Group 1 - The article discusses the potential for significant global upheaval, suggesting that a major restructuring of international power dynamics is imminent, particularly between the US and China [1][3] - It highlights the decline of the US dollar's dominance in international finance, with its usage dropping from 59.3% in 2021 to 56.2% in 2022, while the Chinese yuan and other currencies are gaining traction [3] - The article points out that the US is facing multiple domestic challenges, including a GDP growth rate of only 1.8% last year and declining consumer confidence [3][5] Group 2 - The military capabilities of the US are reportedly diminishing, with a reduction in global troop deployment and a military budget growth rate lagging behind the depreciation of its combat power [5] - The ongoing conflict in Ukraine has destabilized Europe, leading to a decline in Germany's industrial output and a GDP growth rate that fell to 0.4% in 2019, indicating economic stagnation [5][7] - China's advancements in technology, particularly in the semiconductor industry, are notable, with a reported industry output of over 800 billion yuan in 2022, reflecting a 12% year-on-year growth [7][8] Group 3 - The article raises concerns about the potential for conflict as nations prepare for possible upheaval, suggesting that the current global situation is precarious and could lead to significant changes [8][10] - It emphasizes the uncertainty surrounding the future leadership of global powers and the potential for ordinary citizens to face increasing difficulties as geopolitical tensions rise [8][10]

Core Viewpoint - The article discusses the development trends of intelligent computing chips and edge AI chips amidst the AI boom, highlighting the challenges and solutions in testing high-speed chips and the importance of interface compatibility in consumer-side chips [1]. Group 1: Event Overview - The seminar on high-speed chip testing technology will be held on May 21, organized by Nanjing Integrated Circuit Industry Service Center (ICisC) and Keysight [1]. - The event aims to explore popular semiconductor technologies for 2025 and testing methods for high-speed chips, covering PCIe 5.0/6.0, Ethernet, MIPI, and USB technologies [1]. Group 2: Seminar Highlights - The seminar will feature expert discussions on high-speed interface testing technologies, with opportunities for attendees to ask questions [2]. - Attendees will have the chance to observe high-speed chip testing processes in the ICisC laboratory [2]. - The event encourages deep exchanges among professionals in chip design, IP, EDA, and packaging sectors [2]. Group 3: Agenda - The agenda includes a welcome speech, an introduction to ICisC platform business, discussions on key technologies and measurement of intelligent computing chips, post-silicon validation of SoC chip interfaces, challenges in consumer-side chip testing, and a technical salon [9].

Core Insights - The article discusses the development trends of intelligent computing chips and edge AI chips amidst the AI boom, highlighting the increasing demand for high-speed chips and the challenges in testing them [1] - A seminar on high-speed chip testing technology will be held on May 21, organized by Nanjing Integrated Circuit Industry Service Center (ICisC) and Keysight Technologies, focusing on semiconductor technologies popular in 2025 [1][9] Event Details - The seminar will take place on May 21 from 13:30 to 17:30 at Nanjing Jiangbei New District, featuring expert discussions on PCIe 5.0/6.0, Ethernet, MIPI, and USB testing technologies [2][9] - Attendees will have the opportunity to observe high-speed chip testing processes in the ICisC laboratory [2][9] Agenda Highlights - The agenda includes a welcome address, an introduction to ICisC platform business, discussions on key technologies and measurements for intelligent computing chips, post-silicon validation of SoC chip high-speed interfaces, and challenges in testing consumer-side chips [8][9] - The event will also feature a technical salon for in-depth discussions and networking opportunities among professionals in chip design, IP, EDA, and packaging [2][8]