Group 1: Company Overview and Market Position - The company maintains high factory utilization rates, benefiting from strong demand in computing power and automotive electronics markets [1] - The PCB business focuses on high-end products, particularly in the fields of new energy and ADAS, with applications in industrial control and medical sectors [1] - The company has established factories in Shenzhen, Wuxi, Nantong, and Thailand, with ongoing capacity expansion projects [3] Group 2: PCB Business Demand and Trends - There is an increasing demand for large-size, high-layer, high-frequency, and high-speed HDI PCB products, driven by advancements in technology [2] - The PCB business has seen growth in demand for products used in high-speed communication networks, data center switches, AI accelerator cards, and storage devices since 2024 [2] Group 3: Expansion Plans and Investments - The total investment for the Thailand factory is 1.274 billion RMB, aimed at enhancing capabilities in high-layer and HDI PCB technologies [4] - The company is upgrading existing PCB factories to increase capacity and is progressing with the Nantong Phase IV project to establish an HDI technology platform [3] Group 4: Packaging Substrate Business - The packaging substrate business includes a wide range of products, with demand improving in Q1 2025 compared to Q4 2024, particularly for storage-related products [5] - The FC-BGA packaging substrate can now produce products with up to 20 layers, with ongoing development for higher-layer products [6] Group 5: Electronic Assembly Business - The electronic assembly business focuses on communication, data centers, medical, and automotive electronics, aiming to provide integrated solutions and enhance customer loyalty [7] - The company adheres to information disclosure regulations, ensuring no significant undisclosed information was leaked during the investor relations activities [7]

Investment Rating - The investment rating for the company is "Buy" and is maintained [7]. Core Views - The company reported a revenue of 17.907 billion yuan in 2024, representing a year-on-year increase of 32.39%. The net profit attributable to shareholders was 1.878 billion yuan, up 34.29% year-on-year. The gross margin and net margin were 24.83% and 10.49%, respectively, with increases of 1.40 percentage points and 0.16 percentage points year-on-year [2][5]. - In Q4 2024, the company achieved a revenue of 4.858 billion yuan, a year-on-year increase of 19.51% and a quarter-on-quarter increase of 2.74%. The net profit attributable to shareholders was 390 million yuan, down 20.50% year-on-year and 22.22% quarter-on-quarter [2][5]. - The company's PCB business showed robust growth, with revenue of 10.494 billion yuan, up 29.99% year-on-year, and a gross margin of 31.62%, an increase of 5.07 percentage points year-on-year. However, the packaging substrate business saw a decline in profitability [10]. Summary by Sections Financial Performance - In 2024, the company achieved total revenue of 17.907 billion yuan and a net profit of 1.878 billion yuan. The gross profit margin was 24.83%, and the net profit margin was 10.49% [2][5]. - For Q4 2024, the company reported revenue of 4.858 billion yuan and a net profit of 390 million yuan, with gross and net margins of 21.95% and 8.04%, respectively [2][5]. Business Segments - The PCB business generated revenue of 10.494 billion yuan, reflecting a year-on-year growth of 29.99% with a gross margin of 31.62%. The packaging substrate business had revenue of 3.171 billion yuan, up 37.49%, but with a gross margin of 18.15%, down 5.72 percentage points [10]. - The electronic assembly business achieved revenue of 2.823 billion yuan, a year-on-year increase of 33.20%, with a gross margin of 14.40% [10]. Future Outlook - The company is expected to achieve net profits of 2.531 billion yuan, 3.033 billion yuan, and 3.549 billion yuan for the years 2025, 2026, and 2027, respectively, with corresponding price-to-earnings ratios of 28.11, 23.46, and 20.05 [10].