"'无极'芯片只是用学术研究的范式达到的天花板，我们接下来要做的，是用工程化思维研发二维半导体材料，推动其真正的产业化。"复旦大学微电 子学院研究员、原集微科技（上海）有限公司创始人包文中接受采访时表示，"无极"更多是一块验证技术可行性的起点，真正的挑战在于，如何将二 维半导体从几千个晶体管的科研样机，推向百万门级乃至更高复杂度的CMOS芯片，如何在良率、成本、工艺稳定性上跨过工业界的门槛。 上世纪六十年代，英特尔的创始人之一戈登摩尔在一篇观察评论报道中提出，在成本基本不变的情况下，芯片上的晶体管数量大约每18–24个月翻一 倍，计算能力随之指数级提升。 半导体产业半个世纪以来的快速发展，也在不断验证这条"摩尔定律"。人们的普遍感受是，手机更快了、电脑更强了，而且越用越便宜。 但事实上，随着芯片零件越做越小，越做越密，"摩尔定律"的传统演进逻辑正逐渐"失效"。 尤其当制程推进至3纳米及以下节点后，硅基材料在纳米尺度下已逼近物理极限，单纯依靠结构创新实现性能提升的空间愈发有限，摩尔定律的核心 逻辑正面临根本性挑战。 在这一背景下，全球半导体产业正在同时推进两条路径，一条是"延续摩尔"，通过结构创新，在硅体系内继 ...

公司方面，据中证报表示，主要有：南大光电、德尔未来等。 *免责声明：文章内容仅供参考，不构成投资建议 据中证报报道，南京大学-苏州实验室王欣然、李涛涛团队与东南大学王金兰团队合作，开发了全新的 氧辅助金属有机化学气相沉积（oxy-MOCVD）技术，解决了二维半导体量产化制备的动力学瓶颈。团 队在制备二维半导体的过程中创新设计材料生长结构，使前驱物反应速率提升约1000倍以上。该成果团 队2025年发表的"点石成晶"技术共同构建了"衬底工程 + 动力学调控"完整技术路线，为二维半导体量产 化提供核心支撑，为我国在下一代半导体技术竞争中构筑核心优势。 中证报指出，面对摩尔定律逼近物理极限的全球性挑战，具有原子级厚度的二维半导体是目前国际公认 的破局关键。二维半导体是当前半导体技术领域的前沿方向，其核心优势在于原子级厚度（单层或几层 原子构成），可突破硅基材料的物理极限，为后摩尔时代芯片发展提供新路径。二维-硅基混合架构闪 存芯片技术有望颠覆传统存储器体系，让通用型存储器取代多级分层存储架构，为人工智能、大数据等 前沿领域提供更高速、更低能耗的数据支撑，让二维闪存成为AI时代的标准存储方案。 *风险提示：股市有风险 ...

Core Insights - The research teams from Southeast University and Nanjing University have achieved a significant breakthrough in the mass production of two-dimensional (2D) semiconductor single crystals using metal-organic chemical vapor deposition technology with an oxygen-assisted strategy [1][2]. Group 1: Technological Advancements - The new method addresses traditional challenges in 2D semiconductor production, such as carbon contamination, small crystal domain sizes, and low mobility [1]. - By introducing oxygen into the growth process and innovatively designing a pre-reaction chamber structure, the energy barrier for reactions was significantly lowered, increasing the precursor reaction rate by over 1000 times [1]. Group 2: Production Improvements - The new approach has dramatically enhanced the growth rate of molybdenum disulfide crystal domains, increasing the average size from the nanometer scale to several hundred micrometers, and ensuring ordered alignment along specific crystal directions [1]. - This advancement resolves the mass production challenge of achieving uniform growth over large areas and effectively suppresses the formation of carbon-containing intermediates, thereby eliminating carbon contamination issues [1]. Group 3: Industry Implications - This breakthrough lays a material foundation for the large-scale application of 2D semiconductors in integrated circuits, flexible electronics, and sensors [2].

Core Viewpoint - The future of microelectronics hinges on the miniaturization of chips, with a focus on developing smaller and more energy-efficient semiconductors to meet the demands of AI and smart devices [2][4]. Group 1: Emerging Technologies - Two-dimensional (2D) semiconductors are emerging as a groundbreaking technology that can surpass the limitations of traditional silicon, offering unprecedented speed, efficiency, and miniaturization [4][5]. - These materials, only a few atoms thick, allow for stacking chips like paper, enabling engineers to integrate more processing power in smaller spaces [4][5]. Group 2: Research and Development - The research team, led by Professor Tongay, is exploring atomic-scale materials to create, test, and optimize new semiconductor materials, aiming to prove that 2D materials can compete with and even exceed the performance of established silicon technologies [4][5]. - Advanced methods such as Pulsed Laser Deposition (PLD) and Plasma-Enhanced Chemical Vapor Deposition (PECVD) are being utilized to grow these ultra-thin materials with high precision [6]. Group 3: Industry Implications - The work being done addresses a critical industry challenge: how to expand advanced chip capabilities while reducing power consumption, with future AI processors potentially consuming over 10 kilowatts [5][6]. - The collaboration between Arizona State University and Applied Materials Inc. aims to bring these innovations from concept to practical application, potentially transforming the microelectronics industry [6].

Core Viewpoint - The article discusses a £6 million EPSRC-funded project led by Queen Mary University of London, Nottingham University, and Glasgow University, aimed at developing energy-efficient two-dimensional (2D) materials and devices to significantly reduce the power consumption of AI data centers and high-performance computing [1][2]. Group 1: Project Overview - The project, named "NEED2D," focuses on creating atomic-thin semiconductors that can reduce energy consumption in AI data centers by over 90%, thereby lowering electricity costs and aiding in achieving net-zero targets [1][2]. - The initiative involves collaboration with over 20 partners contributing more than £2 million, aiming to establish a new electronic industry in the UK that leverages innovative 2D semiconductors [1][2]. Group 2: Energy Demand and Future Vision - The UK's electricity demand from data centers is projected to increase sixfold by 2034, reaching 30% of total electricity consumption, which poses a threat to climate goals [2]. - Leading semiconductor companies, including TSMC, Intel, and Samsung, recognize 2D materials as a future trend, with a vision for the UK to become a global leader in ultra-low-energy 2D devices by 2040 [2]. Group 3: Technological Advancements - The new 2D materials, such as graphene and its derivatives, exhibit superior charge transport efficiency compared to silicon, making them ideal for low-power computing and reducing heat waste [2][3]. - The project aims to advance the precision engineering of 2D semiconductors, exploring their unique electronic properties at the atomic scale [3]. Group 4: Economic and Environmental Impact - The transition to low-power 2D transistors is expected to enhance the UK's attractiveness for tech investments and demonstrate the economic potential of energy transition [4]. - The research is anticipated to help the UK meet its climate goals while establishing a revolutionary new microelectronics industry, creating jobs and reducing electricity costs [5].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容编译自miragenews ，谢谢 。 英国伦敦玛丽女王大学、诺丁汉大学和格拉斯哥大学的科学家团队获得了一项价值600万英镑的 EPSRC项目资助，该项目名为"利用超低能耗二维材料和器件（NEED2D）实现净零排放和人工智 能革命"。该项目将开发节能、原子级厚度的半导体，以大幅降低人工智能数据中心和高性能计算 的电力需求。 该团队由伦敦玛丽女王大学牵头，将与众多制商和多家研究机构（超过20个合作伙伴为该项目贡 献超过200万英镑）合作，开发新材料并制造晶体管等革命性的低能耗电子设备原型。这将使英国 能够利用创新的二维半导体，打造一个超越传统材料的全新电子产业。 该项目负责人、伦敦玛丽女王大学材料科学教授科林·汉弗莱斯爵士表示："世界各国政府正斥资数 十亿美元建设风能、太阳能、核能和天然气发电站，以满足人工智能数据中心巨大的能源需求。我 们的方法是从源头上解决问题：首先减少这些中心的能源消耗。" 为此，我们将使用最新的二维材料，其厚度仅为原子级。这将节省数据中心和计算机90%以上的能 源需求，降低电力成本，并有助于实现"净零"目标。 人工智能的能源需求正以惊人 ...

Core Viewpoint - A team of 30 scientists from the Indian Institute of Science (IISc) has proposed the development of "angstrom-level" chips, significantly smaller than the current smallest chips, to enhance India's position in the semiconductor industry [1][2]. Group 1: Proposal Details - The proposal aims to develop chips using new semiconductor materials known as two-dimensional materials, which could reduce chip size to one-tenth of the current smallest chips produced globally [1]. - The current smallest chips are produced using 3-nanometer nodes by companies like Samsung and TSMC [1]. - The detailed project report (DPR) was initially submitted in April 2022 and revised for resubmission in October 2024, indicating ongoing governmental discussions [1][3]. Group 2: Government and Industry Response - The Indian Ministry of Electronics and Information Technology (MeitY) is positively inclined towards the project, exploring electronic applications for the proposed technology [2]. - India's semiconductor manufacturing heavily relies on foreign companies, making this project strategically significant for economic and national security [2]. - The largest semiconductor project in India, a collaboration between Tata Electronics and Taiwan's TSMC, has an investment of ₹910 billion and has received government approval for 50% funding support [2]. Group 3: Funding and Global Context - The IISc-led proposal requests ₹5 billion over five years for developing indigenous semiconductor technology, which is relatively modest compared to other global investments [2]. - Countries like Europe and South Korea have invested significantly in two-dimensional materials, with Europe exceeding $1 billion (approximately ₹83 billion) [2]. - The urgency for India to act is emphasized, as global tech companies are shifting focus towards two-dimensional semiconductors, and the window for India to execute this proposal may close soon [3].

如果您希望可以时常见面，欢迎标星收藏哦~ 印度电子和信息技术部（MeitY）的消息人士证实，该提案正在讨论中。 一位知情官员表示："印 度半导体技术与创新部（MeitY）对该项目持积极态度。首席科学顾问兼秘书长已就此举行会议。 MeitY正在探索可部署此类技术的电子应用。这是一项合作项目，每一步都需要尽职调查。" 印度目前在半导体制造方面严重依赖外国企业——这项技术从经济和国家安全角度来看都具有战略 意义。该国最大的半导体项目由塔塔电子与台湾力积电合作设立，投资额达9100亿卢比。该项目 已获得印度半导体计划的批准，并有资格获得政府50%的资金支持。相 比之下，印度理工学院（IISc）牵头的提案要求在五年内拨款50亿卢比，用于打造下一代半导体的 本土技术，但金额相对较低。该项目还包括初始融资阶段后的自主可持续发展路线图。 在全球范围内，二维材料引起了广泛关注。欧洲已投资超过10亿美元（约合830亿卢比），韩国投 资超过3亿卢比，中国和日本等国家也对基于二维材料的半导体研究进行了大规模但未公开的投 资。一位不愿透露姓名的官员表示："二维材料将成为未来异构系统的关键推动因素。 尽管全球发展势头强劲，但印度在这方面 ...