Core Insights - Synopsys celebrates its 30th anniversary in China and announces a strategic transformation from "chip" to "system" following the acquisition of Ansys [2] - The CEO emphasizes the need for integrated solutions across the entire technology chain to meet the demands of complex intelligent systems like robotics and autonomous vehicles [2] Key Areas of Technological Breakthrough - **System-Level Design**: Integration of simulation and chip design capabilities to provide optimization solutions across the entire lifecycle of intelligent systems, encompassing electronic, electrical, thermal, and mechanical domains [2] - **Chip Technology Upgrade**: Utilization of EDA solutions and IP products, combined with multi-physical field analysis technology, to address complex issues such as power consumption, heat dissipation, and electromagnetic compatibility in advanced processes, thereby accelerating chip development cycles [2] - **AI Agent Technology**: Introduction of AI as a core capability in modern chip design, with ongoing efforts to promote vertical applications of AI across the entire EDA stack [2] Future Engineering Vision - The company positions itself at the forefront of a "Re-engineering Engineering" revolution, advocating for a comprehensive, intelligent-driven approach from chips to systems [3]

Core Insights - Synopsys is undergoing a strategic transformation from chip design to system-level solutions, highlighted by its $35 billion acquisition of Ansys, a leader in simulation and analysis software [3] - The company aims to optimize design processes across electronic, mechanical, and software domains by creating digital twins and enhancing AI capabilities to support specific workloads [3][4] - Synopsys emphasizes the importance of integrating chip design with system-level insights to create value in future technological developments, particularly as complex intelligent systems become mainstream [4] Company Strategy - The strategic shift includes three main capabilities: integrating simulation with chip design, providing lifecycle optimization for intelligent systems, and upgrading chip technology to address complex issues in advanced processes [3] - AI is positioned as a core capability in modern chip design, with ongoing development of AI agents for various engineering tasks [3] Industry Context - The CEO of Lingqiao Intelligent highlights the need for delivering entire systems rather than just hardware, emphasizing the importance of digital feedback from human knowledge and developer experience [4] - TSMC's vice president notes that digital twins and AI play a dual role in supporting AI hardware and meeting customer expectations for integration, computing power, and energy efficiency [4] Historical Perspective - Synopsys has established itself as a leader in EDA, simulation, and multi-physics analysis technologies, marking its 30th anniversary in China, where it has contributed significantly to the development of the semiconductor industry [5] - The company has a history of collaboration with Chinese academic institutions, including a donation of over $1 million in software to Tsinghua University [5]

Group 1 - The company hosted a research meeting on May 21, 2025, with 20 institutions including Bosera Fund and Changxin Fund [1] - The company’s top five customers' share has decreased from 44.12% in 2022 to 32.98% in 2024, indicating a trend towards a more balanced and diversified customer structure [2] - The company was recognized as one of the first "chain leader" enterprises in the Lingang New Area, highlighting its role in driving industry chain development [3] Group 2 - The company plans to complete its headquarters R&D building by Q4 2025, which will accommodate 2,000 employees [3] - The company aims to enhance its technological innovation capabilities by focusing on DTCO and collaborating with industry partners to develop application-driven EDA solutions [3] - On April 29, 2025, the company’s board approved a proposal to seek shareholder authorization for a simplified procedure to issue up to 300 million RMB in stock, not exceeding 20% of the latest net assets [4][5]

21世纪经济报道记者 杨坪 深圳报道 据了解，本次交易有助于华大九天构建从芯片到系统级的EDA解决方案，实现EDA全流程工具系统、 EDA产业自主可控，为我国集成电路产业持续健康安全发展提供支撑和保障。 再如隆扬电子（301389）拟收购德佑新材100%股权，标的主营消费电子领域功能性涂层复合材料业 务，是国内功能性涂层复合材料领域的知名企业，通过本次交易，隆扬电子进一步扩充公司产品品类。 值得一提的是，也有部分企业基于转型升级等目标开展跨行业并购，多聚集于半导体、高端装备等新质 生产力领域，共计16单。如阳谷华泰（300121.SZ）拟收购波米科技100%股权，标的主营聚酰亚胺 （PI）材料，用于半导体先进封装与液晶显示面板，可实现半导体封装关键材料进口替代；友阿股份 （002277）现主业为百货零售业务，拟收购尚阳通100%股权，切入功率半导体领域，打造第二增长曲 线，加快向新质生产力转型；金利华电（300069）现主业为玻璃绝缘子业务，拟收购海德利100%股 权，标的主营高压流体设备产品，主要用于航天军工及氢能领域，通过本次交易上市公司将新增高压流 体装备业务板块，实现业务范围的扩展和产业升级。 与此同 ...