KW ultra-high power cutting machine, enhancing its influence in high-end markets [6] - The company is expanding its coverage in the mid-to-low-end market, steadily increasing its market share in high-power laser cutting equipment [7] Group 5: Overseas Expansion Strategy - The company is expanding its overseas R&D and sales teams to capture market opportunities arising from supply chain diversification, particularly in Southeast Asia [8] - The PCB market in Southeast Asia is expected to grow significantly, with projected compound growth rates exceeding those of mainland China [8] - The IC packaging substrate market in the US and Europe is anticipated to grow at compound rates of 18.3% and 40.6% over the next five years, respectively [8] Group 6: Share Buyback Completion - The company completed a share buyback of 22,589,592 shares, representing 2.15% of its total share capital, with a total expenditure of approximately RMB 500 million [9] - The total share capital will decrease from 1,052,193,000 shares to 1,029,603,408 shares following the cancellation of the repurchased shares [9] Group 7: Pledge Situation - The actual controller and major shareholders have a share pledge ratio of 75.98% [10]