Core Insights - India is transitioning from an electronics consumer to a potential global semiconductor manufacturing hub, with the approval of four new semiconductor projects worth ₹460 billion (approximately $5.53 billion) as part of the "India Semiconductor Mission" (ISM) [2][4] - The total number of projects approved under the ISM has now reached 10, with cumulative investments nearing ₹1.6 trillion, indicating a significant expansion of India's high-tech ecosystem [4] Strategic Leap in Chip Ecosystem - The new projects will be distributed across six states, including Odisha, Andhra Pradesh, and Punjab, fostering the development of new industrial clusters in emerging regions [4] - The establishment of advanced semiconductor manufacturing facilities is expected to create over 2,000 direct technical jobs and numerous indirect employment opportunities across the value chain [5] Key Projects and Innovations - SiCSem Private Limited in Odisha will establish India's first commercial compound semiconductor manufacturing plant focusing on silicon carbide (SiC) devices, crucial for defense, electric vehicles, and energy infrastructure [6] - 3D Glass Solutions in Odisha plans to build a state-of-the-art packaging and embedded glass substrate factory, introducing cutting-edge chip packaging technology [6] - ASIP Technologies in Andhra Pradesh will collaborate with Korea's APACT to establish a factory serving consumer electronics, automotive, and communication sectors [6] - Indian Continental Equipment Limited in Punjab will expand production of high-power devices like MOSFETs and IGBTs, directly related to renewable energy and electric vehicles [6] Reducing Import Dependency and Supply Chain Risks - The new factories will help India reduce its reliance on imports, as nearly 90% of advanced chips currently come from Taiwan, thereby enhancing economic resilience and reducing strategic vulnerabilities [7] Enhancing Export Competitiveness - Advanced packaging, manufacturing, and compound semiconductor technologies will position Indian-made chips competitively in the global supply chain, especially amid rising tensions between the US and China [8] - The semiconductor market is projected to reach $100 billion to $110 billion by 2030, positioning India as a reliable node in the trillion-dollar global semiconductor market [8] Fostering Innovation and Talent Pool - The ISM's collaboration with 72 startups and 278 academic partners ensures alignment between manufacturing advancements and R&D, with over 60,000 students currently receiving semiconductor-related skills training [9] Regional Growth and Emerging Industry Clusters - The establishment of cutting-edge factories in Odisha, Punjab, and Andhra Pradesh reflects the government's intent to decentralize high-tech growth, transforming local economies into technology-driven growth engines [9] Strategic Positioning and Global Partnerships - Collaborations with companies like Clas-SiC Wafer Fab from the UK and APACT from Korea indicate India's strategy to combine domestic potential with international best practices and technology transfer [11] Future Outlook - The first "Make in India" chips are expected to be produced by the end of 2025, marking a significant transformation for India as it aims for self-sufficiency and resilience in the semiconductor industry [13]

插播： 5月15日，"电动交通&数字能源SiC技术应用及供应链升级大会"活动将在上海举办， 三菱电机、意法半导体、Wolfspeed、三安半导体、天科合达、元山电子、大族半导体、香港 大学、长飞先进、宏微科技、利普思、昕感科技、国扬电子、国基南方、芯长征、合盛新材料、 国瓷功能材料等将出席本次会议，点击文章底部"阅读原文"即可报名参会。 前段时间，"行家说三代半"推送了第一篇《特斯拉技术专家访谈》 （ 链接 ） ，今天继续访谈后半段部分的 报道 ，分享 特斯拉专家他是如何看待 纳微、 英飞凌和 TI等氮化镓供应商，如何看待不同的氮化镓技术路线 。以下是他的核心观点节选： ● 我们并不关心氮化镓供应商是不是 Fabless， 最关心的是 他们 能否 英诺赛科、 ● 无论氮化镓企业如何做、做什么，对于汽车应用来说，大批量生产才是关键。如果他们没有统一 的封装标准，无法满足系统集成商所需的双供和多供要求。 解决质量和工艺问题。 ● 氮化镓供应商要具备良好的设计响应能力，尤其是在早期迭代 关键阶段。 ● GaN 的新锐公司之间不是关注内部竞争，更多的是考虑如何大力推广 ● 车规市场只有两家氮化镓供应商是不够的，三家是 ...