Core Viewpoint - The article discusses the shift towards Fan-Out Panel Level Packaging (FOPLP) as a new mainstream for AI chip packaging, with major companies like TSMC, ASE, and others investing in this technology to increase production and reduce costs [1][2]. Group 1: Industry Trends - FOPLP is expected to replace CoWoS as the leading technology for AI chip packaging, with a focus on enhancing the yield of large-sized AI chips and lowering production costs [1]. - TSMC is constructing a pilot production line for FOPLP in Taoyuan, aiming for small-scale trial production by 2027, utilizing a smaller substrate size of 310mm x 310mm compared to previous attempts [1]. Group 2: Company Strategies - ASE has been investing in FOPLP for over a decade, with a $200 million investment in equipment to establish a production line in Kaohsiung, expected to begin trial production by the end of this year [2]. - Powertech Technology has begun small-scale shipments of FOPLP and is validating high-end products for a major client, with packaging costs reaching $25,000 for advanced SoC designs [2]. - Innolux has validated its FOPLP products and plans to ramp up production by 2025, anticipating that the AI boom will drive demand for high-end chips [2]. Group 3: Technological Developments - Innolux's Chip First technology aims to reduce die size and costs while maintaining high I/O density and lower packaging thickness, suitable for various advanced applications [3]. - The company has outlined a roadmap for FOPLP technology, with Chip First technology set for mass production this year, followed by RDL First technology in one to two years, and TGV technology in two to three years [3].