Core Insights - The company is focusing on the growing demand for computing power and the continuous upgrade of optical communication networks, with its self-developed 3D SPI and 3D AOI products being applicable in the optical communication field [1][3] - The company’s core products are designed to enhance process stability and yield in semiconductor advanced packaging processes by inspecting solder paste, chip solder balls, and solder paste quality [3] - The upcoming development of the third optical inspection equipment in 2024 will enable inspections across various processes, including flux, system-in-package (SIP), die bonding, wire bonding, and flip chip bonding [3] - Industry experts believe that the acceleration of upgrades in the optical communication and semiconductor supply chains will allow the company's detection products to achieve broader import substitution in high-precision application scenarios, thereby enhancing its market competitiveness in the intelligent detection equipment sector [3]

Core Viewpoint - The company, Systech (301568), is advancing in the semiconductor packaging process with its self-developed core products, 3DSPI and 3DAOI, which are designed for detecting solder paste quality in semiconductor back-end packaging [1] Group 1: Product Development - The company is set to launch a new optical inspection device, the three-light machine, in 2024, which will enhance detection capabilities for various semiconductor processes including flux, system-in-package (SIP), die bonding, wire bonding, and flip chip bonding [1] - The products developed by the company aim to achieve import substitution in the semiconductor industry [1]

每经AI快讯，有投资者在投资者互动平台提问：公司产品可以用在光通信的检测吗？ 思泰克（301568.SZ）9月26日在投资者互动平台表示，随着算力需求发展，光通信网络持续迭代升级， 光模块800G、1.6T将逐步成为标配。公司自研的3D SPI和3D AOI可充分应用于光通信领域，适用光模 块线路板制程环节的检测。 （文章来源：每日经济新闻） ...