风冷技术
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AI训练引爆散热革命?高盛:液冷明年全面超风冷,年复合增长超100%!
美股IPO· 2025-11-05 13:15
Core Insights - The global server cooling market is experiencing structural growth opportunities, with a projected total scale of $17.6 billion by 2027, driven primarily by AI training servers with a compound annual growth rate (CAGR) of 101% [1][6][7] Market Growth Projections - The server cooling market is expected to grow by 111%, 77%, and 26% year-on-year from 2025 to 2027, reaching $17.6 billion by 2027 [6][8] - The liquid cooling market is anticipated to grow from $1.2 billion in 2024 to $15.2 billion in 2027, while the air cooling market remains relatively stable [7] Liquid Cooling Penetration - Liquid cooling penetration for AI training servers is projected to rise from 15% in 2024 to 80% by 2027, with significant differentiation in penetration rates across segments [3][9] - Full rack AI training servers have already achieved 100% liquid cooling penetration, becoming a key market driver [3] Segment Analysis - The AI training server cooling market is expected to expand from $4.5 billion in 2025 to $12.4 billion in 2027, showcasing strong growth momentum [2][9] - In contrast, the general/HPC and AI inference server cooling markets are projected to grow more modestly, from $3.4 billion in 2025 to $5.1 billion in 2027 [9] Component Innovations - Key components in the liquid cooling segment, such as cold plates, manifolds, and CDU/RPU, are expected to see significant growth, while traditional components like 3D VC and heat sinks will grow at a more stable rate [10] - Innovative cooling designs are being developed to meet the increasing thermal demands of AI servers, including 3D printed cold plates and microchannel solutions [11][12]
AI训练引爆散热革命?高盛:液冷明年全面超风冷,年复合增长超100%!
Hua Er Jie Jian Wen· 2025-11-05 11:43
Core Insights - The global server cooling market is experiencing structural growth opportunities driven by increased AI server shipments and rapid penetration of liquid cooling technology, with projections indicating a market size of $17.6 billion by 2027 [1][3]. Market Growth Projections - The global server cooling market is expected to grow by 111% in 2025, 77% in 2026, and 26% in 2027, reaching $17.6 billion by 2027 [1][3]. - The AI training server cooling market is projected to expand from $1.5 billion in 2024 to $12.4 billion in 2027, with a compound annual growth rate (CAGR) of 101% [1][3]. Liquid Cooling Penetration - Liquid cooling penetration for AI training servers is forecasted to rise from 15% in 2024 to 80% by 2027, with significant differentiation in penetration rates across market segments [2][4]. - Full rack AI training servers have achieved 100% liquid cooling penetration, becoming a key market driver [2]. Market Dynamics - The liquid cooling segment is expected to grow from $1.2 billion in 2024 to $15.2 billion by 2027, while the air cooling market remains relatively stable [3][4]. - The market is anticipated to peak in growth rate in 2025 before gradually declining, yet still maintaining strong growth [3]. Segment Analysis - The AI training server cooling market is expected to dominate, with growth from $4.5 billion in 2025 to $12.4 billion in 2027, while the general/HPC and AI inference server cooling markets will see more moderate growth [4]. - Liquid cooling penetration in the AI training server market is projected to reach 80% by 2027, indicating a clear technological direction [4]. Innovation and Supplier Requirements - Innovative cooling designs are being developed to meet the increasing thermal demands of AI servers, with a focus on enhancing both the quantity and value of cooling components [5]. - Suppliers are required to enhance their customization capabilities, design responsiveness, and production capacity to support new product introductions [5]. Component Innovations - New cooling technologies include 3D printed cold plates and microchannel solutions, which improve heat exchange efficiency [6].
藏在算力背后的 “降温术”:数据中心热管理全解析
DT新材料· 2025-10-20 16:05
Core Viewpoint - The article emphasizes the critical importance of cooling technologies in data centers, particularly in the context of rising AI computing densities and the need for efficient heat management solutions [5][24]. Cooling Technology Evolution - The main cooling technologies are categorized into air cooling and liquid cooling, with air cooling further divided into natural and forced air cooling, while liquid cooling includes direct and indirect methods [6][13]. - The demand for innovative cooling solutions is driven by increasing power densities in data cabinets, necessitating significant improvements in heat transfer rates to ensure stable and efficient data center operations [8]. Air Cooling Technology - Forced air cooling is the most widely used method in data centers, utilizing fans to enhance airflow and cooling efficiency, while air conditioning and fresh air cooling are the primary techniques employed [9][11]. - Fresh air cooling systems, such as Distributed Airflow Cooling Systems (DACS) and Blowing and Suction Ventilation Cooling Systems (BDVCS), have shown rapid development and can significantly reduce cooling costs, especially in temperate or cold regions [12]. Liquid Cooling Technology - Liquid cooling utilizes high thermal conductivity liquids to replace air for heat dissipation, making it particularly suitable for high-density and high-power data center environments [13][23]. - The two main types of liquid cooling are indirect and direct liquid cooling, with indirect cooling involving heat exchange through conduits and direct cooling allowing liquids to contact heat-generating components directly [14][17]. Direct Liquid Cooling Methods - Single-phase immersion cooling involves submerging IT equipment in an insulating liquid, effectively transferring heat to an external cooling source [19]. - Two-phase immersion cooling utilizes a coolant with a boiling point lower than the operating temperature of the equipment, allowing for efficient heat absorption through phase change [20]. - Single-phase spray cooling sprays a cooling medium onto heat-generating surfaces, achieving high cooling efficiency but requiring careful design to prevent contamination [21]. Market Demand and Trends - The demand for liquid cooling solutions is increasing as computational power continues to rise, with single-phase cold plate cooling currently dominating the market [23]. - The latest advancements in computing technology, such as NVIDIA's GB200 module, highlight the limitations of traditional air cooling, which struggles to manage the heat generated by high-performance systems [24]. - Policies in China, such as the "East Data West Computing" strategy, aim to reduce energy usage in data centers, further driving the adoption of liquid cooling technologies [24][25]. Economic Benefits - In AI training scenarios, approximately 30% of energy costs are attributed to cooling, with liquid cooling systems significantly reducing Power Usage Effectiveness (PUE) compared to traditional methods [25]. - The implementation of liquid cooling can lead to substantial annual savings in electricity costs for medium to large data centers, reinforcing its position as a key development area in cooling technology [25].
佳力图(603912.SH):目前技术储备既有风冷技术也有液冷技术
Ge Long Hui A P P· 2025-08-26 08:05
Core Viewpoint - The company, Jialitu (603912.SH), has announced its current technological reserves include both air cooling and liquid cooling technologies, with a focus on developing CPU liquid cooling technology [1] Group 1: Liquid Cooling Technology Development - The main objectives and content of the liquid cooling technology development include the integration of liquid cooling systems [1] - Research on the advantages and disadvantages of cold plate and immersion systems is part of the development process [1] - The design of liquid cooling systems is a key focus area [1] - Research on boiling heat transfer is included in the development goals [1] - Studies on cooling liquid cooling are also part of the company's research efforts [1] - Application research for liquid cooling systems is being conducted [1]
液冷行业深度:智算需求驱动冷却技术升级,液冷生态迎成长契机
2025-07-02 15:49
Summary of Liquid Cooling Industry Research Industry Overview - The liquid cooling industry is experiencing rapid growth driven by the increasing demand for high computing power and policy guidance, with the penetration rate expected to exceed 20% by 2025 from approximately 10% in 2024, although air cooling remains dominant [1][6][9]. Key Points and Arguments - **Data Center PUE Reduction Policies**: National policies require that by the end of 2025, new and renovated large data centers must achieve a Power Usage Effectiveness (PUE) of below 1.25, with key nodes not exceeding 1.2, and the national average PUE below 1.5. Recent data shows a decrease to 1.26 [1][9]. - **Smart Computing Drives Liquid Cooling Development**: The reliance on high-power chips like NVIDIA's Blackwell series necessitates more effective cooling solutions, as these chips generate significantly higher heat compared to traditional data centers [1][8]. - **Importance of Stable Temperature and Humidity**: A 10-degree increase in server temperature can reduce equipment reliability and lifespan by 50%. Data center failures can lead to decreased operational efficiency and potential data loss [1][5]. - **Liquid Cooling Technology Types**: The main types of liquid cooling technologies include cold plate, silent, and spray cooling, with cold plate systems currently being the most widely deployed [1][3][19]. - **Investment Opportunities**: Recommendations include focusing on integrated solution providers and high-value, low domestic production component suppliers, which are expected to meet the growing data processing demands while aligning with green development goals [10][20]. Additional Important Content - **PUE Definition and Importance**: PUE is a critical metric for assessing data center energy efficiency, with lower values indicating better efficiency. Liquid cooling technologies can help achieve lower PUE by improving thermal management [11][12]. - **Liquid Cooling System Components**: Key components of liquid cooling systems include the cold distribution unit (CDU), which manages heat transfer, and various cooling sources that can be natural or mechanical [14][16]. - **Risks and Challenges**: Potential risks include underwhelming computing demand, insufficient chip supply, international trade tensions, and increased industry competition [21].