Summary of Key Points Core Viewpoint - The report outlines the completion of certain fundraising projects by Guangzhou Fangbang Electronics Co., Ltd. and the temporary use of remaining funds to supplement working capital, following regulatory compliance and internal approvals [1][7]. Group 1: Fundraising Overview - The company successfully raised a total of RMB 979,039,622.63 through the issuance of 20,000,000 shares, as approved by the China Securities Regulatory Commission [1][2]. - The funds were fully received on July 18, 2019, and verified by Tianjian Accounting Firm [2]. Group 2: Project Investment Status - As of June 30, 2025, the company reported progress on its fundraising projects, with the first phase completed in 2022 and the second phase expected to reach operational status by early July 2024 [2]. - The company has achieved a production capacity of 32.5 million square meters per month for flexible copper-clad laminates [2]. Group 3: Project Completion and Fund Usage - The "Research and Development Center Construction Project" is proposed for completion, with a total investment of RMB 20,206.00 million, of which RMB 10,092.45 million has been spent [5]. - The remaining funds from the project will be temporarily used to supplement working capital, not exceeding RMB 120 million, for business expansion and daily operations [6]. Group 4: Approval and Compliance - The board of directors and supervisory board approved the project completion and the use of remaining funds in meetings held on August 27, 2025 [6][7]. - The actions taken are in compliance with the relevant regulations and do not harm the interests of the company or its shareholders [7].

Core Viewpoint - The company has developed a series of new products for PCB (including FPC) electronic functional materials, focusing on pressure testing films, photoresist dry films, solder mask inks, and conductive adhesive films, aiming to establish pressure testing films as the leading product in the high-performance functional materials sector [1] Group 1: Product Development - The company has introduced pressure testing films, photoresist dry films, solder mask inks, and conductive adhesive films as part of its new product lineup [1] - Pressure testing films have been recognized as a "single champion" product in manufacturing by Hebei Province [1] Group 2: Partnerships and Collaborations - The company has established stable partnerships with leading enterprises in the electronics and semiconductor sectors, including JD.com, Tianma Microelectronics, and BYD [1] Group 3: Market Outlook - The PCB industry is expected to continue steady growth over the next five years, driven by new technological applications in AI, 5G communication, and new energy vehicles [1] - The market prospects for the company's PCB (including FPC) electronic functional materials are considered promising [1]