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小米16大曝光,5款新机全部确认!
猿大侠· 2025-08-06 04:11
兄弟们,大家中午好。 在很久之前,高通就已经官宣过, 将 在 2025 年骁龙峰会将于 9 月 23 日至 25 日举行。 届时,将会发布新一代的 骁龙 8 至尊版处理器,内部代号 SM8850 。 后续博主爆料, 这款芯片的官方大名将会是 骁龙 8 Elite Gen2。 众所周知,每年新一代骁龙发布,都会引起一股安卓圈的腥风血雨。 不管是首发之战,还是性能大战,都很有看头。 进入8月份之后, 各个安卓友商们都开始了自家新旗舰的预热。 首当其冲的还是小米。 据 AndroidCentral 报道,高通将进一步深化了与小米的合作,为中国市场多代设备提供芯片支持。 小米将成为首家推出搭载高通下一代骁龙 8 Elite 芯片手机的厂商。 看到消息并没有很意外,毕竟最近几年,小米都凭借着自身的实力和热度,稳坐首发之位。 这段时间, 小米16系列的热度更是居高不下。 咱们一起来看一看今年的小米旗舰到底都有哪些升级吧。 1、新增机型 以往,新旗舰是有4款机型,但是今年据说是有5款。 目前曝光的有 小米 16、小米 16 Pro、小米 16 Pro Max、小米 16 Ultra。 以及还有一款 小米 16 Ultra ...
消息称三星加速1c DRAM工艺量产LPDDR6内存 计划下半年供货高通
Huan Qiu Wang· 2025-06-07 03:45
Group 1 - Samsung Electronics' Device Solutions (DS) division plans to mass-produce the next-generation LPDDR6 memory using the sixth-generation "1c DRAM" process in the second half of this year [1][3] - The 1c DRAM technology offers higher transistor density and better energy efficiency compared to previous generations, with cold yield rates reaching 50% and hot yield rates between 60%-70% [3][4] - Samsung aims to supply LPDDR6 memory to major tech companies like Qualcomm, enhancing its presence in the smartphone, laptop, and AI server markets [4] Group 2 - China’s Changxin Memory Technologies (CXMT) has completed the development phase of LPDDR5X memory and is working to close the technology gap with Samsung, potentially achieving mass production by 2026 [3] - Samsung is accelerating its LPDDR6 memory technology development in response to CXMT's advancements [3][4] - The upcoming Qualcomm Snapdragon 8 Elite Gen2 chip will be the first to support LPDDR6 memory, set to be unveiled at the Snapdragon Summit on September 23 [3] Group 3 - Samsung is also deploying 1c DRAM technology in high-end storage products like HBM4, aiming to create a comprehensive memory solution for AI applications [4] - The company has established an expansion plan for 1c DRAM, with production line construction in its Hwaseong factory expected to be completed by the end of this year [4] - Samsung is concurrently developing 1c DRAM for both DDR and LPDDR applications, breaking traditional development sequences to accelerate commercialization [4]