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有研硅完成对日本DGT 70%股权收购 完善半导体产业链布局
Zhong Zheng Wang· 2026-01-28 06:12
2025年3月,有研硅经董事会、监事会及临时股东会审议通过相关议案,以自有资金119138.82万日元 (折合人民币约5846.97万元)现金收购控股股东株式会社RS Technologies(简称"RST")所持DGT股权。 截至公告披露日,首笔对价款83397.17万日元(折合人民币3766.88万元)已支付完毕,股权交割先决条件 全部满足,DGT正式成为有研硅控股子公司并纳入合并财务报表范围。 中证报中证网讯(记者杨洁)近日,有研硅发布公告称,已顺利完成对株式会社DG Technologies(简 称"DGT")70%股权的收购交割,公司在半导体产业链下游延伸及全球市场拓展方面迈出关键一步。 作为国内半导体硅材料领域的标杆企业,有研硅前身为中国有研科技集团有限公司(原北京有色金属研 究总院)401室,自上世纪50年代起便投身半导体硅材料研究,历经半个多世纪的技术积淀与产业深耕, 公司在国内率先实现了6英寸、8英寸硅片的产业化,率先实现12英寸工艺的技术研发,有力支持了中国集 成电路产业的发展。 在业内人士看来,此次收购对于有研硅有着多重战略意义。一是实现产业链垂直整合,公司现有硅材料 产品为粗加工中间品 ...
【投融资动态】欣晖材料A轮融资,投资方为成都创投、正耀资本等
Sou Hu Cai Jing· 2025-08-26 11:39
Core Insights - Chongqing Xinhui Material Technology Co., Ltd. has completed its Series A financing round, with undisclosed investment amounts from institutions including Chengdu Chuangtou, Zhengyao Capital, Yida Capital, and Guotai Junan Venture Capital [1][2]. Company Overview - Chongqing Xinhui Material Technology Co., Ltd. was established in August 2022 and is located in the Liangjiang New Area Yufu Industrial Park. It is a key project under the ecological chain investment incubation of Beijing Yisiwei Technology Group [2]. - The total investment for the project is 2.5 billion yuan, covering an area of 135 acres. The main products include silicon rings, silicon electrodes, and silicon carbide rings, with the silicon carbide ring product filling a domestic gap in this field [2]. Project Development - The Chongqing Xinhui silicon and silicon carbide components project officially commenced construction in April 2023. The factory is expected to be topped out by October 2023, with the first equipment moving in by March 2024, and product samples expected by September 2024 [2]. - Once fully operational, the project is anticipated to generate an annual output value exceeding 2 billion yuan [2].
全球与中国刻蚀用硅部件市场现状及未来发展趋势
QYResearch· 2025-07-11 09:28
Core Viewpoint - The etching silicon components are essential consumables in wafer manufacturing, with silicon electrodes and silicon rings being the primary products. The shift from traditional etching methods to plasma etching has improved product yield and quality due to the superior properties of silicon materials compared to ceramics [1][3][4]. Industry Status Analysis - The etching silicon components industry is highly concentrated, with over twenty manufacturers globally, primarily located in the US, South Korea, and Japan. Key players include Silfex Inc., Hana Materials Inc., and Mitsubishi Materials. The Chinese market is rapidly growing, with local companies like Ningxia Shunyu Juxin and Jinzhou Shengong Semiconductor entering the field [3][4]. Product Lifecycle - In the international supply chain, silicon components are in the "mature phase," while in the Chinese market, they are still in the "introduction phase." The products are characterized by a wide variety and small batch sizes, with consumption depending on the types of plasma etching machines and manufacturing processes used by integrated circuit manufacturers [4]. Technology and Application - As advanced processes move towards 3 nm and below, the requirements for silicon components' purity, crystal orientation uniformity, and surface roughness are increasing. Mainstream products need to achieve over 9N purity, with metal ion contamination controlled at the ppb level. The demand for large-sized silicon rings and electrodes (300 mm and above) is rising, with some companies researching 450 mm components for future wafer size evolution [5][19]. Supply Chain Dynamics - Geopolitical factors are driving regions like Europe, the US, Japan, and South Korea to accelerate local production to reduce reliance on single supply sources. Chinese manufacturers are also capturing market share, although they face technical challenges in high-purity and large-size products. Future trends indicate a shift towards higher purity and more complex structures in silicon components [6][20]. Global Market Scale - The global market for etching silicon components is projected to reach $1.727 billion by 2024 and $2.771 billion by 2031, with a CAGR of 7.27% from 2025 to 2031. The Chinese market is expected to grow from $176 million in 2024 to $349 million by 2031, increasing its global market share from 10.24% to 12.6% [11][12]. Regional Market Insights - North America is the largest consumer market, accounting for 24.77% of the market share in 2024, followed by Japan, Taiwan, and South Korea. The Chinese market is anticipated to grow the fastest, with a CAGR of approximately 10.33% from 2025 to 2031 [13][14]. Production Insights - North America, South Korea, and Japan are the top three production regions, holding 51.4%, 19.15%, and 18.73% of the market share in 2024. China's share is expected to increase from 7.5% in 2024 to 12.55% by 2031 [14]. Product Type Distribution - In 2024, silicon rings and silicon electrodes are projected to hold 53.1% and 46.9% of the market share, respectively. OEM customers are expected to account for about 68% of the market, with a CAGR of 7.22% in the coming years [15][16]. Competitive Landscape - The core manufacturers in the global etching silicon components market include Silfex Inc., Hana Materials Inc., and Mitsubishi Materials, with the top ten manufacturers holding over 90% of the market share in 2024 [16].