Core Insights - The company is focusing on the growing demand for computing power and the continuous upgrade of optical communication networks, with its self-developed 3D SPI and 3D AOI products being applicable in the optical communication field [1][3] - The company’s core products are designed to enhance process stability and yield in semiconductor advanced packaging processes by inspecting solder paste, chip solder balls, and solder paste quality [3] - The upcoming development of the third optical inspection equipment in 2024 will enable inspections across various processes, including flux, system-in-package (SIP), die bonding, wire bonding, and flip chip bonding [3] - Industry experts believe that the acceleration of upgrades in the optical communication and semiconductor supply chains will allow the company's detection products to achieve broader import substitution in high-precision application scenarios, thereby enhancing its market competitiveness in the intelligent detection equipment sector [3]

Core Viewpoint - The company, Systech (301568), is advancing in the semiconductor packaging process with its self-developed core products, 3DSPI and 3DAOI, which are designed for detecting solder paste quality in semiconductor back-end packaging [1] Group 1: Product Development - The company is set to launch a new optical inspection device, the three-light machine, in 2024, which will enhance detection capabilities for various semiconductor processes including flux, system-in-package (SIP), die bonding, wire bonding, and flip chip bonding [1] - The products developed by the company aim to achieve import substitution in the semiconductor industry [1]

Core Viewpoint - The company has confirmed that its self-developed 3D SPI and 3D AOI technologies can be effectively applied in the optical communication field, particularly in the detection processes of optical module circuit boards as the demand for computing power continues to grow [2]. Group 1 - The company responded to an investor inquiry regarding the applicability of its products in optical communication detection [2]. - The optical communication network is undergoing continuous upgrades, with 800G and 1.6T optical modules expected to become standard configurations [2]. - The company's technologies are positioned to support the evolving needs of the optical communication industry [2].