Workflow
2.5D/3D集成电路封装测试
icon
Search documents
华天科技(002185.SZ)拟20亿元设立华天先进 开展2.5D/3D集成电路封装测试业务
智通财经网· 2025-08-01 09:20
Core Viewpoint - Huatian Technology (002185.SZ) plans to establish a wholly-owned subsidiary, Nanjing Huatian Advanced Packaging Co., Ltd., with a total registered capital of 2 billion yuan to enhance its investment in advanced packaging business, specifically in 2.5D/3D integrated circuit packaging and testing [1]. Group 1 - The new subsidiary will focus on 2.5D/3D integrated circuit packaging and testing [1]. - The establishment of Nanjing Huatian Advanced Packaging is part of the company's strategy to accelerate the development of advanced packaging business [1]. - The total registered capital for the new company is set at 2 billion yuan [1].
华天科技:拟20亿元设立2.5D/3D集成电路封装测试公司 抢抓先进封装市场先机
news flash· 2025-08-01 09:09
Group 1 - The company plans to establish a wholly-owned subsidiary, Nanjing Huaten Advanced Packaging Co., Ltd., with a total registered capital of 2 billion yuan [1] - The investment will be contributed by Huaten Jiangsu (1 billion yuan, 50%), Huaten Kunshan (665 million yuan, 33.25%), and Advanced No. 1 (335 million yuan, 16.75%) [1] - The new company will focus on 2.5D/3D integrated circuit packaging and testing, aiming to seize opportunities in the advanced packaging market and enhance the company's competitive capabilities [1]