Group 1 - The article discusses the potential for significant global upheaval, suggesting that a major restructuring of international power dynamics is imminent, particularly between the US and China [1][3] - It highlights the decline of the US dollar's dominance in international finance, with its usage dropping from 59.3% in 2021 to 56.2% in 2022, while the Chinese yuan and other currencies are gaining traction [3] - The article points out that the US is facing multiple domestic challenges, including a GDP growth rate of only 1.8% last year and declining consumer confidence [3][5] Group 2 - The military capabilities of the US are reportedly diminishing, with a reduction in global troop deployment and a military budget growth rate lagging behind the depreciation of its combat power [5] - The ongoing conflict in Ukraine has destabilized Europe, leading to a decline in Germany's industrial output and a GDP growth rate that fell to 0.4% in 2019, indicating economic stagnation [5][7] - China's advancements in technology, particularly in the semiconductor industry, are notable, with a reported industry output of over 800 billion yuan in 2022, reflecting a 12% year-on-year growth [7][8] Group 3 - The article raises concerns about the potential for conflict as nations prepare for possible upheaval, suggesting that the current global situation is precarious and could lead to significant changes [8][10] - It emphasizes the uncertainty surrounding the future leadership of global powers and the potential for ordinary citizens to face increasing difficulties as geopolitical tensions rise [8][10]

Core Viewpoint - The article discusses the development trends of intelligent computing chips and edge AI chips amidst the AI boom, highlighting the challenges and solutions in testing high-speed chips and the importance of interface compatibility in consumer-side chips [1]. Group 1: Event Overview - The seminar on high-speed chip testing technology will be held on May 21, organized by Nanjing Integrated Circuit Industry Service Center (ICisC) and Keysight [1]. - The event aims to explore popular semiconductor technologies for 2025 and testing methods for high-speed chips, covering PCIe 5.0/6.0, Ethernet, MIPI, and USB technologies [1]. Group 2: Seminar Highlights - The seminar will feature expert discussions on high-speed interface testing technologies, with opportunities for attendees to ask questions [2]. - Attendees will have the chance to observe high-speed chip testing processes in the ICisC laboratory [2]. - The event encourages deep exchanges among professionals in chip design, IP, EDA, and packaging sectors [2]. Group 3: Agenda - The agenda includes a welcome speech, an introduction to ICisC platform business, discussions on key technologies and measurement of intelligent computing chips, post-silicon validation of SoC chip interfaces, challenges in consumer-side chip testing, and a technical salon [9].

AI热潮中的智算芯片、端测AI芯片有哪些发展趋势，如何对其进行精准测量？ SoC芯片高速接口的硅后验证有哪些难点，又如何解决？ 5月21日 13:30 - 17:30 消费类端侧芯片的应用愈加广泛，对接口兼容性的要求也愈发严格，接口测试会遇到哪些新 挑战，有哪些解决方案？ 高速芯片在实际测试过程中有哪些注意事项，可能会遇到哪些难点？ 当下，对高速、低延迟数据传输的需求激增，对高速芯片的需求也日益增高。但是，对于高速芯片 的检测仍有不少痛点亟待解决。 在此背景下， 5月21日 ，由南京集成电路产业服务中心（ICisC）及合作伙伴是德科技 （Keysight）联合举办的 是德科技 & 南京ICisC 高速芯片测试技术研讨会 将在 南京 举行。本 次研讨会旨在探讨2025年热门的半导体技术，以及高速芯片的测试方法。内容囊括 PCIe 5.0/6.0 技术、以太网技术、MIPI 与 USB 技术等， 现场还将参观 ICisC，观摩高速芯片实测。 现场用户均有精美的伴手礼相赠，欢迎大家参会！ 扫描下方二维码 报名参会 会议时间： 地点： 南京江北新区华富路1号数智溪谷4号楼国家集成电路芯火平台(南京)7楼芯咖啡 会议亮 ...