公司研发方向聚焦于300mm半导体硅片及300mm SOI硅片关键技术突破，重点布局面向AI应用的高算 力芯片、功率器件、人工智能与数据中心等新兴高成长性应用领域。这些研发方向精准对应当前国内 300mm半导体硅片在先进制程产品和特殊规格产品等高端产品方面的结构性缺口，公司正以高强度的 研发投入和技术创新加速实现新形势下全面国产化供应保障的战略使命。 高研发强度有效推动技术迭代与产品组合拓宽。2025年上半年，公司新开发300mm硅片产品50余款， 累计通过认证的产品规格已超过820款，覆盖客户数量超过100家，产品广泛应用于逻辑芯片、存储器、 图像传感器、功率器件等领域，这些研发布局共同支撑了公司在多领域的技术迭代与市场渗透，技术广 度和纵深得到同步拓展，为公司把握行业上行周期、深耕国内外市场奠定了重要基础。 产能建设稳步推进 多元化布局成效渐显 转自：中国证券报·中证网 中证报中证网讯（王珞）在半导体硅片行业整体复苏但价格压力仍存的复杂环境下，沪硅产业正通过技 术攻坚与规模扩张双轮驱动，强化其在300mm大硅片领域的领先地位，并积极调整产品结构以应对 200mm市场的疲软和竞争压力。 10月30日晚间，沪 ...

Core Viewpoint - The company, Hu Silicon Industry, reported a revenue of 2.641 billion yuan for the first three quarters of 2025, reflecting a year-on-year growth of 6.56%, with third-quarter revenue reaching 940 million yuan [1] Group 1: Financial Performance - For the first three quarters of 2025, the company achieved a total revenue of 2.641 billion yuan, marking a 6.56% increase year-on-year [1] - The third-quarter revenue was reported at 940 million yuan [1] Group 2: Research and Development - The company invested a total of 253 million yuan in R&D for the first three quarters of 2025, which is a 21.63% increase compared to the previous year [1] - The R&D focus is on breakthroughs in 300mm semiconductor wafers and 300mm SOI wafers, targeting high-performance chips for AI applications and emerging high-growth sectors [1] Group 3: Production Capacity and Strategy - The company is advancing its capacity upgrade project for 300mm semiconductor wafers in Taiyuan, with combined production capacity in Shanghai and Taiyuan reaching 8 million pieces per month as of June 2025 [1] - In response to market challenges for products below 200mm, the company is actively pursuing a transformation strategy, with subsidiaries Okmetic and New Ao Technology achieving a combined capacity of over 500,000 pieces per month for polishing and epitaxial wafers [1] - The company has established a pilot line for 300mm SOI with an annual capacity of 80,000 pieces, successfully delivering samples to multiple clients [1]

Core Viewpoint - The company reported a revenue increase but continued to face net losses due to pricing pressures and market demand fluctuations in the semiconductor industry [1][2]. Financial Performance - For the first three quarters of 2025, the company achieved a revenue of 2.641 billion yuan, a year-on-year increase of 6.56%, while the net profit attributable to shareholders was a loss of 631 million yuan [1]. - In the third quarter, the revenue was 944 million yuan, reflecting a year-on-year growth of 3.79%, with a net profit loss of 265 million yuan [1]. Sales and Market Dynamics - The sales volume of 300mm semiconductor wafers increased by over 30% year-on-year, but the revenue growth was limited to approximately 16% due to price pressures [1]. - Conversely, the sales volume of 200mm semiconductor wafers decreased by about 10%, and revenue from contract processing services significantly declined due to weak end-market demand [1]. R&D Investment - The company invested a total of 253 million yuan in R&D for the first three quarters, marking a year-on-year increase of 21.63%, with the third quarter alone seeing an investment of 97.6 million yuan, up 15.42% [2]. - R&D efforts are focused on breakthroughs in 300mm semiconductor wafers and 300mm SOI wafers, targeting high-growth applications in AI, power devices, and data centers [2]. Production Capacity - As of June 2025, the company's combined production capacity for 300mm semiconductor wafers in Shanghai and Taiyuan reached 750,000 pieces per month, maintaining a leading position in China [2]. - The company plans to expand the production capacity of its 300mm SOI pilot line to 160,000 pieces per year by the end of 2025, covering high-end applications such as RF, silicon photonics, and automotive-grade high-voltage devices [3]. Industry Outlook - According to SEMI, China's investment in 300mm equipment is expected to reach $94 billion between 2026 and 2028, with significant growth in equipment spending for chip manufacturing in 2025 and 2026 [3]. - The number of mass production factories for 300mm chips in China is projected to increase from 62 at the end of 2024 to over 70 by the end of 2026, driving further demand for 300mm semiconductor wafers [3].