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印度要发力1nm以下的芯片
半导体行业观察· 2025-04-21 00:58
Core Viewpoint - A team of 30 scientists from the Indian Institute of Science (IISc) has proposed the development of "angstrom-level" chips, significantly smaller than the current smallest chips, to enhance India's position in the semiconductor industry [1][2]. Group 1: Proposal Details - The proposal aims to develop chips using new semiconductor materials known as two-dimensional materials, which could reduce chip size to one-tenth of the current smallest chips produced globally [1]. - The current smallest chips are produced using 3-nanometer nodes by companies like Samsung and TSMC [1]. - The detailed project report (DPR) was initially submitted in April 2022 and revised for resubmission in October 2024, indicating ongoing governmental discussions [1][3]. Group 2: Government and Industry Response - The Indian Ministry of Electronics and Information Technology (MeitY) is positively inclined towards the project, exploring electronic applications for the proposed technology [2]. - India's semiconductor manufacturing heavily relies on foreign companies, making this project strategically significant for economic and national security [2]. - The largest semiconductor project in India, a collaboration between Tata Electronics and Taiwan's TSMC, has an investment of ₹910 billion and has received government approval for 50% funding support [2]. Group 3: Funding and Global Context - The IISc-led proposal requests ₹5 billion over five years for developing indigenous semiconductor technology, which is relatively modest compared to other global investments [2]. - Countries like Europe and South Korea have invested significantly in two-dimensional materials, with Europe exceeding $1 billion (approximately ₹83 billion) [2]. - The urgency for India to act is emphasized, as global tech companies are shifting focus towards two-dimensional semiconductors, and the window for India to execute this proposal may close soon [3].
印度要发力1nm以下的芯片
半导体行业观察· 2025-04-21 00:58
如果您希望可以时常见面,欢迎标星收藏哦~ 印度电子和信息技术部(MeitY)的消息人士证实,该提案正在讨论中。 一位知情官员表示:"印 度半导体技术与创新部(MeitY)对该项目持积极态度。首席科学顾问兼秘书长已就此举行会议。 MeitY正在探索可部署此类技术的电子应用。这是一项合作项目,每一步都需要尽职调查。" 印度目前在半导体制造方面严重依赖外国企业——这项技术从经济和国家安全角度来看都具有战略 意义。该国最大的半导体项目由塔塔电子与台湾力积电合作设立,投资额达9100亿卢比。该项目 已获得印度半导体计划的批准,并有资格获得政府50%的资金支持。相 比之下,印度理工学院(IISc)牵头的提案要求在五年内拨款50亿卢比,用于打造下一代半导体的 本土技术,但金额相对较低。该项目还包括初始融资阶段后的自主可持续发展路线图。 在全球范围内,二维材料引起了广泛关注。欧洲已投资超过10亿美元(约合830亿卢比),韩国投 资超过3亿卢比,中国和日本等国家也对基于二维材料的半导体研究进行了大规模但未公开的投 资。一位不愿透露姓名的官员表示:"二维材料将成为未来异构系统的关键推动因素。 尽管全球发展势头强劲,但印度在这方面 ...