公众号记得加星标⭐️，第一时间看推送不会错过。 人工智能（AI）热潮让南韩半导体出口重心转向！据南韩国际贸易协会（KITA）最新数据显示，受 AI供应链推升，台湾已跃升为南韩记忆体出口成长最快的市场，年增率几近翻倍，主因在于大量南韩 记忆体需先「过水」台湾，交由台积电进行关键的先进封装与后段制程，最后再交给美国客户辉达。 韩 媒 BusinessKorea 报 导 ， 去 年 南 韩 全 球 记 忆 体 半 导 体 出 口 总 额 达 到 946.1 亿 美 元 （ 约 新 台 币 3 兆 元）， 其中，对中国大陆出口金额为309.9亿美元，占总出口比重降至32.7%；对比过去大陆曾一度 吸收近7 成南韩半导体的盛况，如今已大幅下滑，从2018年起的50%左右，到2024 年已回落至约 30%。 相较于大陆市场的走弱，南韩对台湾的出口表现极为亮眼。去年南韩对台记忆体出口达270.8 亿美元 （约新台币8598亿元），较前一年的144.6 亿美元暴增87.2%。 台湾在南韩记忆体总出口中的占比， 已从2020年的6%飙升至去年的28.6%，出口市场排名跃居第二，与第一名中国大陆的差距已微乎其 微。 这项结构性转 ...

Core Viewpoint - The article discusses the shift towards Fan-Out Panel Level Packaging (FOPLP) as a new mainstream for AI chip packaging, with major companies like TSMC, ASE, and others investing in this technology to increase production and reduce costs [1][2]. Group 1: Industry Trends - FOPLP is expected to replace CoWoS as the leading technology for AI chip packaging, with a focus on enhancing the yield of large-sized AI chips and lowering production costs [1]. - TSMC is constructing a pilot production line for FOPLP in Taoyuan, aiming for small-scale trial production by 2027, utilizing a smaller substrate size of 310mm x 310mm compared to previous attempts [1]. Group 2: Company Strategies - ASE has been investing in FOPLP for over a decade, with a $200 million investment in equipment to establish a production line in Kaohsiung, expected to begin trial production by the end of this year [2]. - Powertech Technology has begun small-scale shipments of FOPLP and is validating high-end products for a major client, with packaging costs reaching $25,000 for advanced SoC designs [2]. - Innolux has validated its FOPLP products and plans to ramp up production by 2025, anticipating that the AI boom will drive demand for high-end chips [2]. Group 3: Technological Developments - Innolux's Chip First technology aims to reduce die size and costs while maintaining high I/O density and lower packaging thickness, suitable for various advanced applications [3]. - The company has outlined a roadmap for FOPLP technology, with Chip First technology set for mass production this year, followed by RDL First technology in one to two years, and TGV technology in two to three years [3].