Core Insights - The company views Japanese semiconductor equipment as a benchmark for technology and application, indicating a long-standing accumulation of expertise in the field [1] - After years of effort, the company has successfully introduced domestic semiconductor slicing equipment to leading packaging enterprises, achieving bulk sales and comparable performance to international competitors [1] - The company aims to complete the layout of mechanical cutting, laser cutting, and grinding equipment in the semiconductor business by 2025, while continuing to enhance R&D and expand its product range to further promote domestic substitution of semiconductor equipment [1]