Core Viewpoint - The global semiconductor industry is undergoing a significant adjustment period, with domestic substitution accelerating in key areas such as wafer manufacturing, packaging and testing, equipment materials, and EDA tools, making industry chain collaborative innovation the core to breaking through [1] Group 1: Major Vertical Exhibitions - The three major vertical exhibitions, including the Munich Shanghai Optical Expo, PCIM Asia, and WAIC, serve as essential platforms for global industry resources and cutting-edge technologies, establishing themselves as the top tier in industry significance [2][3] - These exhibitions are recognized as the leading indicators of industry trends, showcasing the highest level of authority and resource aggregation capabilities [3] Group 2: Munich Shanghai Optical Expo - Scheduled for March 18-20, 2026, at the Shanghai New International Expo Center, this expo is the largest and most prestigious in the global optoelectronics field, featuring over 1,400 top domestic and international companies [4] - The event covers the entire industry chain from materials to optical chips and devices, showcasing key technologies such as silicon-based photonic integration and quantum dot lasers [4] Group 3: PCIM Asia - Taking place from August 26-28, 2026, at the Shenzhen International Convention and Exhibition Center, PCIM Asia focuses on the power electronics industry, gathering over 800 leading companies [5][6] - The exhibition highlights third-generation semiconductors and serves as a platform for product launches and technical exchanges in the power electronics sector [6] Group 4: WAIC (World Artificial Intelligence Conference) - The main exhibition in Shanghai is set for July 5-7, 2026, with a focus on AI integration with semiconductors, featuring a display area of 77,000 square meters and attracting over 1,000 top companies [7] - The event emphasizes core areas such as GPU/DPU/NPU heterogeneous computing chips and edge computing semiconductors, showcasing the deep integration of semiconductors and AI [7] Group 5: Bay Area Strategic Hub - The Bay Area is positioned as a critical platform for domestic substitution, linking global resources and activating new industrial dynamics [9][10] - It houses over 70% of China's semiconductor design companies and 60% of packaging and testing firms, creating a complete industrial ecosystem [10] Group 6: Market Demand and Opportunities - The semiconductor industry in the Bay Area is projected to exceed one trillion in procurement for equipment, materials, and EDA tools over the next decade, indicating significant opportunities for domestic manufacturers [11][12] - The exhibition serves as a core window for domestic companies to connect with essential orders and projects [12] Group 7: Focus on Core Areas - The exhibition targets critical segments of the semiconductor industry, including wafer manufacturing equipment and advanced packaging technologies, fostering innovation and collaboration [13] - It invites top experts to address industry challenges and provide insights into technology breakthroughs [13] Group 8: Regional and Global Linkage - The exhibition acts as a gateway to the South China market, facilitating connections between domestic and international resources [14] - It supports a dual circulation model, promoting both domestic and international market interactions [14] Group 9: Strategic Matrix of Four Major Exhibitions - The four major exhibitions form a strategic matrix that combines leading segments with ecological collaboration, creating a resource aggregation platform for the semiconductor industry [16]

Core Points - The 2025 Heterogeneous Integration Frontier Forum will be held from November 17 to 19, 2025, in Ningbo, organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association [2][38] - The forum aims to discuss advancements in heterogeneous integration technology and its applications in micro-nano manufacturing and semiconductor packaging [20][24] Event Details - The forum will take place at the Ningbo Pan Pacific Hotel, with an expected attendance of 300 to 500 participants [38] - An 8-inch verification line for information materials and micro-nano device preparation will also be inaugurated during the event [2] Accommodation Information - Special hotel rates have been arranged for attendees at the Ningbo Pan Pacific Hotel, with prices ranging from 350 to 600 RMB per night depending on room type [6][9] - Additional nearby hotels are suggested for accommodation, including the Ningbo Radisson Hotel and the Ningbo Yidong Howard Johnson Hotel [8][11] Agenda Highlights - The forum will feature keynote speeches, panel discussions, and specialized forums focusing on topics such as advanced packaging, micro LED technology, and heterogeneous integration processes [20][28] - Notable speakers include experts from Huazhong University of Science and Technology, Zhejiang University, and various semiconductor companies [21][24][30] Ticketing Information - Tickets for the forum are priced at 2500 RMB per person, with early bird discounts available for those who register before October 31 [39]