Core Viewpoint - Shenzhen Chuangzhixin Technology Co., Ltd. (Chuangzhixin) has submitted its IPO application to the Hong Kong Stock Exchange after withdrawing its A-share IPO application, aiming for faster capital market support and international exposure [12][13]. Group 1: Company Overview - Chuangzhixin, established in 2006, is the largest domestic provider of wet process coating materials in China and ranks sixth in the domestic market for wet process coating materials [2][4]. - The company has transitioned from initial losses to significant revenue growth, with revenues of 320 million yuan, 312 million yuan, and 410 million yuan from 2022 to 2024, and a gross profit margin increasing from 32.3% in 2022 to 42.8% in 2024 [3][4]. Group 2: Financing and Investment - Chuangzhixin has completed multiple financing rounds, raising approximately 589 million yuan, with significant investments from various funds and institutions [6]. - The company plans to allocate about 45% of the funds raised from the IPO for new production lines and service upgrades, with additional funds for R&D, strategic expansion, and general corporate purposes [1]. Group 3: Management and Innovation - The current general manager, Yao Yu, is the daughter of major shareholder Yao Cheng, and they are jointly driving the company's development [10]. - Chuangzhixin holds 71 invention patents and 61 utility model patents domestically, along with 6 overseas invention patents, showcasing its technological advantages in the coating materials sector [10].

芯东西6月12日报道，6月9日，深圳半导体封装材料提供商创智芯联正式递表港交所。 根据IPO文件，创智芯联成立于2006年11月，是湿制程镀层材料行业的全球领导者，亦是电子封装行业金属化互连领域中兼具技术话语权与生 态整合能力的中国领先企业，2024年被认定为国家级专精特新"小巨人"企业。 | 80% | 排名第一 | 53.8% | | --- | --- | --- | | 中國前五大功率器件廠商覆蓋率3 | 濕製程鍍層材料中國提供商 · 一站式鍍層材料及鍍層服務中國提供商2 | 2022财年至2024财年半導體業務 收入增長CAGR | | 90% | 8.500+萬元人民幣 | 130+家 | | 中國前十大PCB企業覆蓋率3 | 2022财年至2024财年研發費用開支 | 半導體領域客戶 | 作为中国领先的金属化互连镀层材料和关键工艺技术的方案提供商，近二十年来，创智芯联致力于推动晶圆级和芯片级封装，以及PCB制造领 域镀层材料供应链发展。 01.三年累计营收逾10亿，净利润约1亿 电子封装是为电子器件设计和制造保护性外壳的技术，直接影响器件的性能、可靠性、尺寸与成本。其层级可划分为晶圆级封装、芯片 ...