Workflow
3D DRAM产品
icon
Search documents
坚定不移看好端侧AI
Jin Tou Wang· 2025-12-05 00:33
近期字节跳动旗下豆包手机助手的发布,成为消费电子行业的标志性事件。 这款搭载在努比亚M153工程样机上的AI应用,以系统级交互、跨APP执行等颠覆性功能,正式宣告手 机端侧AI进入"Agent时代"。更可能是智能手机行业换机潮的起点。 01 手机交互逻辑被重新定义 豆包手机助手的核心颠覆性,在于其真正实现了"类人化"的手机操作能力。 与传统智能助手的单一指令响应不同,它凭借系统级操作权限与豆包大模型的语义理解能力,可模拟点 击、滑动、输入等动作,完成复杂的跨应用任务,且任务成功率超80%,大幅超出市场预期。 系统级交互上,支持语音、侧边AI键、蓝牙耳机三重唤醒,可实现屏幕内容实时问答、声纹解锁、高 清视频通话等功能,无需打开APP即可随时召唤助手,尤其适合远程指导、学习辅助等场景; 跨APP执行是核心突破,用户可指令助手对比多平台肯德基鸡翅价格并下单,或自动修改微信图片颜色 并回传,甚至完成飞书请假订票、物流一键查询、批量领券等复合任务,仅在支付等关键环节交由用户 接管,兼顾效率与安全; 定时任务功能可实现微博热搜定时截图存档、滴滴优惠券每日自动领取等自动化操作;而后台静默运行 设计,让AI任务在顶部状态栏完 ...
北京君正:公司存储芯片目前根据市场综合情况,对部分客户价格进行了一定的调整
Zheng Quan Ri Bao Wang· 2025-10-24 10:44
Core Viewpoint - The company is adjusting prices for certain customers based on market conditions and is focusing on higher computing power products in the smart security sector due to the increasing penetration of AI technology [1] Group 1: Price Adjustments - The company is making price adjustments for certain customers in response to comprehensive market conditions [1] Group 2: Product Development - The company is planning higher computing power products in the smart security field to align with the growing demand driven by AI technology [1] - The company's 3D DRAM products are designed to meet the market demand for large-capacity, high-speed storage across multiple AI application areas [1]
北京君正(300223.SZ):公司3D DRAM产品可满足AI应用所带来的多个领域的产品对大容量高速存储的市场需求
Ge Long Hui· 2025-10-24 07:33
Core Viewpoint - The company is adjusting prices for certain customers based on market conditions and is focusing on higher computing power products in the smart security sector due to the increasing penetration of AI technology [1] Group 1: Price Adjustments - The company is making price adjustments for certain customers in response to comprehensive market conditions [1] Group 2: Product Development - The company is planning higher computing power products in the smart security field to align with the growing demand driven by AI technology [1] - The company's 3D DRAM products are designed to meet the market demand for large-capacity, high-speed storage across various AI application areas [1]