Group 1 - The telecom business revenue in China reached 1,043.1 billion yuan in the first seven months, showing a year-on-year growth of 0.7%. The total telecom business volume, calculated at constant prices from the previous year, increased by 8.9% [1] - In July, China's optical module exports decreased significantly, with a year-on-year drop of 30% for the month and a cumulative decline of 14% from January to July. This is attributed to domestic optical module companies establishing factories overseas [1] - Major cloud service providers, including Microsoft, Google, Meta, and Amazon, reported substantial capital expenditures in Q2 2025, with increases of 28%, 70%, 102%, and 91% respectively [1] Group 2 - Huawei announced its Ascend AI chip and Kunpeng CPU technology roadmap at the 2025 Connect Conference, planning to launch the Ascend 950PR chip with a computing power of 1 PFLOPS by 2026 [2] - The optical communication sector has experienced significant volatility recently, but strong demand for AI computing power indicates that the fundamentals of the optical module industry remain solid. The AI-driven computing expansion cycle is far from over [2] - As of September 23, 2025, the Guozheng Communication Index rose by 2.04%, with the Guangfa Communication ETF (159507) increasing by 2.23%, marking six consecutive days of gains [2]

Core Insights - Huawei unexpectedly revealed its future chip roadmap during the Huawei Connect 2025 event, showcasing several new chips including the Ascend 950, 960, and 970 series for AI computing, as well as the Kunpeng 950 and 960 processors for general computing [1][3][10] Group 1: Chip Developments - The Ascend 950 series chips will support low-precision data formats and achieve computing power of 1P and 2P, enhancing training efficiency and inference throughput [3][10] - The Ascend 960 is planned to double the performance of the Ascend 950 and will support Huawei's self-developed HiF4 data format, set to launch in Q4 2027 [7] - The Ascend 970 will further enhance specifications compared to the Ascend 960, with plans for release in Q4 2028 [7] Group 2: Supernode and Cluster Innovations - Huawei introduced the Atlas 950 supernode, which will consist of 8192 Ascend 950DT chips, achieving FP8 computing power of 8E FLOPS and FP4 computing power of 16E FLOPS, set to launch in Q4 2026 [11][13] - The Atlas 960 supernode, planned for Q4 2027, will be based on 15488 Ascend 960 chips, with FP8 computing power reaching 30E FLOPS and FP4 computing power reaching 60E FLOPS [13] - The Atlas 950 SuperCluster will consist of 64 Atlas 950 supernodes, achieving FP8 computing power of 524 EFLOPS, making it the world's strongest computing cluster [18] Group 3: Software and Ecosystem Development - Huawei aims to develop a robust software ecosystem to complement its hardware, with the CANN deep learning framework and MindSpore framework serving as alternatives to NVIDIA's CUDA [21][22] - The company plans to open-source its CANN compiler and virtual instruction set interface by the end of 2025, along with the Mind series application tools [22][24] - Huawei's strategy emphasizes hardware evolution through existing chip technology while fostering an open-source ecosystem to address challenges posed by U.S. sanctions [24]