Core Viewpoint - The article discusses the development and investment landscape of diamond-based composite materials, highlighting various companies involved in this sector and their technological advancements. Group 1: Company Overview - Changsha Shenghua Microelectronics Materials Co., Ltd. specializes in high-performance electronic packaging materials, including tungsten-copper and diamond-copper composites, with thermal conductivity reaching 600-800 W/m·K [5] - Nanjing Ruiwei New Materials Technology Co., Ltd. focuses on new materials for chip cooling, collaborating with Nanjing University of Aeronautics and Astronautics [6] - Hunan Xinfeng Advanced Materials, a subsidiary of Hunan Xinfeng Technology, is engaged in the research and production of diamond semiconductor materials, with a projected output of 50 tons in 2024 and 150 tons in 2025 [8] Group 2: Investment and Financing - Several companies have secured significant funding, such as Hunan Xinfeng Advanced Materials, which completed an A+ round of financing amounting to several million yuan in February 2025 [9] - Ningbo Saime Technology Co., Ltd. was established with investment from Jiangxi Copper Group, focusing on lightweight, high-thermal-conductivity composite materials for various applications [10] - Anhui Shangxin Crystal Technology Co., Ltd. has received angel round financing and is involved in the production of high-end refractory metals and diamond-copper composites [12] Group 3: Technological Advancements - Companies are developing advanced materials with high thermal conductivity, such as diamond-copper composites, which are essential for high-power semiconductor applications [33] - The industry is leveraging innovative manufacturing techniques, including chemical vapor deposition and powder metallurgy, to enhance material properties and production efficiency [24][25] - The market is witnessing a trend towards integrating diamond-based materials in various sectors, including aerospace, automotive, and electronics, due to their superior thermal management capabilities [42]

Core Viewpoint - The article discusses the development and investment landscape of diamond-based composite materials, highlighting various companies involved in this sector and their technological advancements. Company Overview - **Changsha Shenghua Microelectronics Materials Co., Ltd.** specializes in high-performance electronic packaging materials, including tungsten-copper and molybdenum-copper composites, with thermal conductivity reaching 600-800 W/m·K. The company has entered the supply chains of major players like Huawei and BYD for applications in 5G base stations and electric vehicles [5]. - **Nanjing Ruiwei New Materials Technology Co., Ltd.** focuses on new materials for chip cooling, collaborating with Nanjing University of Aeronautics and Astronautics. The company provides comprehensive thermal management solutions through thermal design and testing [6]. - **Xinfeng Advanced Materials** is a subsidiary of Hunan Xinfeng Technology, established in 2019, specializing in semiconductor materials and diamond-based composites. The company aims to produce 50 tons of high-performance low-cost diamond-copper materials by 2024, with plans to expand to 150 tons by 2025 [8]. - **Ningbo Saime Technology Co., Ltd.** was founded in 2018, focusing on lightweight, high-thermal-conductivity composite materials for applications in power chip packaging and 5G communications [9]. - **Anhui Shangxin Crystal Technology Co., Ltd.** specializes in high-end refractory metals and diamond-copper/aluminum composites, with a focus on medical and optical applications [12]. Investment Landscape - Various companies have secured funding rounds, indicating a growing interest in diamond-based composite materials. For instance, **Nanjing Ruiwei** completed an A+ round with several million yuan in funding [9]. - **Ningbo Saime Technology** has also attracted investment from major players like Jiangxi Copper Group, reflecting the strategic importance of this sector [10]. - **Haitexin New Materials Technology Co., Ltd.** is set to become a leading manufacturer of microelectronic packaging materials, with significant investments in production facilities [17]. Technological Advancements - Companies are leveraging advanced technologies such as chemical vapor deposition (CVD) and high-pressure high-temperature (HPHT) processes to enhance the performance of diamond-based materials [29]. - The thermal conductivity of diamond-copper composites is highlighted, with some products achieving thermal conductivity rates of 1800-2200 W/m·K, significantly outperforming traditional materials [30]. - The industry is witnessing innovations in manufacturing techniques, such as the development of ultra-thin diamond heat sinks and composite materials tailored for specific applications in aerospace and defense [22][24].