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全球8英寸晶圆供需正步入失衡期,我国国产化力度超预期,集成电路ETF(562820)一键布局全产业链芯片龙头
Xin Lang Cai Jing· 2026-01-22 03:05
Group 1 - The core viewpoint of the articles highlights the current trends and challenges in the semiconductor industry, particularly focusing on the 8-inch wafer supply-demand imbalance and the rise of domestic foundries in China [1] - The China Securities Index for integrated circuits has seen a decline of 0.52%, with mixed performance among constituent stocks, where Longxin Technology led with a 7.04% increase [1] - According to a report by TrendForce, the global 8-inch wafer foundry capacity is expected to shrink by 2.4% due to strategic capacity reductions by TSMC and Samsung [1] Group 2 - The demand for AI-driven power management chips remains strong, contributing to an increase in the average capacity utilization rate in the industry, which is projected to reach 90% [1] - Domestic wafer foundries in China are emerging as alternatives to meet the demand for 8-inch chips, with price adjustments expected to range from 5% to 20% [1] - TSMC plans to significantly increase its capital expenditure to between $52 billion and $56 billion in 2026 to accelerate advanced process capacity construction in response to the ongoing demand for AI computing power chips [1] Group 3 - As of December 31, 2025, the top ten weighted stocks in the China Securities Index for integrated circuits account for 53.66% of the index, including companies like Cambricon, SMIC, and Haiguang Information [2] - The integrated circuit ETF (562820) serves as a convenient tool for investors to gain exposure to leading companies across the entire semiconductor industry chain [2] Group 4 - Investors without stock accounts can also access investment opportunities in the semiconductor sector through the integrated circuit ETF linked fund (022350) [3]
中芯国际等巨头集体提价 8英寸芯片最高涨20%
Ge Long Hui· 2026-01-21 01:11
格隆汇1月21日|据21财经,集邦咨询报告显示,全球8英寸晶圆供需正步入失衡期。受台积电、三星电 子战略性削减产能影响,2026年全球8英寸代工总产能将萎缩2.4%。而AI驱动的电源管理芯片(Power IC)等产品需求维持强劲,正拉动行业平均产能利用率回升至90%的高位。在此背景下,中国大陆晶圆 代工厂正在崛起,成为满足8英寸芯片需求的替代方案。晶圆代工厂正提高报价,预计调价幅度在5%至 20%之间。 具体来看,目前台积电在中国台湾有4座8英寸晶圆厂和1座6英寸晶圆厂,若要在2027年全 面退出,2026年就需要持续削减产能。目前台积电的8英寸晶圆代工月产能约为52.8万片。 三星电子同 样于2025年下半年启动8英寸晶圆厂减产,且态度更为积极,希望将更多的资源投入到12英寸晶圆市场 的竞争当中。此前,三星为了应对持续亏损的晶圆代工业务以及8英寸晶圆厂的低产能利用率,就已经 计划削减8英寸晶圆厂规模,并传闻对8英寸代工制造和技术团队裁员30%以上。目前三星电子的8英寸 晶圆代工月产能亦约为52.8万片。 联电旗下8英寸晶圆月产能曾超36万片,现阶段产能利用率约70%。 展望后市,联电正向看待2026年营运有 ...