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超薄2D材料,挑战硅芯片极限
半导体行业观察· 2025-08-02 02:13
Core Viewpoint - The future of microelectronics hinges on the miniaturization of chips, with a focus on developing smaller and more energy-efficient semiconductors to meet the demands of AI and smart devices [2][4]. Group 1: Emerging Technologies - Two-dimensional (2D) semiconductors are emerging as a groundbreaking technology that can surpass the limitations of traditional silicon, offering unprecedented speed, efficiency, and miniaturization [4][5]. - These materials, only a few atoms thick, allow for stacking chips like paper, enabling engineers to integrate more processing power in smaller spaces [4][5]. Group 2: Research and Development - The research team, led by Professor Tongay, is exploring atomic-scale materials to create, test, and optimize new semiconductor materials, aiming to prove that 2D materials can compete with and even exceed the performance of established silicon technologies [4][5]. - Advanced methods such as Pulsed Laser Deposition (PLD) and Plasma-Enhanced Chemical Vapor Deposition (PECVD) are being utilized to grow these ultra-thin materials with high precision [6]. Group 3: Industry Implications - The work being done addresses a critical industry challenge: how to expand advanced chip capabilities while reducing power consumption, with future AI processors potentially consuming over 10 kilowatts [5][6]. - The collaboration between Arizona State University and Applied Materials Inc. aims to bring these innovations from concept to practical application, potentially transforming the microelectronics industry [6].
新型半导体,将功耗降低90%
半导体行业观察· 2025-05-05 04:22
如果您希望可以时常见面,欢迎标星收藏哦~ 来源:内容编译自miragenews ,谢谢 。 英国伦敦玛丽女王大学、诺丁汉大学和格拉斯哥大学的科学家团队获得了一项价值600万英镑的 EPSRC项目资助,该项目名为"利用超低能耗二维材料和器件(NEED2D)实现净零排放和人工智 能革命"。该项目将开发节能、原子级厚度的半导体,以大幅降低人工智能数据中心和高性能计算 的电力需求。 该团队由伦敦玛丽女王大学牵头,将与众多制商和多家研究机构(超过20个合作伙伴为该项目贡 献超过200万英镑)合作,开发新材料并制造晶体管等革命性的低能耗电子设备原型。这将使英国 能够利用创新的二维半导体,打造一个超越传统材料的全新电子产业。 该项目负责人、伦敦玛丽女王大学材料科学教授科林·汉弗莱斯爵士表示:"世界各国政府正斥资数 十亿美元建设风能、太阳能、核能和天然气发电站,以满足人工智能数据中心巨大的能源需求。我 们的方法是从源头上解决问题:首先减少这些中心的能源消耗。" 英国已经拥有欧洲最大的数据中心市场,伦敦是其中心枢纽。用低功耗二维晶体管取代高能耗的硅 芯片,将有助于确保英国继续成为吸引科技投资的地方,同时证明能源转型的经济潜力。 ...
新型半导体,将功耗降低90%
半导体芯闻· 2025-04-29 09:59
如果您希望可以时常见面,欢迎标星收藏哦~ 来源:内容编译自miragenews ,谢谢 。 英国伦敦玛丽女王大学、诺丁汉大学和格拉斯哥大学的科学家团队获得了一项价值600万英镑的 EPSRC项目资助,该项目名为"利用超低能耗二维材料和器件(NEED2D)实现净零排放和人工智 能革命"。该项目将开发节能、原子级厚度的半导体,以大幅降低人工智能数据中心和高性能计算 的电力需求。 该团队由伦敦玛丽女王大学牵头,将与众多制商和多家研究机构(超过20个合作伙伴为该项目贡 献超过200万英镑)合作,开发新材料并制造晶体管等革命性的低能耗电子设备原型。这将使英国 能够利用创新的二维半导体,打造一个超越传统材料的全新电子产业。 该项目负责人、伦敦玛丽女王大学材料科学教授科林·汉弗莱斯爵士表示:"世界各国政府正斥资数 十亿美元建设风能、太阳能、核能和天然气发电站,以满足人工智能数据中心巨大的能源需求。我 们的方法是从源头上解决问题:首先减少这些中心的能源消耗。" 为此,我们将使用最新的二维材料,其厚度仅为原子级。这将节省数据中心和计算机90%以上的能 源需求,降低电力成本,并有助于实现"净零"目标。 人工智能的能源需求正以惊人 ...
印度要发力1nm以下的芯片
半导体行业观察· 2025-04-21 00:58
Core Viewpoint - A team of 30 scientists from the Indian Institute of Science (IISc) has proposed the development of "angstrom-level" chips, significantly smaller than the current smallest chips, to enhance India's position in the semiconductor industry [1][2]. Group 1: Proposal Details - The proposal aims to develop chips using new semiconductor materials known as two-dimensional materials, which could reduce chip size to one-tenth of the current smallest chips produced globally [1]. - The current smallest chips are produced using 3-nanometer nodes by companies like Samsung and TSMC [1]. - The detailed project report (DPR) was initially submitted in April 2022 and revised for resubmission in October 2024, indicating ongoing governmental discussions [1][3]. Group 2: Government and Industry Response - The Indian Ministry of Electronics and Information Technology (MeitY) is positively inclined towards the project, exploring electronic applications for the proposed technology [2]. - India's semiconductor manufacturing heavily relies on foreign companies, making this project strategically significant for economic and national security [2]. - The largest semiconductor project in India, a collaboration between Tata Electronics and Taiwan's TSMC, has an investment of ₹910 billion and has received government approval for 50% funding support [2]. Group 3: Funding and Global Context - The IISc-led proposal requests ₹5 billion over five years for developing indigenous semiconductor technology, which is relatively modest compared to other global investments [2]. - Countries like Europe and South Korea have invested significantly in two-dimensional materials, with Europe exceeding $1 billion (approximately ₹83 billion) [2]. - The urgency for India to act is emphasized, as global tech companies are shifting focus towards two-dimensional semiconductors, and the window for India to execute this proposal may close soon [3].
印度要发力1nm以下的芯片
半导体行业观察· 2025-04-21 00:58
如果您希望可以时常见面,欢迎标星收藏哦~ 印度电子和信息技术部(MeitY)的消息人士证实,该提案正在讨论中。 一位知情官员表示:"印 度半导体技术与创新部(MeitY)对该项目持积极态度。首席科学顾问兼秘书长已就此举行会议。 MeitY正在探索可部署此类技术的电子应用。这是一项合作项目,每一步都需要尽职调查。" 印度目前在半导体制造方面严重依赖外国企业——这项技术从经济和国家安全角度来看都具有战略 意义。该国最大的半导体项目由塔塔电子与台湾力积电合作设立,投资额达9100亿卢比。该项目 已获得印度半导体计划的批准,并有资格获得政府50%的资金支持。相 比之下,印度理工学院(IISc)牵头的提案要求在五年内拨款50亿卢比,用于打造下一代半导体的 本土技术,但金额相对较低。该项目还包括初始融资阶段后的自主可持续发展路线图。 在全球范围内,二维材料引起了广泛关注。欧洲已投资超过10亿美元(约合830亿卢比),韩国投 资超过3亿卢比,中国和日本等国家也对基于二维材料的半导体研究进行了大规模但未公开的投 资。一位不愿透露姓名的官员表示:"二维材料将成为未来异构系统的关键推动因素。 尽管全球发展势头强劲,但印度在这方面 ...