在珠三角地区，珠海是仅次于深圳的集成电路设计产业重镇；放眼全国，珠海多年位居全国集成电路设计业销售额前 十。 这里汇聚了一个涵盖半导体全产业链的企业矩阵，包括纳思达、英集芯、芯耀辉、全志科技、炬芯科技、英诺赛科、 越亚半导体、宝丰堂半导体等。 格隆汇获悉，珠海越亚半导体股份有限公司（简称"越亚半导体"）不久前向深交所递交了招股书，寻求创业板上市， 由中信证券担任保荐人。 东方富海押注，专注于封装载板领域 珠海是中国芯片产业的重要一极。 越亚半导体成立于2006年4月，2012年7月完成股改，总部位于珠海市斗门区。 本次发行前，越亚半导体的第一大股东AMITEC公司、第二大股东新信产及其一致行动人持股比例分别为39.95%、 37.23%，且单个股东无法控制股东会或董事会多数席位，因此，公司无控股股东、实际控制人。 大股东AMITEC公司是一家以色列上市公司Priortech所控股的境外企业，其实际控制人为Rafi Amit和Yotam Stern； 第二大股东新信产及其一致行动人巨人网盛均是由中国平安最终控制的主体，目前公司的董事长聂志强就是由新信产 提名的。 此外，公司其他重要股东还包括东方富海、皖江物流等 ...

点击 最 下方 "在看"和" "并分享，"关注"材料汇 添加 小编微信 ，遇见 志同道合 的你 正文 引言 在人工智能、 5G 通信、高性能计算和自动驾驶技术飞速发展的今天，芯片已成为推动全球科技进步的 核心引擎。然而，在每一颗高端芯片的背后，都 离不开一项被称为 " 隐形核心 " 的关键材料 —— ABF 胶膜 （ Ajinomoto Build-up Film ） 。这种由日本味之素公司几乎垄断的环氧树脂基绝缘薄膜，虽不为 人熟知，却是实现芯片高密度互联、高速传输和高可靠性的基础。它不仅是英特尔、 AMD 、英伟达等 巨头高端处理器的 " 标配 " ，更在全球半导体产业链中扮演着不可替代的角色。 当前，中国正全力推进半导体产业自主可控战略，而 ABF 胶膜作为 " 卡脖子 " 环节之一，其国产化进 程牵动着整个高端封装领域的命脉。本文将从 技术原理、市场与格局、产业链结构、技术壁垒、未来 方向及投资逻辑 等多个维度，全面剖析 ABF 胶膜的发展现状与国产突围路径，旨在为 行业参与者、投 资者和政策制定者 提供一份深入而系统的参考。 目录 一、 ABF 胶膜基本概况： 芯片封装的关键 " 黏合剂 " 1 、 ...

Core Viewpoint - The article emphasizes the growing demand for advanced packaging materials in the semiconductor industry, particularly focusing on the evolution of molding compounds and the challenges posed by new technologies and applications [2][6]. Group 1: Advanced Packaging Applications - The shift from traditional wire bonding packaging to advanced packaging methods such as wafer-level packaging, panel-level packaging, 2.5D/3D heterogeneous integration, and system-level packaging requires molding compounds to have higher flatness, lower warpage, and better fine-pitch filling capabilities [2]. - The increasing frequency and speed requirements from applications like 5G and AI necessitate low dielectric constant and low dielectric loss molding compounds to minimize signal transmission delays and losses [3]. Group 2: Thermal Management and Reliability - Power devices, such as IGBTs used in electric vehicles, generate significant heat, leading to a need for ultra-high thermal conductivity molding compounds [4]. - Industries like automotive electronics and aerospace demand components that can operate in extreme environments for over 15 years, placing extreme reliability requirements on materials [5]. Group 3: Environmental Considerations - There is a push towards developing more environmentally friendly formulations, such as halogen-free, antimony-free, and bio-based materials, in response to sustainability concerns [6]. Group 4: Market Landscape - China, as a leading player in the global packaging and testing manufacturing industry, has the largest demand for epoxy molding compounds, yet local supply capabilities are limited, particularly for mid-to-high-end products like wafer-level packaging materials, which still rely on imports or foreign enterprises' production bases in China [6]. - Currently, there are 18 major enterprises competing in the packaging molding materials market in China, with total annual production capacity exceeding 210,000 tons [6]. Group 5: Industry Events and Collaboration - TrendBank plans to hold the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on cutting-edge heterogeneous integration technologies and aiming to foster collaboration within the advanced electronic information industry [7][8].

Group 1: Market Dynamics - As of September 15, 2025, there were 16 new private placement projects added, a decrease of 10 projects compared to the previous period[6] - The number of terminated projects was 6, down by 4 projects from the previous period[6] - The approval rate for projects was 100%, with 10 projects approved by the review committee, an increase of 2 projects[17] Group 2: Fundraising and Valuation - The total fundraising amount for the three listed projects in the last two weeks was 11.281 billion yuan, a decrease of 32.21%[32] - The average price discount rate for the successful project "Fulede" was 13.26%, with a market price discount rate of 16.25%[32] - Zhongke Xingtou plans to raise up to 2.488 billion yuan for various projects, with a projected revenue growth rate exceeding 20% for 2024 and H1 2025[23] Group 3: Performance Metrics - The average absolute return for newly unlocked competitive projects was 33.82%, a decrease of 74.78 percentage points[32] - The average absolute return for pricing projects was 52.71%, down by 32.70 percentage points[32] - The average market price discount rate for pricing projects was 54.35%, an increase of 31.31 percentage points[32] Group 4: Risks - Risks include slower-than-expected review progress, stock price volatility in the secondary market, and changes in the pricing environment for private placements[32]

Core Viewpoint - The company, Shenzhen Zhizheng High Polymer Materials Co., Ltd., is undergoing a significant asset restructuring to acquire 87.47% of Advanced Packaging Materials International Ltd. (AAMI), a leading semiconductor lead frame supplier, while divesting its wholly-owned subsidiary, Zhizheng New Materials [1][3][5]. Company Performance - For the first half of 2025, the company reported revenue of 10,417.63 million yuan, representing a year-on-year increase of 6.03%. However, the net profit attributable to shareholders was -2,264.80 million yuan, with a net profit of -2,348.66 million yuan after excluding non-recurring losses [2][4]. Asset Restructuring Details - The company plans to acquire AAMI through a combination of major asset swaps, issuance of shares, and cash payments, with the total value of the assets to be acquired amounting to 306,870.99 million yuan and the assets to be divested valued at 25,637.34 million yuan [2][5]. - Following the transaction, the company will hold approximately 99.97% of AAMI's shares, which is expected to enhance its focus on the semiconductor packaging materials and specialized equipment sector [3][4]. Regulatory Approval - The company received approval from the China Securities Regulatory Commission on September 5, 2025, for the issuance of shares to purchase assets and raise supporting funds, marking a critical step in the restructuring process [1][4].

点击 最 下方 "在看"和" "并分享，"关注"材料汇 添加 小编微信 ，遇见 志同道合 的你 正文 引言 在人工智能、 5G 通信、高性能计算和自动驾驶技术飞速发展的今天，芯片已成为推动全球科技进步的 核心引擎。然而，在每一颗高端芯片的背后，都 离不开一项被称为 " 隐形核心 " 的关键材料 —— ABF 胶膜 （ Ajinomoto Build-up Film ） 。这种由日本味之素公司几乎垄断的环氧树脂基绝缘薄膜，虽不为 人熟知，却是实现芯片高密度互联、高速传输和高可靠性的基础。它不仅是英特尔、 AMD 、英伟达等 巨头高端处理器的 " 标配 " ，更在全球半导体产业链中扮演着不可替代的角色。 当前，中国正全力推进半导体产业自主可控战略，而 ABF 胶膜作为 " 卡脖子 " 环节之一，其国产化进 程牵动着整个高端封装领域的命脉。本文将从 技术原理、市场与格局、产业链结构、技术壁垒、未来 方向及投资逻辑 等多个维度，全面剖析 ABF 胶膜的发展现状与国产突围路径，旨在为 行业参与者、投 资者和政策制定者 提供一份深入而系统的参考。 目录 一、 ABF 胶膜基本概况： 芯片封装的关键 " 黏合剂 " 1 、 ...

Group 1: Historical Significance - The ancient city of Ye, known for its historical importance as a capital during various dynasties, is recognized as a significant archaeological site with a history spanning over two thousand years [2][3] - Ye City was the first to implement a planned construction approach in ancient Chinese capital cities, influencing the urban planning of later cities such as Xi'an and Beijing [3] Group 2: Cultural and Tourism Development - The establishment of the Ye City Archaeological Park aims to protect and showcase the ancient capital's heritage, serving as a national model for archaeological site preservation [4][6] - The park includes various functional areas such as public archaeological excavation zones and cultural industry parks, enhancing its role as a comprehensive tourist attraction [4][6] Group 3: Technological Integration - The integration of modern technology, including VR experiences, allows visitors to engage with the historical context of Ye City, enhancing the educational and immersive aspects of the site [7] - Advanced digital technologies are utilized to create a 1:1 high-precision simulation of the ancient city, promoting a new cultural tourism brand [7] Group 4: Economic Transformation - The development of new industries in Linzhang County, including high-tech companies in semiconductor materials and specialized equipment, is driving economic growth [8][9] - Linzhang County is positioning itself as a significant hub for intelligent special equipment manufacturing, with a focus on high-quality economic development through industrial transformation [8][9]

Core Viewpoint - The company, Cheng Tian Wei Ye, reported impressive performance in its 2025 semi-annual report, showcasing strong growth in its smart card business while actively expanding into emerging fields such as semiconductor packaging materials and digital energy thermal management, reflecting its innovative vitality and strategic advancement [1] Financial Performance - Cheng Tian Wei Ye achieved a revenue of 210 million yuan, representing a year-on-year increase of 32.91% - The net profit attributable to shareholders reached 10.8764 million yuan, a significant year-on-year increase of 562.05% - The net profit after deducting non-recurring items turned from loss to profit, with a year-on-year growth of 387.93%, driven by continuous optimization of product structure and expansion of sales scale [2] Smart Card Business - As a leading player in the domestic smart card industry, the company has established a comprehensive coverage of the entire industry chain, becoming the first one-stop service provider in the sector - The proportion of high-margin one-stop service orders for smart cards increased during the reporting period - The company deepened strategic cooperation with major telecom operators, leveraging its advantages in functional integration, data security, and value-added services to explore innovative applications for super SIM cards - The global smart card market is experiencing structural growth opportunities, particularly in Southeast Asia, the Middle East, and Africa, where significant growth potential exists [3] Emerging Business Growth - The company is implementing a strategy to extend its industrial chain and explore new fields, with semiconductor packaging materials and digital energy thermal management emerging as new growth drivers - In the first half of 2025, orders for semiconductor packaging materials increased by 145.28% year-on-year - The company has completed the technical development and production line construction for copper pin heat dissipation substrates, upgrading its product structure to meet the high demands of new energy vehicles, charging piles, and AI applications - The self-developed liquid cooling plates in the digital and energy thermal management sector have competitive advantages in structural integration, thermal efficiency, and pressure resistance, catering to high-performance computing needs [4] Financial Health - The company's financial fundamentals remain robust, with a cash balance of 127 million yuan at the end of the period, an increase of 3.57% from the previous year, primarily due to increased sales collections - The net cash flow from operating activities grew by 2.88% year-on-year, indicating good cash flow management capabilities [5] Research and Development - Cheng Tian Wei Ye emphasizes technology research and development, focusing on industry pain points and cutting-edge applications, with R&D investment increasing by 9.59% year-on-year - The company has implemented a new employee stock ownership plan to enhance long-term incentive mechanisms, further stimulating team motivation and creativity - The global semiconductor market is expanding, with AI driving explosive demand for computing power, and the liquid cooling server market is expected to grow at a compound annual growth rate of 46.8% - The company is accelerating its expansion from the smart card sector into high-growth, high-value technology fields, forming a clear "dual-driven" pattern [6]

Core Viewpoint - The company, Cheng Tian Wei Ye, reported impressive performance in its 2025 semi-annual report, showcasing strong growth in its smart card business while actively expanding into emerging fields such as semiconductor packaging materials and digital energy thermal management, reflecting its innovative vitality and strategic advancement capabilities [1] Financial Performance - The company's revenue reached 210 million yuan, a year-on-year increase of 32.91% - Net profit attributable to shareholders was 10.8764 million yuan, a significant rise of 562.05% - The net profit after deducting non-recurring items turned from loss to profit, increasing by 387.93%, driven by continuous optimization of product structure and expansion of sales scale [2] Smart Card Business - As a leading player in the domestic smart card industry, the company has achieved full coverage of the entire industry chain, becoming the first one-stop service provider in the sector - The proportion of high-margin one-stop service orders for smart cards has increased during the reporting period - The company has deepened strategic cooperation with major telecom operators, seeking to break through traditional smart card business bottlenecks and actively expand innovative application scenarios for super SIM cards - The global smart card market is experiencing structural growth opportunities, particularly in Southeast Asia, the Middle East, and Africa, where significant growth potential exists [3] Emerging Business Growth - The company is implementing a strategy to extend its industrial chain and explore new fields, with semiconductor packaging materials and digital energy thermal management becoming new growth drivers - In the first half of 2025, orders for semiconductor packaging materials increased by 145.28%, supported by strong market demand and high customer recognition - The company has completed the technical development and production line construction for copper pin heat dissipation substrates, upgrading its product structure to meet the high demands of IGBT and SiC power module packaging for electric vehicles and charging piles [4] Financial Health - The company's financial fundamentals remain robust, with cash balances at the end of the period reaching 127 million yuan, a 3.57% increase from the previous year - The net cash flow from operating activities grew by 2.88%, indicating good cash flow management capabilities [5] R&D and Innovation - The company emphasizes technology research and development, with R&D investment increasing by 9.59% year-on-year - The implementation of a new employee stock ownership plan aims to enhance long-term incentive mechanisms, further stimulating team motivation and creativity - The global semiconductor market is expanding, with AI driving explosive demand for computing power, and the liquid cooling server market is expected to grow at a compound annual growth rate of 46.8% - The company is accelerating its expansion from the smart card sector into high-growth, high-value technology fields, forming a clear "dual-drive" pattern [6]

Core Insights - The company reported a significant increase in both revenue and profit for the first half of 2025, with revenue reaching 2.095 billion yuan, a year-on-year growth of 7.88%, and net profit attributable to shareholders soaring by 327.86% to 42.669 million yuan [1] Group 1: Business Performance - The core business of copper-clad laminates (CCL) has been a key driver of revenue growth, with increased sales volume contributing to the overall performance [2] - The company is actively targeting high-end applications in AI servers and automotive electronics, leading to a notable increase in the sales proportion of high-end copper-clad laminates [2] - The company has successfully developed and sold low-loss materials for high-speed copper-clad laminates, which have gained recognition from major international chip manufacturers [2] Group 2: New Growth Areas - The semiconductor packaging materials business has emerged as a new growth highlight, with stable orders for BT packaging materials in various applications, promoting domestic substitution through cost-effective solutions [3] - The company is advancing the development of composite materials and film materials, achieving breakthroughs in medical equipment and expanding into new application areas such as energy storage and lightweight logistics [3] Group 3: R&D and Operational Efficiency - The company has increased its R&D investment to 94.87 million yuan, a year-on-year growth of 4.79%, focusing on high-end copper-clad laminates and semiconductor packaging materials [4] - The company is enhancing production and operational efficiency through digital upgrades and optimization of its SAP system, which supports cost control and efficiency improvements [4] - The company is planning a copper-clad laminate production base in Thailand with an investment of up to 60 million USD, aiming to expand its overseas market presence [4]