Core Insights - Synopsys celebrates its 30th anniversary in China and announces a strategic transformation from "chip" to "system" following the acquisition of Ansys [2] - The CEO emphasizes the need for integrated solutions across the entire technology chain to meet the demands of complex intelligent systems like robotics and autonomous vehicles [2] Key Areas of Technological Breakthrough - **System-Level Design**: Integration of simulation and chip design capabilities to provide optimization solutions across the entire lifecycle of intelligent systems, encompassing electronic, electrical, thermal, and mechanical domains [2] - **Chip Technology Upgrade**: Utilization of EDA solutions and IP products, combined with multi-physical field analysis technology, to address complex issues such as power consumption, heat dissipation, and electromagnetic compatibility in advanced processes, thereby accelerating chip development cycles [2] - **AI Agent Technology**: Introduction of AI as a core capability in modern chip design, with ongoing efforts to promote vertical applications of AI across the entire EDA stack [2] Future Engineering Vision - The company positions itself at the forefront of a "Re-engineering Engineering" revolution, advocating for a comprehensive, intelligent-driven approach from chips to systems [3]

以下文章来源于新思科技 Synopsys ，作者Synopsys 新思科技 Synopsys . 新思科技提供全球领先的芯片到系统设计解决方案，可充分提高客户的研发力和效能。生态合作伙伴相信 新思科技能够开拓创新技术，帮助他们在实现预期性能的前提下更快推出创新产品。 公众号记得加星标⭐️，第一时间看推送不会错过。 从芯片到系统 引领AI智能体工程师重构工程范式 盖思新先生在主题演讲中，重点阐述了新思科技在 2025 年的战略转型与未来发展方向。他指出， 2025 年是新思科技意义非凡的一年，通过完成对Ansys的收购，公司正式确立"从芯片到系统"工程 解决方案全球领导者地位。 2025年9月18日，新思科技中国30周年暨2025新思科技开发者大会在上海西岸国际会展中心隆 重举行。本次大会汇聚了全球行业精英、技术专家、跨界嘉宾及合作伙伴，见证新思科技在华 30年发展成果，共同讨论在智能系统新浪潮中，如何利用更多的数字工具，串联物理世界，再 造工程设计范式，持续引领从芯片到系统技术浪潮。 从初心到未来 引领科技创新 在本届开发者大会上，新思科技全球高级副总裁、新思科技中国区董事长兼总裁葛群回望了公司在中 国的发展 ...