Core Viewpoint - SpaceX, led by Elon Musk, is betting on Fan-Out Panel Level Packaging (FOPLP) to meet the production demands of its low Earth orbit satellites, requiring suppliers to expand their FOPLP production lines [1][2]. Group 1: SpaceX and FOPLP Development - SpaceX has signed a Non-Recurring Engineering (NRE) contract with Innolux, which is expected to secure significant orders for power management chips and aims for FOPLP mass production this year [1]. - SpaceX is also building its own FOPLP production line in Malaysia, with a substrate size of 700mm x 700mm, the largest in the industry, targeting RF chips and power management chips for integrated packaging [1]. Group 2: Innolux's Position and Strategy - Innolux, a supplier for Tesla, is extending its collaboration into semiconductors, aiming to develop analog chips for mass production this year [2]. - The company is utilizing its existing 3.5-generation glass substrate for FOPLP, which, while not competitive for panel production, offers significant size advantages for packaging efficiency [2]. Group 3: Clarifications on Technology Capabilities - Following a report suggesting that the display industry's precision standards are insufficient for advanced chip packaging, Innolux clarified that it has not received negative feedback regarding its technical capabilities and that the overlap between display technology and advanced packaging processes is significant [3][4]. - Innolux emphasized that its G3.5 factory can produce the largest substrate size currently applicable for advanced packaging, and it can adjust processes for smaller substrate sizes without technical challenges [4][5]. Group 4: Market Trends and Future Focus - The trend towards larger chip sizes is driving the economic benefits of larger packaging substrates, which Innolux plans to focus on to enhance process efficiency and provide reliable packaging solutions for clients [5].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自工商时报 。 特斯拉执行长马斯克（Elon Musk）旗下低轨卫星厂商Space X押宝面板级封装（FOPLP），要求 相关协力厂扩大建置FOPLP产线，以因应其低轨卫星高度整合晶片后续量产需求。据悉，该公司 已与群创签下NRE（委托设计合约），群创有望夺下电源管理晶片大单，并借此力拼FOPLP今年 量产。 群创日前传获恩智浦、意法半导体、英飞凌手机电源管理晶片订单，原规划2024年下半年量产。 惟手机市况不佳，及良率等诸多原因，量产计画告吹。但群创持续投入开发FOPLP，前总经理杨 柱祥2024年底还特别延揽日月光前研发总经理唐和明，担任先进封装产品技术推进处的顾问，全 力冲刺2025年量产。 据悉Space X已要求供应链建置FOPLP产能外，本身也将在马来西亚自建FOPLP产线，基板尺寸 更是目前业界最大的700mmx700mm。 Space X将目标设定在卫星射频晶片、电源管理晶片等进行 共同封装，并透过掌握封装技术，强化卫星系统的垂直整合能力。 身为特斯拉车用面板供应商的群创，也借此机会将双方合作关系延伸至半导体，双方将合作开发类 比晶片，希望 ...