Group 1: Company Overview - Guangli Technology Co., Ltd. is involved in semiconductor packaging and testing equipment and IoT safety monitoring equipment [1][2]. - The company has received widespread recognition for its domestic mechanical slicing equipment, which matches international standards in performance [2]. Group 2: Production Capacity and Orders - As of January 2026, the company has reached full production capacity for its domestic semiconductor slicing equipment, with continuous new orders being added since July 2025 [2][3]. - The second phase of the production project is expected to be fully operational by Q1 2027, with a projected capacity increase to over three times the current capacity upon completion [3]. Group 3: Customer Base and Market Demand - Approximately 50% of new orders in the semiconductor business come from major clients, primarily IDM and OSAT manufacturers [3]. - The company is dynamically adjusting its production capacity based on market demand changes [3]. Group 4: Product Development and Validation - The company is currently validating its new 12-inch high-precision cutting equipment, which is suitable for ultra-thin wafers and various advanced packaging applications [3]. - Several new products, including 12-inch laser cutting machines and grinding machines, are in the client validation phase, with positive feedback received [3]. Group 5: Future Plans - The company is evaluating the feasibility of implementing an equity incentive plan [3].

Group 1: Semiconductor Equipment Business - The company has accelerated the delivery speed of domestic semiconductor equipment since July, reaching full production status, with new orders continuously increasing; a positive supply trend is expected to continue into Q4 [2][3] - Mainstream models such as 8230CIS, 8230IR, and 8230CF have received high market recognition since their launch in 2024, leading to bulk deliveries to customers [3] - Core components like air spindles are being supplied not only to the semiconductor sector but also to various precision manufacturing fields, with a joint team established with a UK R&D group to enhance market expansion [3] Group 2: New Product Development - New products for ultra-thin wafers and compact packaging are in the validation stage, with the 12-inch laser slotting machine expected to enter client validation in Q4 2025 [3] - The 8-inch laser cutting machine is anticipated to enter client validation by the end of 2025, while the grinding machine 3230 is also in the validation phase [3] Group 3: IoT Security Monitoring Business - The IoT security monitoring business serves as a foundation for the company's development, supporting the semiconductor business and maintaining steady growth over the years [4][5] - The company plans to continue developing new products and applications in the IoT sector, aiming to expand revenue and profit scales [5] - Efforts are being made to explore overseas markets, receiving high recognition from international clients and forming strategic partnerships [5] Group 4: ADT Subsidiary Operations - The ADT subsidiary is operating normally despite regional conflicts affecting revenue recognition; both orders and sales have increased compared to the previous year, with expectations for further improvement in the second half of the year [4] - To mitigate the impact of regional conflicts, some ADT machinery is being relocated to the domestic Zhengzhou factory to better meet customer order delivery needs [4]