Report Overview - Report Industry: Semiconductor [2] - Research Object: CR Microelectronics [16] - Reception Time: August 29, 2025 [16] - Key Representatives: He Xiaolong, Chairman of CR Microelectronics; Wu Guoyi, Director, CFO, and Secretary of the Board of Directors of CR Microelectronics [16] Core Viewpoints - In the first half of 2025, the company's revenue and profit showed year - on - year and quarter - on - quarter growth, indicating continuous improvement in profitability and growth quality [28][29][30] - The global semiconductor industry has structural growth and market differentiation, with AI - driven high - performance computing and data centers as core growth drivers. The company is actively deploying in the AI field and expanding into emerging sectors [31][32][34] - The company is seizing recovery opportunities in multiple fields, optimizing its product and business structure, and aims to transform from a "device supplier" to a "system - level solution provider" [35][36][38] Summary by Section 01. Basic Research Information - The research object is CR Microelectronics, belonging to the semiconductor industry. It took place on August 29, 2025, and was received by the chairman and relevant executives [16] 02. Detailed Research Institutions - There are many participating institutions, including securities companies, fund management companies, investment companies, insurance companies, and other types [17][18][19] 03. Proportion of Research Institutions - No specific proportion information is provided in the text 04. Main Content Data Chairman's Speech - In the first half of 2025, the company achieved an operating income of 5.218 billion yuan, a year - on - year increase of 9.62%. The net profit attributable to the parent company was 339 million yuan, a year - on - year increase of 20.85% [28][29] - The company is actively deploying in the AI field, focusing on end - side AI in consumer and automotive electronics and expanding to emerging scenarios. In cloud - side AI, it provides power device solutions for server power supplies [32][33] - The company is seizing recovery opportunities in multiple fields such as automotive, photovoltaic energy storage, and consumer electronics. The proportion of the pan - new energy field in the product and solution segment has increased to 44% [35][36] - The company plans to build multi - dimensional growth curves, including in silicon - based products, compound semiconductor products, and sensors/MCUs [38] Investors' Questions and Answers - **Key Project Progress**: The Chongqing 12 - inch production line has reached a capacity of 30,000 wafers per month and is fully loaded. The Shenzhen 12 - inch production line has multiple 90nm products in mass production, and 55/40nm products are being verified. The advanced power packaging and testing base has a capacity utilization rate of over 80%, and the high - end mask project's sales have increased by 40% year - on - year [42][43][44] - **Gallium Nitride Product Layout**: The company is deploying two process routes for gallium nitride products. It has achieved full - voltage coverage and is a leading supplier in some fields. It has achieved mass production in server power supplies and is in the sampling verification stage for robots [45] - **Product Pricing**: The company's 6 - inch, 8 - inch, and Chongqing 12 - inch production lines are close to full production. It is in the process of discussing price increases with customers [46][47] - **Business Collaboration with Changjiang Electronics Technology**: The two companies have complementary businesses. Some 12 - inch advanced products of CR Microelectronics cooperate with Changjiang Electronics Technology during the R & D stage, and they will explore more in - depth collaboration in the future [47] - **Power Device Market in Servers**: The server market is growing rapidly, and the company has achieved mass supply of multiple products and has many new products under development [48] - **Advantages in AI Computing Power**: The company has large - scale manufacturing capabilities, rich product lines, experience in serving high - end customers, and advanced packaging technology capabilities [51] - **Sensor Field Layout**: The company will increase investment in high - end sensors, focus on multiple product types, and establish a dedicated sensor business group [51] - **Overseas Manufacturer Capacity Transfer**: The company is actively taking on orders from overseas companies in packaging and testing and wafer manufacturing [52]