瑞能半导体科技股份有限公司成立于2015年，起点并非典型"从零孵化"的功率器件创业公司，而是承接 了恩智浦(NXP)计划剥离的双极功率器件业务：2015年8月，恩智浦与建广资产旗下基金南昌建恩、北 京广盟共同出资成立瑞能半导体，注册资本1.3亿美元，恩智浦持股49%，北京广盟与南昌建恩各持股 25.5%。不过，在四年后，恩智浦就完全退出了，瑞能半导体也就成为了一家中资100%控股的半导体企 业。 前言：脱胎于恩智浦(NXP)标准功率器件业务的安世半导体，虽然多年前就成为了闻泰科技全资子公 司，但今年10月却遭遇荷兰方面的强行接管，安世中国业务也由于荷兰方面的晶圆断供，正面临生产中 断的风险。而另一家脱胎于恩智浦双极功率器件业务的瑞能半导体，在被中资收购之后，不仅继承了成 熟的工艺平台、质量体系与客户网络，总部及制造供应链也都建在了国内，成为了一家真正意义上的中 国公司。 可控硅市场份额全球第一 得益于对恩智浦的双极功率器件"遗产"的完整继承，这也意味着瑞能半导体获得了在技术专利、生产设 施、研发团队、质量体系与客户网络等方面的强大底蕴。 瑞能半导体全球销售及市场副总裁尹晨丰去年在接受媒体采访时表示，"从飞利浦 ...

Core Insights - Silicon carbide (SiC) is gaining attention as a next-generation power semiconductor material that can replace silicon (Si) for high-temperature and high-pressure applications [1] - The upcoming International Conference on Silicon Carbide and Related Materials (ICSCRM 2025) is expected to highlight trends in SiC development and global competition, particularly involving Japan [1] Group 1: Challenges in SiC Production - Device manufacturers face significant challenges in improving the yield of 8-inch production lines, necessitating the establishment of high-yield processes compatible with multiple suppliers [2] - Wafer manufacturers are tasked with reducing the costs of 12-inch wafers and developing evaluation technologies that have not kept pace with the rapid commercialization of these wafers [2] Group 2: China's Advancements in SiC - Chinese manufacturers have made remarkable progress in reducing the price and improving the quality of SiC wafers, with quality now comparable to high-reliability components [3] - The rapid rise of Chinese manufacturers is attributed to unconventional manufacturing methods and significant government support, alongside lower electricity costs compared to Japan [3] Group 3: Weaknesses in China's SiC Ecosystem - Despite high-quality wafers, China's lack of coordination across the supply chain may hinder its ability to dominate the entire SiC ecosystem, as many companies focus on specific segments [4] - The unclear demand from device manufacturers raises concerns about the final quality of devices made from Chinese wafers, which may exhibit slight crystal misalignment affecting yield [5] Group 4: Japan's Position in SiC - Japan maintains a high level of research and technology in SiC, with significant contributions expected at ICSCRM 2025, although its commercial influence has declined [6] - The Japanese industry faces challenges related to generational turnover and a shortage of young talent, impacting the research environment for SiC [6] - Japan's strength lies in its comprehensive capabilities, leveraging expertise from silicon to SiC applications, particularly in high-voltage applications and data center power supplies [6]

Core Insights - India is transitioning from an electronics consumer to a potential global semiconductor manufacturing hub, with the approval of four new semiconductor projects worth ₹460 billion (approximately $5.53 billion) as part of the "India Semiconductor Mission" (ISM) [2][4] - The total number of projects approved under the ISM has now reached 10, with cumulative investments nearing ₹1.6 trillion, indicating a significant expansion of India's high-tech ecosystem [4] Strategic Leap in Chip Ecosystem - The new projects will be distributed across six states, including Odisha, Andhra Pradesh, and Punjab, fostering the development of new industrial clusters in emerging regions [4] - The establishment of advanced semiconductor manufacturing facilities is expected to create over 2,000 direct technical jobs and numerous indirect employment opportunities across the value chain [5] Key Projects and Innovations - SiCSem Private Limited in Odisha will establish India's first commercial compound semiconductor manufacturing plant focusing on silicon carbide (SiC) devices, crucial for defense, electric vehicles, and energy infrastructure [6] - 3D Glass Solutions in Odisha plans to build a state-of-the-art packaging and embedded glass substrate factory, introducing cutting-edge chip packaging technology [6] - ASIP Technologies in Andhra Pradesh will collaborate with Korea's APACT to establish a factory serving consumer electronics, automotive, and communication sectors [6] - Indian Continental Equipment Limited in Punjab will expand production of high-power devices like MOSFETs and IGBTs, directly related to renewable energy and electric vehicles [6] Reducing Import Dependency and Supply Chain Risks - The new factories will help India reduce its reliance on imports, as nearly 90% of advanced chips currently come from Taiwan, thereby enhancing economic resilience and reducing strategic vulnerabilities [7] Enhancing Export Competitiveness - Advanced packaging, manufacturing, and compound semiconductor technologies will position Indian-made chips competitively in the global supply chain, especially amid rising tensions between the US and China [8] - The semiconductor market is projected to reach $100 billion to $110 billion by 2030, positioning India as a reliable node in the trillion-dollar global semiconductor market [8] Fostering Innovation and Talent Pool - The ISM's collaboration with 72 startups and 278 academic partners ensures alignment between manufacturing advancements and R&D, with over 60,000 students currently receiving semiconductor-related skills training [9] Regional Growth and Emerging Industry Clusters - The establishment of cutting-edge factories in Odisha, Punjab, and Andhra Pradesh reflects the government's intent to decentralize high-tech growth, transforming local economies into technology-driven growth engines [9] Strategic Positioning and Global Partnerships - Collaborations with companies like Clas-SiC Wafer Fab from the UK and APACT from Korea indicate India's strategy to combine domestic potential with international best practices and technology transfer [11] Future Outlook - The first "Make in India" chips are expected to be produced by the end of 2025, marking a significant transformation for India as it aims for self-sufficiency and resilience in the semiconductor industry [13]

插播： 5月15日，"电动交通&数字能源SiC技术应用及供应链升级大会"活动将在上海举办， 三菱电机、意法半导体、Wolfspeed、三安半导体、天科合达、元山电子、大族半导体、香港 大学、长飞先进、宏微科技、利普思、昕感科技、国扬电子、国基南方、芯长征、合盛新材料、 国瓷功能材料等将出席本次会议，点击文章底部"阅读原文"即可报名参会。 前段时间，"行家说三代半"推送了第一篇《特斯拉技术专家访谈》 （ 链接 ） ，今天继续访谈后半段部分的 报道 ，分享 特斯拉专家他是如何看待 纳微、 英飞凌和 TI等氮化镓供应商，如何看待不同的氮化镓技术路线 。以下是他的核心观点节选： ● 我们并不关心氮化镓供应商是不是 Fabless， 最关心的是 他们 能否 英诺赛科、 ● 无论氮化镓企业如何做、做什么，对于汽车应用来说，大批量生产才是关键。如果他们没有统一 的封装标准，无法满足系统集成商所需的双供和多供要求。 解决质量和工艺问题。 ● 氮化镓供应商要具备良好的设计响应能力，尤其是在早期迭代 关键阶段。 ● GaN 的新锐公司之间不是关注内部竞争，更多的是考虑如何大力推广 ● 车规市场只有两家氮化镓供应商是不够的，三家是 ...